PC457L0NIP0F

PC457L0NIP0F Series
PC457L0NIP0F
Series
High Speed 1Mb/s, High CMR
Mini-flat Package
∗OPIC Photocoupler
■ Description
■ Agency approvals/Compliance
PC457L0NIP0F Series contains a LED optically coupled to an OPIC chip.
It is packaged in a 5 pin Mini-flat.
Input-output isolation voltage(rms) is 3.75 kV.
High speed response (TYP. 1Mb/s) and CMR is
MIN. 15 kV/µs.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC457L)
2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40009162 (as model No. PC457L)
3. Package resin : UL flammability grade (94V-0)
(∗)
■ Features
DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Applications
1. Mini-flat 5 pin package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High speed response
(tPHL : TYP. 0.2 µs, tPLH : TYP. 0.4 µs)
4. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. 15kV/µs,
CML : MIN. −15kV/µs)
5. High isolation voltage between input and output
(Viso(rms) : 3.75 kV)
6. RoHS directive compliant
1. Programmable controller
2. Inverter
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A05102FEN
Date Jun. 30. 2005
© SHARP Corporation
PC457L0NIP0F Series
■ Internal Connection Diagram
6
5
4
1
3
4
5
1
6
3
Anode
Cathode
GND
VO (Open collector)
VCC
■ Outline Dimensions
(Unit : mm)
1. Mini-flat Package [ex. PC457L0NIP0F]
2. Mini-flat Package (VDE option) [ex. PC457L0YIP0F]
3.6±0.3
3.6±0.3
1.27±0.25
6
4
1.27±0.25
6
SHARP
mark
"S"
P C4 57L
4.4±0.2
SHARP
mark
"S"
5
1.27±0.25
Anode
mark
5
4
P C4 5 7 L
Anode
mark
4.4±0.2
1.27±0.25
4
VDE Identification mark
Date code
1
3
Date code
1
0.4±0.1
Factory identification mark
0.4±0.1
Factory identification mark
5.3±0.3
Epoxy resin
3
5.3±0.3
Epoxy resin
45˚
6˚
0.5+0.4
−0.2
7.0+0.2
−0.7
Product mass : approx. 0.1g
0.2±0.05
0.1±0.1 2.6±0.2
0.2±0.05
0.1±0.1 2.6±0.2
45˚
0.5+0.4
−0.2
6˚
7.0+0.2
−0.7
Product mass : approx. 0.1g
Plating material : SnCu (Cu : TYP. 2%)
Sheet No.: D2-A05102FEN
2
PC457L0NIP0F Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production.
Rank mark
There is no rank mark indicator.
Sheet No.: D2-A05102FEN
3
PC457L0NIP0F Series
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol
Rating
Unit
*1 Forward current
IF
25
mA
Input
V
Reverse voltage
5
V
R
*2
Power dissipation
mW
P
45
VCC
−0.5 to +30
Supply voltage
V
VO
−0.5 to +20
Output voltage
V
Output
IO
Output current
8
mA
*3
PO
Power dissipation
100
mW
*3
Ptot
100
mW
Total power dissipation
Topr
−55 to +85
˚C
Operating temperature
Tstg
−55 to +125
˚C
Storage temperature
*4 Isolation voltage
Viso (rms)
kV
3.75
*5 Soldering temperature
Tsol
260
˚C
*1 When ambient temperature goes above 70˚C, the power dissipation goes down at
0.8mA/˚C. (Fig.3)
*2 When ambient temperature goes above 70˚C, the power dissipation goes down at
1.5mW/˚C. (Fig.4)
*3 When ambient temperature goes above 70˚C, the power dissipation goes down at
1.8mW/˚C. (Fig.4)
*4 40 to 60%RH, AC for 1minute, f=60Hz
*5 For 10s
■ Electro-optical Characteristics*7
Response
time
Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Input
Terminal capacitance
Ct
High level output current (1)
IOH (1)
High level output current (2)
IOH (2)
*6
High level output current (3)
IOH (3)
Output
High level supply current (1)
ICCH (1)
*6
High level supply current (2)
ICCH (2)
Low level supply current
ICCL
Low level output voltage
VOL
Current transfer ratio (1)
CTR (1)
*6
Current transfer ratio (2)
CTR (2)
RISO
Isolation resistance
Cf
Floating capacitance
Transfer
"High→Low" propagation delay time
tPHL
charac"Low→High" propagation delay time
tPLH
teristics
Instantaneous common mode
rejection voltage
CMH
(High level output)
Instantaneous common mode
rejection voltage
(Low level output)
CML
(Ta=25˚C)
Unit
V
µA
pF
nA
µA
µA
µA
µA
µA
V
%
%
Ω
pF
DC500V, 40 to 60%RH
V=0, f=1MHz
MIN.
−
−
−
−
−
−
−
−
−
−
19
15
5×1010
−
TYP.
1.7
−
60
3
−
−
0.02
−
120
−
−
−
1011
0.6
MAX.
1.95
10
250
500
1.0
50
1.0
2.0
−
0.4
50
−
−
1.0
IF=16mA, VCC=5V
RL=1.9Ω
−
−
0.2
0.4
0.8
0.8
µs
IF=0, VCC=5V,
VCM=1.0kV(p-p), RL=1.9kΩ
15
30
−
kV/µs
IF=16mA, VCC=5V,
VCM=1.0kV(p-p), RL=1.9kΩ
−15
−30
−
kV/µs
Conditions
IF=16mA
VR=5V
V=0, f=1MHz
IF=0, VCC=5.5V, VO=5.5V
IF=0, VCC=15V, VO=15V
IF=0, VCC=15V, VO=OPEN
IF=16mA, VCC=15V, VO=OPEN
IF=16mA, VCC=4.5V, IO=2.4mA
IF=16mA, VCC=4.5V,
VO=0.4V, RL=1.9kΩ
µs
*6 Ta=0 to 70˚C
*7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 6 ) and GND (pin 4 ) near the device, when it measures transfer characteristics and the output side
characteristics.
Sheet No.: D2-A05102FEN
4
PC457L0NIP0F Series
■ Model Line-up
Taping
3 000pcs/reel
DIN EN60747-5-2
−−−−−−
Approved
Model No.
PC457L0NIP0F PC457L0YIP0F
Package
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A05102FEN
5
PC457L0NIP0F Series
Fig.1 Test Circuit for Propagation Delay Time
IF
IF
0.01µF
VCC
Pulse input
Pulse width
10µs
Duty ratio
1/10
RL
0V
VO
tPHL
CL
IF
Monitor
tPLH
VO
5V
1.5V
*CL includes the probe
and wiring capacitance.
100Ω
VOL
Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage
IF
0.01µF
SW
B
VCM
VCC
A
1.0kV
RL
0V
VO
CMH
VO
2V
(IF=0)
CL
+
−
CML
0.8V
VO
GND
VOL
When SW is B
(IF=16mA)
VCM
5V
When SW is A
*CL includes the probe and wiring capacitance.
Fig.3 Forward Current vs. Ambient
Temperature
Fig.4 Power Dissipation vs. Ambient
Temperature
Power dissipation P, PO (mW)
Forward current IF (mA)
20
15
10
80
60
P
45
40
20
5
70
0
−55
PO
100
25
0
25
85
50
75
100
70
0
−55
125
Ambient temperature Ta (˚C)
0
25
50
85
75
100
125
Ambient temperature Ta (˚C)
Sheet No.: D2-A05102FEN
6
PC457L0NIP0F Series
Fig.5 Forward Current vs. Forward Voltage
Fig.6 Relative Current Transfer Ratio vs.
Forward Current
200
Relative current transfer ratio (%)
Forward current IF (mA)
100
10
Ta=25˚C
Ta=0˚C
Ta=50˚C
Ta=−25˚C
1
Ta=70˚C
VCC=4.5V
VO=0.4V
Ta=25˚C
150
100
50
Ta=−55˚C
CTR=100% at IF=16mA
0.1
1
1.2
1.4
1.6
1.8
0
0.1
2
1
Forward voltage VF (V)
Fig.7 Output Current vs. Output Voltage
150
Ta=25˚C
16
VCC=5V
Dotted line shows
pulse characteristics
Relative current transfer ratio (%)
Output current IO (mA)
IF=16mA
VCC=4.5V
VO=0.4V
140
14
12
IF=25mA
10
IF=20mA
8
IF=15mA
6
IF=10mA
4
IF=5mA
130
120
110
100
90
80
70
2
60
0
50
−55 −40
0
2
4
6
8
10
12
14
16
18
20
CTR=100% at Ta=25˚C
Output voltage VO (V)
0
20
40
60
80
100
Fig.10 Propagation Delay Time vs.
Ambient Temperature
1 000
800
Propagation delay time tPHL, tPLH (ns)
IF=0
100
VCC=VO=5.5V
10
VCC=VO=15V
0.1
−25
−20
Ambient temperature Ta (˚C)
Fig.9 High Level Output Current vs.
Ambient Temperature
1
100
Fig.8 Relative Current Transfer Ratio vs.
Ambient Temperature
18
High level output current IOH (nA)
10
Forward current IF (mA)
VCC=VO=30V
0
25
50
75
IF=16mA
VCC=5V
RL=1.9kΩ
600
tPLH
400
200
0
−55 −40
100
tPHL
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D2-A05102FEN
7
PC457L0NIP0F Series
■ Design Considerations
● Recommended operating conditions
Parameter
Input current
Supply voltage
Fan out (TTL load)
Operating temperature
Symbol
IF
VCC
N
Topr
MIN.
7
−
−
0
MAX.
16
−
5
+70
TYP.
−
5
−
−
Unit
mA
V
−
˚C
● Notes about static electricity
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
● Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between VCC and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
● Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
● Recommended Foot Print (reference)
1.5
0.8
1.27
1.27
6.3
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05102FEN
8
PC457L0NIP0F Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A05102FEN
9
PC457L0NIP0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: D2-A05102FEN
10
PC457L0NIP0F Series
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
E
G
D
J
MAX
.
H
H
A
B
C
I
5˚
K
Dimensions List
A
B
12.0±0.3
5.5±0.1
H
I
7.4±0.1
0.3±0.05
C
1.75±0.1
J
3.1±0.1
D
8.0±0.1
K
4.0±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
370
13.5±1.5
e
f
±1.0
21
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1.0
80
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 3 000pcs/reel]
Sheet No.: D2-A05102FEN
11
PC457L0NIP0F Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
[E239]
Sheet No.: D2-A05102FEN
12