TrilithIC BTS 781 GP Data Sheet 1 Overview 1.1 Features • • • • • • • • • • • • • • • Quad D-MOS switch Free configurable as bridge or quad-switch Optimized for DC motor management applications Low RDS ON: 26 mΩ high-side switch, 14 mΩ low-side switch (typical values @ 25 °C) Maximum peak current: typ. 42 A @ 25 °C= Very low quiescent current: typ. 4 µA @ 25 °C= Small outline, thermal optimized PowerPak Load and GND-short-circuit-protection Operates up to 40 V Status flag for over temperature Open load detection in Off-mode Overtemperature shut down with hysteresis Internal clamp diodes Isolated sources for external current sensing Under-voltage detection with hysteresis P-TO263-15-1 Type Ordering Code Package BTS 781 GP Q67006-A9526 P-TO263-15-1 1.2 Description The BTS 781 GP is part of the TrilithIC family containing three dies in one package: One double high-side switch and two low-side switches. The drains of these three vertical DMOS chips are mounted on separated leadframes. The sources are connected to individual pins, so the BTS 781 GP can be used in H-bridge- as well as in any other configuration. The double high-side is manufactured in SMART SIPMOS® technology which combines low RDS ON vertical DMOS power stages with CMOS control circuit. The high-side switch is fully protected and contains the control and diagnosis circuit. To achieve low RDS ON and fast switching performance, the low-side switches are manufactured in S-FET 2 logic level technology. The equivalent standard product is the SPD30N06S2L-13. Data Sheet 1 2002-06-28 BTS 781 GP 1.3 Pin Configuration (top view) Molding Compound NC 1 Heat-Slug 1 SL1 2 IL1 3 NC 4 IH1 5 18 DL1 Heat-Slug 2 ST1 6 SH1 7 DHVS 8 GND 9 IH2 10 ST2 11 SH2 12 17 DHVS Heat-Slug 3 SL2 13 16 NC 14 IL2 15 DL2 Figure 1 Data Sheet 2 2002-06-28 BTS 781 GP 1.4 Pin Definitions and Functions Pin No. Symbol Function 1 NC Not connected 2 SL1 Source of low-side switch 1 3 IL1 Analog input of low-side switch 1 4 NC Not connected 5 IH1 Digital input of high-side switch 1 6 ST1 Status of high-side switch 1; open Drain output 7 SH1 Source of high-side switch 1 8 DHVS Drain of high-side switches and power supply voltage 9 GND Ground of high-side switches 10 IH2 Digital input of high-side switch 2 11 ST2 Status of high-side switch 2; open Drain output 12 SH2 Source of high-side switch 2 13 SL2 Source of low-side switch 2 14 NC Not connected 15 IL2 Analog input of low-side switch 2 16 DL2 Drain of low-side switch 2 Heat-Slug 3 17 DHVS Drain of high-side switches and power supply voltage Heat-Slug 2 18 DL1 Drain of low-side switch 1 Heat-Slug 1 Pins written in bold type need power wiring. Data Sheet 3 2002-06-28 BTS 781 GP 1.5 Functional Block Diagram DHVS 6 8, 17 ST1 ST2 IH1 IH2 11 5 10 Diagnosis Biasing and Protection Driver IN OUT 0 0 L L 0 1 L H 1 0 H L 1 1 H H RO1 RO2 12 16 SH2 DL2 9 GND 7 18 SH1 DL1 3 IL1 15 IL2 2 SL1 13 SL2 Figure 2 Block Diagram Data Sheet 4 2002-06-28 BTS 781 GP 1.6 Circuit Description Input Circuit The control inputs IH1,2 consist of TTL/CMOS compatible Schmitt-Triggers with hysteresis. Buffer amplifiers are driven by these stages and convert the logic signal into the necessary form for driving the power output stages. The inputs are protected by ESD clamp-diodes. The inputs IL1 and IL2 are connected to the gates of the standard N-channel vertical power-MOS-FETs. Output Stages The output stages consist of a low RDS ON Power-MOS H-bridge. In H-bridge configuration, the D-MOS body diodes can be used for freewheeling when commutating inductive loads. If the high-side switches are used as single switches, positive and negative voltage spikes which occur when driving inductive loads are limited by integrated power clamp diodes. Short Circuit Protection The outputs are protected against – output short circuit to ground – overload (load short circuit). An internal OP-amp controls the Drain-Source-voltage by comparing the DS-voltagedrop with an internal reference voltage. Above this trippoint the OP-Amp reduces the output current depending on the junction temperature and the drop voltage. In the case of overloaded high-side switches the status output is set to low. Overtemperature Protection The high-side switches incorporate an overtemperature protection circuit with hysteresis which switches off the output transistors and sets the status output to low. Undervoltage-Lockout (UVLO) When VS reaches the switch-on voltage VUVON the IC becomes active with a hysteresis. The high-side output transistors are switched off if the supply voltage VS drops below the switch off value VUVOFF. Open Load Detection Open load is detected by voltage measurement in off state. If the output voltage exceeds a specified level the error flag is set with a delay. Data Sheet 5 2002-06-28 BTS 781 GP Status Flag The two status flag outputs are an open drain output with Zener-diode which require a pull-up resistor, c.f. the application circuit on page 15. ST1 and ST2 provide separate diagnosis for each high-side switch. Various errors as listed in the table “Diagnosis” are detected by switching the open drain output ST1/2 to low. Forward current in the integrated body diode of the highside switch may cause undefined voltage levels at the corresponding status output. The open load detection can be used to detect a short to Vs as long as both lowside switches are off and ROL is disconnected from 5V by BCR192W. 2 Truthtable and Diagnosis (valid only for the High-Side-Switches) Flag IH1 IH2 SH1 Inputs SH2 ST1 ST2 Remarks Outputs 0 0 1 1 0 1 0 1 L L H H L H L H 1 1 1 1 1 1 1 1 stand-by mode switch2 active switch1 active both switches active 0 1 X X X X 0 1 Z H X X X X Z H 0 1 1 1 1 1 0 1 detected Overtemperature high-side switch1 0 1 X X L L X X 1 0 1 1 detected Overtemperature high-side switch2 X X 0 1 X X L L 1 1 1 0 detected Overtemperature both high-side switches 0 X 1 0 1 X L L L L L L 1 1 0 1 0 1 detected detected Undervoltage X X L L 1 1 not detected Normal operation; identical with functional truth table Open load at high-side switch 1 Open load at high-side switch 2 detected Note: * multiple simultaneous errors are not shown in this table Inputs: Outputs: Status: 0 = Logic LOW Z = Output in tristate condition 1 = No error 1 = Logic HIGH L = Output in sink condition 0 = Error X = don’t care H = Output in source condition X = Voltage level undefined Data Sheet 6 2002-06-28 BTS 781 GP 3 Electrical Characteristics 3.1 Absolute Maximum Ratings – 40 °C < Tj < 150 °C Parameter Symbol Limit Values min. Unit Remarks max. High-Side-Switches (Pins DHVS, IH1,2 and SH1,2) Supply voltage Supply voltage for full short circuit protection HS-drain current HS-input current HS-input voltage VS VS(SCP) – 0.3 IS IIH VIH 42 V – 28 V – – 10 * A TC = 125°C; DC –5 5 mA Pin IH1 and IH2 – 10 16 V Pin IH1 and IH2 – 0.3 5.4 V – –5 5 mA Pin ST1 or ST2 Note: * internally limited Status Output ST (Pins ST1 and ST2) Status pull up voltage Status Output current VST IST Low-Side-Switches (Pins DL1,2, IL1,2 and SL1,2) Drain- source break down voltage VDSL 55 – V VIL = 0 V; ID ≤ 1 mA LS-drain current IDL IDL –20 20 A – 25 A – 100 A TC = 125°C; DC tp < 100 ms; ν < 0.1 tp < 1 ms; ν < 0.1 VIL – 20 20 V Pin IL1 and IL2 Tj Tstg – 40 150 °C – – 55 150 °C – LS-drain current TC = 85°C LS-input voltage Temperatures Junction temperature Storage temperature Data Sheet 7 2002-06-28 BTS 781 GP 3.1 Absolute Maximum Ratings (cont’d) – 40 °C < Tj < 150 °C Parameter Symbol Limit Values min. Unit Remarks max. Thermal Resistances (one HS-LS-Path active) LS-junction case HS-junction case Junction ambient Rthja = Tj(HS)/(P(HS)+P(LS)) RthjC L RthjC H Rthja – 0.6 K/W – 0.75 K/W – 35 K/W device soldered to reference PCB with 6 cm2 cooling area ESD Protection (Human Body Model acc. MIL STD 883D, method 3015.7 and EOS/ ESD assn. standard S5.1 - 1993) Input LS-Switch Input HS-Switch Status HS-Switch Output LS and HS-Switch VESD VESD VESD VESD 0.5 kV 1 kV 2 kV 4 kV all other pins connected to Ground Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. 3.2 Operating Range – 40 °C < Tj < 150 °C Parameter Symbol Limit Values min. Unit Remarks max. Supply voltage VS VUVOFF 42 V After VS rising above VUVON Input voltages HS VIH VIL IST TjHS – 0.3 15 V – – 0.3 20 V – 0 2 mA – – 40 150 °C – Input voltages LS Status output current Junction temperature Note: In the operating range the functions given in the circuit description are fulfilled. Data Sheet 8 2002-06-28 BTS 781 GP 3.3 Electrical Characteristics ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V unless otherwise specified Parameter Symb ol Limit Values Unit Test Condition min. typ. max. – 4 9 µA IH1 = IH2 = 0 V Tj = 85 °C – – 20 µA IH1 = IH2 = 0 V – 2.5 4.5 mA IH1 or IH2 = 5 V – 5 9 mA IH1 and IH2 = 5 V – – 7 µA 2.2 10 mA VIH = VSH = 0 V Tj = 85 °C IFH =5 A Current Consumption HS-switch Quiescent current Supply current IS Q IS Leakage current of highside switch ISH LK Leakage current through logic GND in free wheeling condition ILKCL = – IFH + ISH Current Consumption LS-switch Input current IIL – 10 100 nA Leakage current of lowside switch IDL LK – – 12 µA VIL = 20 V VDSL = 0 V VIL = 0 V VDSL = 40 V Tj = 85 °C Under Voltage Lockout (UVLO) HS-switch Switch-ON voltage Switch-OFF voltage Switch ON/OFF hysteresis Data Sheet VUVON VUVOFF VUVHY – – 5 V 1.8 – 4.5 V – 1 – V 9 VS increasing VS decreasing VUVON – VUVOFF 2002-06-28 BTS 781 GP 3.3 Electrical Characteristics (cont’d) ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V unless otherwise specified Parameter Symb ol Limit Values Unit Test Condition min. typ. max. Inverse diode of highside switch; Forwardvoltage VFH – 0.8 1.2 V IFH = 5 A Inverse diode of lowside switch; Forward-voltage VFL – 0.8 1.2 V IFL = 5 A RDS ON H – Static drain-source on-resistance of highside switch 26 35 mΩ ISH = 5 A Tj = 25 °C RDS ON L – 14 17 mΩ ISL = 5 A; VIL = 5 V Tj = 25 °C – 100 mΩ RDS ON H + RDS ON L ISH = 5 A; 35 48 65 A 30 42 54 A 25 32 42 A Tj = – 40 °C Tj = + 25 °C Tj = + 150 °C kΩ VDSL = 3 V Output stages Static drain-source on-resistance of lowside switch Static path on-resistance RDS ON – Short Circuit of highside switch to GND Initial peak SC current Initial peak SC current Initial peak SC current ISCP H ISCP H ISCP H Note: Peak SC current is significantly lower at VS > 18V Short Circuit of highside switch to VS Output pull-down-resistor RO Data Sheet 7 14 10 42 2002-06-28 BTS 781 GP 3.3 Electrical Characteristics (cont’d) ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V unless otherwise specified Parameter Symb ol Limit Values Unit Test Condition min. typ. max. Thermal shutdown junction temperature Tj SD 155 180 190 °C – Thermal switch-on junction temperature Tj SO 150 170 180 °C – Temperature hysteresis ∆T – 10 – °C ∆T = TjSD – TjSO IST = 1.6 mA VST = 5 V IST = 1.6 mA Thermal Shutdown Status Flag Output ST of highside switch Low output voltage Leakage current Zener-limit-voltage VST L IST LK VST Z td(SToffo+) – 0.2 0.6 V – – 5 µA – V 5.4 – – 20 µs Status change after td(SToffo-) – negative input slope with open load – 700 µs 1.6 10 µs RST = 47 kΩ 14 100 µs RST = 47 kΩ 3 4 V Status change after positive input slope with open load Status change after positive input slope with overtemperature td(STofft+) – Status change after td(STofft-) negative input slope with overtemperature – Note: times are guaranteed by design Open load detection in Off condition Open load detection voltage Data Sheet VOUT(OL) 2 11 2002-06-28 BTS 781 GP 3.3 Electrical Characteristics (cont’d) ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V unless otherwise specified Parameter Symb ol Limit Values min. typ. max. Unit Test Condition Switching times of highside switch Turn-ON-time; to 90% VSH tON – 100 220 µs RLoad = 12 Ω VS = 12 V Turn-OFF-time; to 10% VSH tOFF – 120 250 µs RLoad = 12 Ω VS = 12 V – 0.5 1.1 V/µs RLoad = 12 Ω VS = 12 V – 0.7 1.3 V/µs RLoad = 12 Ω VS = 12 V dV/ dtON VSH Slew rate off 70 to 40% -dV/ dtOFF VSH Slew rate on 10 to 30% Note: switching times are guaranteed by design Switching times of low-side switch Turn-ON delay time; VIL = 5V; RGate= 16Ω td_ON_L – 40 ns resistive load ISL = 10 A; VS = 12 V Switch-ON time; VIL= 5V; RGate = 16Ω tON_L – 170 ns resistive load ISL = 10 A; VS = 12 V Switch-OFF delay time; VIL= 5V; RGate = 16Ω td_OFF_L – 100 ns resistive load ISL = 10 A; VS = 12 V Switch-OFF time; VIL= 5V; RGate = 16Ω tOFF_L – 200 ns resistive load ISL = 10 A; VS = 12 V Input to source charge; – 4.5 6 nC – 16 24 nC Input charge total; QIS QID QI – 55 69 nC Input plateau voltage; V(plateau) – 2.6 – V ISL = 10 A; VS = 40 V ISL = 10 A; VS = 40 V ISL = 10 A; VS = 40 V VIL = 0 to 10 V ISL = 10 A; VS = 40 V Input to drain charge; Note: switching times and input charges are guaranteed by design Data Sheet 12 2002-06-28 BTS 781 GP 3.3 Electrical Characteristics (cont’d) ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 150 °C; 8 V < VS < 18 V unless otherwise specified Parameter Symb ol Limit Values min. typ. Unit Test Condition max. Control Inputs of highside switches IH 1, 2 H-input voltage L-input voltage Input voltage hysterese H-input current L-input current Input series resistance Zener limit voltage VIH High VIH Low VIH HY IIH High IIH Low RI VIH Z – – 2.5 V – 1 – – V – – 0.5 – V – 5 30 60 µA 5 14 25 µA VIH = 5 V VIH = 0.4 V 2.7 4 6 kΩ – 5.4 – – V IIH = 1.6 mA VIL th – 1.9 2.6 V – 1.7 – 0.8 1.1 – Tj = – 40 °C Tj = + 25 °C Tj = + 150 °C Control Inputs IL1, 2 Gate-threshold-voltage IDL = 1 mA Note: The listed characteristics are ensured over the operating range of the integrated circuit. Typical characteristics specify mean values expected over the production spread. If not otherwise specified, typical characteristics apply at TA = 25 °C and VS = 12 V. Data Sheet 13 2002-06-28 BTS 781 GP IS VS CL 100µF CS 470nF IFH1,2 IST LK1 IST1 DHVS ST1 6 8, 17 VDSH2 VDSH1 -VFH2 -VFH1 IST LK2 IST2 ST2 11 IH1 5 IH2 10 Diagnosis Biasing and Protection VST1 VSTL1 VSTZ1 IIH1 VST2 VSTL2 VSTZ2 IIH1 VIH1 VIH2 Gate Driver RO1 GND RO2 Gate Driver 12 16 SH2 ISH2 DL2 IDL2 IDL LK 2 VUVON SH1 ISH1 VUVOFF DL1 IDL1 6 IGND 7 ILKCL 18 IDL LK 1 VIL1 IIL1 IL1 3 IIL2 IL2 15 VIL th 1 VIL2 VIL th 2 2 13 VDSL1 VDSL2 SL1 SL2 -VFL1 -VFL2 ISCP L 1 ISCP L 2 ISL1 ISL2 Figure 3 Test Circuit HS-Source-Current Named during Short Circuit Named during LeakageCond. ISH1,2 ISCP H IDL LK Data Sheet 14 2002-06-28 BTS 781 GP Watchdog Reset Q RQ 100 kΩ Ω RQ 100 kΩ Ω WD R CQ 22µF VCC TLE 4278G I D CS 10µF D01 Z39 CD 47nF DHVS ST1 RS VS=12V 6 BCR192W 8, 17 10 kΩ Ω to µC ST2 11 RS Diagnosis Biasing and Protection 10 kΩ Ω Can be replaced by diode when Short to Vs detection is not needed ROL 560Ohm IH1 5 IH2 10 optional for open load in off Gate Driver RO1 GND Gate Driver RO2 12 SH2 DL2 16 9 µP 7 18 IL1 3 IL2 15 GND 2 13 SL1 SL2 SH1 M DL1 Figure 4 Application Circuit Data Sheet 15 2002-06-28 BTS 781 GP 4 Package Outlines P-TO263-15-1 (Plastic Transistor Single 21.6 ±0.2 8.3 X2, 1) 4.4 5.56 ±0.15 1.27 ±0.1 1±0.2 8.18 ±0.15 B 0.1 1±0.3 2.4 1) 4.7 ±0.5 7.65 14 x 1.4 0.05 2.7 ±0.3 A 9.25 ±0.2 (15) 4.8 X1, 1) 0...0.15 0.5 ±0.1 0.8 ±0.1 0.25 1) M 8˚ MAX. A B 0.1 B Typical Metal surface min. X1 = 3.57, X2 = 7.03, Y = 6.9 All metal surfaces tin plated, except area of cut. Footprint Footprint 21.6 8.4 4 16 9.5 0.8 0.4 1 Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”. SMD = Surface Mounted Device Data Sheet 16 Dimensions in mm 2002-06-28 BTS 781 GP Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Data Sheet 17 2002-06-28