NL17SZ04 Single Inverter The NL17SZ04 is an inverter in three tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. Features • • • • • • • Tiny SOT−353, SOT−553 and SOT−953 Packages 24 mA Sink and Source Output Capability Over−Voltage Tolerant Inputs and Outputs Pin For Pin with NC7SZ04P5X, TC7SZ04FU and TC7SZ04AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant VCC NC 5 1 VCC IN A 1 5 L5 M G = Specific Device Marking = Date Code* = Pb−Free Package 5 5 1 SOT−953 L5 M Figure 1. Pinout (Top View) 1 L5 M SOT−553 XV5 SUFFIX CASE 463B SOT−353/SC70−5/ SC−88A/SOT−553 IN A L5 MG G 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 4 3 4 3 OUT Y NC OUT Y GND 5 *Date Code orientation and/or position may vary depending upon manufacturing location. 2 2 MARKING DIAGRAMS (Note: Microdot may be in either location) GND IN A www.onsemi.com OUT Y = Specific Device Marking = Date Code SOT−953 CASE 527AE Figure 2. Logic Symbol V M 1 VM 1 = Specific Device Code = Month Code ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2015 November, 2015 − Rev. 14 1 Publication Order Number: NL17SZ04/D NL17SZ04 PIN ASSIGNMENT PIN ASSIGNMENT (SOT−953) (SOT−353/SC70−5/SC−88A/SOT−553) FUNCTION TABLE Pin Function Input Output Pin Function 1 IN A A Y 1 NC 2 GND L H 2 IN A 3 NC H L 3 GND 4 OUT Y 4 OUT Y 5 VCC 5 VCC MAXIMUM RATINGS Symbol VCC Parameter DC Supply Voltage Value Unit −0.5 to )7.0 V VI DC Input Voltage −0.5 v VI v +7.0 V VO DC Output Voltage Output in Higher or Low State (Note 1) (SOT−353/SC70−5/SC−88A/SOT−553 Packages) −0.5 to VCC + 0.5 V VO DC Output Voltage (SOT−953 Package) −0.5 to VCC + 0.5 −0.5 to + 0.5 V IIK DC Input Diode Current VI < GND −50 mA IOK DC Output Diode Current (SOT−353/SC70−5/SC−88A/SOT−553 Packages) VO < GND, VO > VCC ±50 mA IOK DC Output Diode Current (SOT−953 Package) VO < GND −50 mA IO DC Output Sink Current ±50 mA Output in Higher or Low State (Note 1) Power−Down Mode (VCC = 0 V) ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground Current per Supply Pin ±100 mA TSTG Storage Temperature Range −65 to )150 °C 260 °C )150 °C SOT−353 (Note 2) SOT−553 350 496 °C/W SOT−353 SOT−553 186 135 mW TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating ESD ESD Classification ILATCHUP Level 1 Oxygen Index: 28 to 34 Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) Latchup Performance Above VCC and Below GND at 125°C (Note 6) UL 94 V−0 @ 0.125 in 2000 200 N/A V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 4. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. www.onsemi.com 2 NL17SZ04 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage Operating Data Retention VOUT DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages) (High or Low State) VOUT DC Output Voltage (SOT−953 Package) (High or Low State) TA Operating Temperature Range tr, tf Input Rise and Fall Time VCC = 2.5 V $ 0.2 V VCC = 3.0 V $ 0.3 V VCC = 5.0 V $ 0.5 V Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V 0 VCC V −55 +125 °C 0 0 0 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL VOL IIN Low−Level Output Voltage VIN = VIH IOH = −100 mA −555C ≤ TA ≤ 1255C TA = 255C VCC (V) Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC V 0.25 VCC 0.3 VCC VCC − 0.1 VCC VCC − 0.1 IOH = −3 mA 1.65 1.29 1.52 1.29 IOH = −8 mA 2.3 1.9 2.1 1.9 IOH = −12 mA 2.7 2.2 2.4 2.2 IOH = −16 mA 3.0 2.4 2.7 2.4 IOH = −24 mA 3.0 2.3 2.5 2.3 IOH = −32 mA 4.5 3.8 4.0 3.8 IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 IOH = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 $0.1 VIN = 5.5 V or GND 0 to 5.5 IOFF Power Off Leakage Current (SOT−353/ SC70−5/SC−88A/ SOT−553 Packages) VIN = 5.5 V or VOUT = 5.5 V 0 ICC Quiescent Supply Current VIN = 5.5 V or GND 5.5 V V 1.65 to 5.5 Input Leakage Current Unit V $1.0 mA 1 10 mA 1 10 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NL17SZ04 AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W −555C ≤ TA ≤ 1255C TA = 255C Symbol tPLH tPHL7 Condition VCC (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.65 1.8 2.0 2.0 5.3 4.4 11.4 9.5 2.0 2.0 12.0 10.0 ns RL = 1 MW, CL = 15 pF 2.5 $ 0.2 0.2 3.5 6.5 0.8 7.0 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 2.1 4.5 0.5 4.7 1.2 2.9 5.5 1.5 5.2 0.5 1.8 3.9 0.5 4.1 0.8 2.4 4.3 0.8 4.5 Parameter Propagation Delay (Figure 3 and 4) RL = 500 W, CL = 50 pF 5.0 $ 0.5 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical Unit u2.5 pF 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% OUTPUT 50% 10% 10% tPHL GND CL tPLH VOH OUTPUT Y RL INPUT 50% A 1−MHz square input wave is recommended for propagation delay tests. 50% VOL Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Package Shipping† NL17SZ04DFT2G SC−88A/SOT−353/SC−70−5 (Pb−Free) 3000 / Tape & Reel NL17SZ04XV5T2G SOT−553 (Pb−Free) 4000 / Tape & Reel NL17SZ04P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 4 NL17SZ04 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ04 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE c 5 PL 0.08 (0.003) DIM A b c D E e L HE M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 NL17SZ04 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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