RH37C - SPEC NO. 05-08-5030

SPEC NO. 05-08-5030 REV. P
REV
0
A
B
C
D
E
RH37C, PRECISION OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
DATE
06/12/96
12/01/97
INITIAL RELEASE
• PAGE 2: ADDED PARAGRAPHS 3.2.1 AND 3.2.2. PARAGRAPH 3.3.b HAD “(SEE PARAGRAPH
3.2)”.
• PAGE 3: ADDED PARAGRAPHS 3.8.1 AND 3.8.2.
• PAGE 4: PARAGRAPH 4.4.2, GROUP B INSPECTION WAS REDEFINED.
• PAGE 5: PARAGRAPH 4.4.3, GROUP D INSPECTION WAS REDEFINED. PARAGRAPH 4.5,
SOURCE INSPECTION, REDEFINED.
• PAGE 4, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
• PAGE 6, TO5 CASE OUTLINE, CHANGED θjc FROM 60°C/W TO 40°C/W, θja DOES NOT
CHANGE.
• PAGE 7, CERAMIC DIP CASE OUTLINE, CHANGED θja FROM 120°C/W TO 110°C/W, θjc
CHANGED FROM 50°C/W TO 30°C/W.
• PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, HAD FIGURES 1, 2, REMOVED.
• PAGE 4, PARAGRAPH 3.7, CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND
AS SPECIFIED IN TABLE III HEREIN”, LINE 2. PARAGRAPH 3.9, ADDED “HEREIN” AFTER
TABLE II”, LINE 2.
• PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.1,
ADDED “HEREIN” AFTER “TABLE III”, LINE 2. 4.4.2.2, CHANGED VERBIAGE IN LINE 1
FROM “ALL FOOTNOTES OF TABLE IIA OF MIL-STD-883” TO “ALL FOOTNOTES
PERTAINING TO TABLE IIA IN MIL-STD-883”.
• PAGE 6, PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF
TABLE IV OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD883”.
• PAGE 3, PARAGRAPH 3.2.3, 03 ADDED RH37W10 (FLATPAK GLASS SEAL, 10 LEAD).
• PAGE 4, PARAGRAPH 3.8.3, ADDED OPTION 3. PARAGRAPH 3.10.1, ADDED FIGURE 3.
PARAGRAPH 3.10.2, CHANGED TO FIGURE 4, 5 AND ADDED FIGURE 6.
• PAGE 5, PARAGRAPH 3.11.3, CHANGED FIGURE TO 13.
• PAGE 9, ADDED DEVICE OPTION 03.
• PAGE 10, ADDED FIGURE 6.
• PAGE 15, ADDED DEVICE OPTION 03, STATIC BURN-IN CIRCUIT.
• PAGE 16, ADDED DEVICE OPTION 03, DYNAMIC BURN-IN CIRCUIT.
• PAGE 18, CHANGED NOTES FROM ALPHABETICAL ORDER TO NUMBER’S PER LTC DATA
SHEET.
03/20/98
07/14/99
01/04/00
07/06/00
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
APPLICATION
1
P
18
P
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
2
P
19
P
3
P
20
P
4
P
21
P
5
P
22
P
SIGNOFFS
6
P
7
P
DATE
8
P
9
P
10
P
11
P
12
P
13
P
14
P
15
P
16
P
17
P
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
MICROCIRCUIT, LINEAR,
RH37C, PRECISION
OPERATIONAL AMPLIFIER
SIZE
CAGE CODE DRAWING NUMBER REV
64155
05-08-5030
P
CONTRACT:
FOR OFFICIAL USE ONLY
________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 1 of 22
SPEC NO. 05-08-5030 REV. P
REV
F
•
G
•
•
RH37C, PRECISION OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
PAGE 9, CHANGED THETA JA TO 0JA=170°C/W AND THETA JC 0JC=40°C/W FROM
0JA=225°C/W AND 0JC=18°C/W PER PACKAGE ENGINEER.
PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3, ADDED “OPTION” BEFORE EACH DEVICE
SELECTION.
DATE
09/05/00
09/20/02
PAGE 4, PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II.
PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV.
PARAGRAPH 3.10.3, ADDED “DEVICE OPTIONS 1, 2, AND 3” TO LINE 1.
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per
second” TO “…dosage rate of less than or equal to 10 Rads per second”.
•
PAGE 5, PARAGRAPHS 4.1 THROUGH 4.4.2 CHANGES WERE DONE TO CLARIFY GROUP
SAMPLING.
• PAGE 6, PARAGRAPHS 4.4.2.1 THROUGH 4.4.3 CHANGES WERE DONE TO CLARIFY GROUP
SAMPLING.
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
• PAGE 7, PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM
DELIVERED DATA.
• PAGES 8 THROUGH 18, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
•
PAGE 11, MOVED FIGURES TO BETTER FIT ON THE PAGE.
•
PAGE 14, CERDIP STATIC BURN-IN CHANGED TO REFLECT DIFFERENT BURN-IN
VOLTAGES AND BURN-IN CIRCUIT.
•
PAGE 15, CERDIP DYNAMIC BURN-IN CHANGED TO COMPLETE NEW CIRCUIT.
•
PAGE 17, FLATPACK, DYNAMIC BURN-IN CHANGED TO COMPLETE NEW CIRCUIT.
•
PAGE 19, TABLES I, II HAVE CORRESPONDING NOTES ALL ON PAGE 20.
•
PAGE 21, FIGURE 14 AND FIGURE 15 NOW ON ONE PAGE.
H
•
PAGE 10, CHANGED OUTLINE DRAWING PIN 1 NOTCH MOVED TO INSIDE LEAD
LOCATION.
05/19/03
J
K
•
•
PAGE 5, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
03/16/05
10/11/07
•
L
M
N
•
•
•
•
•
PAGE 5, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED TO
3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
PAGE 4, PARAGRAPH 3.10.3 ADDED OPTION 3 IS ALLOY 42 FOR FLATPACK.
PAGE 4, PARAGRAPH 3.10.3 CHANGED OPTION 2 TO ALLOY 42 PACKAGE REQUIREMENT.
PAGE 5, PARAGRAPH 3.11.1 CHANGED VERBIAGE.
PAGE 5, PARAGRAPH 4.4.2 CHANGED VERBIAGE.
PAGE 10, FIGURE 3 NOTE 2 ADDED TO LEAD THICKNESS.
PAGE 3, PARAGRAPH 3.2.3, OPTION 3, AMENDED DEVICE NOMENCLATURE FROM
04/29/08
05/27/08
05/23/12
RH37CW10 TO RH37CW.
P
•
PAGE 4, PARAGRAPH 3.5, DEVICE HAS BEEN RETESTED AND FOUND TO HAVE AN
ESD CLASSIFICATION OF 3A.
________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 2 of 22
SPEC NO. 05-08-5030 REV. P
1.0
SCOPE:
1.1
2.0
RH37C, PRECISION OPERATIONAL AMPLIFIER
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of
Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a
part of this specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the
contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and
other referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH37C, Precision Operational
Amplifier, processed to space level manufacturing flow.
3.2
Part Number:
3.3
3.2.1
Option 1 – RH37CH (TO5 Metal Can, 8 Lead)
3.2.2
Option 2 – RH37CJ8 (Ceramic Dip, 8 Lead)
3.2.3
Option 3 – RH37CW (Flatpak Glass Sealed, 10 Lead)
Part Marking Includes:
a.
LTC Logo
b.
LTC Part Number (See Paragraph 3.2)
c.
Date Code
d.
Serial Number
e.
ESD Identifier per MIL-PRF-38535, Appendix A
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LINEAR TECHNOLOGY CORPORATION
Page 3 of 22
SPEC NO. 05-08-5030 REV. P
3.4
RH37C, PRECISION OPERATIONAL AMPLIFIER
The Absolute Maximum Ratings:
Supply Voltage
. . . . . .
Internal Power Dissipation . . .
Input Voltage . . . . . . .
.
Output Short-Circuit Duration
.
Differential Input Current 1/
.
Operating Temperature Range
.
Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
. . . . . . . . . . +22V
. . . . . . . . . . 500mW
. . . . . . .
Equal to Supply Voltage
. . . . . . . . . . Indefinite
. . . . . . . . . . +25mA
. . . . . . . . . . -55°C to +125°C
. . . . . . . . . . -55°C to +150°C
. . . . . . . . . . -65°C to +150°C
. . . . . . . . +300°C
1/
The RH37’s inputs are protected by back-to-back diodes. Current limiting resistors are
not used in order to achieve low noise. If differential input voltage exceeds +0.7V, the input
current should be limited to 25mA.
3.5
Electrostatic discharge sensitivity, ESDS, shall be Class 3A.
3.6
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified
in Table I and Table II.
3.7
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
3.8
Burn-In Requirement:
3.8.1
Option 1 (TO5): Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8
3.8.2
Option 2 (Ceramic Dip): Static Burn-In, Figure 9; Dynamic Burn-In, Figure 10
3.8.3
Option 3 (Flatpack Glass Sealed) : Static Burn-In, Figure 11; Dynamic Burn-In, Figure 12
3.9
Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after
each burn-in, and the delta rejects are included in the PDA calculation.
3.10
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.10.1
Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance
with Figure 1, Figure 2, and Figure 3.
3.10.2
Terminal Connections: The terminal connections shall be as specified in Figure 4, Figure 5,
and Figure 6.
3.10.3
Lead Material and Finish: The lead material and finish for Device Options 1, shall be Kovar
and Options 2, 3 is Alloy 42. The lead finishes shall be hot solder dip (Finish letter A) in
accordance with MIL-PRF-38535.
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LINEAR TECHNOLOGY CORPORATION
Page 4 of 22
SPEC NO. 05-08-5030 REV. P
3.11
4.0
RH37C, PRECISION OPERATIONAL AMPLIFIER
Radiation Hardness Assurance (RHA):
3.11.1
The manufacturer shall perform a lot sample test as an internal process monitor for total
dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019
Condition A as a guideline.
3.11.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
3.11.3
Total dose bias circuit is specified in Figure 13.
3.12
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix
A, except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.
3.13
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of
SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack
when specified as a customer purchase order line item.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on
qualified Class S manufacturing lines.
4.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
4.3
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with
QML allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the
test method. Electrical testing shall be as specified in Table IV herein.
4.3.1
4.4
Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot
fails the burn-in or re-burn-in PDA requirements.
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and
4.3 herein and as follows:
4.4.1
Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
4.4.2
Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2
(Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed
prior to the first shipment from any inspection lot and Attributes provided when a Full Space
Data Pack is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This
subgroup may or may not be from devices built in the same package style as the current
inspection lot. Attributes and variables data for this subgroup will be provided upon request at
no charge.
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LINEAR TECHNOLOGY CORPORATION
Page 5 of 22
SPEC NO. 05-08-5030 REV. P
4.4.2.1
RH37C, PRECISION OPERATIONAL AMPLIFIER
Group B, Subgroup 2c = 10%
Group B, Subgroup 3 = 10%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
whichever is the larger quantity)
Group B, Subgroup 4 = 5%
Group B, Subgroup 6 = 15%
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The
quantity (accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
4.4.3
4.5
4.6
Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each
assembly location every 26 weeks. A generic Group D Summary is provided when a full Space
Data Pack is ordered.
4.4.3.1
Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
4.4.3.2
All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The
quantity (accept number) or sample number and accept number of all other subgroups
are per MIL-STD-883, Method 5005, Table IV.
Source Inspection:
4.5.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal
internal visual.
4.5.2
The procuring activity has the right to perform source inspection at the supplier’s facility prior
to shipment for each lot of deliverables when specified as a customer purchase order line item.
This may include wafer lot acceptance and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
4.6.1
Lot Serial Number Sheets identifying all devices accepted through final inspection by serial
number.
4.6.2
100% attributes (completed lot specific traveler; includes Group A Summary)
4.6.3
Burn-In Variables Data and Deltas (if applicable)
4.6.4
Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)
4.6.5
Generic Group D data (4.4.3 herein)
4.6.6
SEM photographs (3.13 herein)
4.6.7
Wafer Lot Acceptance Report (3.13 herein)
4.6.8
X-Ray Negatives and Radiographic Report
4.6.9
A copy of outside test laboratory radiation report if ordered
________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 6 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is
noted on the Purchase Order Review Form as “No Charge Data”.
5.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices
shall be packaged in conductive material or packaged in anti-static material with an external conductive field
shielding barrier.
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LINEAR TECHNOLOGY CORPORATION
Page 7 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 1
(H) TO5 / 8 LEADS CASE OUTLINE
θja = +150°C/W
θjc = +40°C/W
FIGURE 1
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LINEAR TECHNOLOGY CORPORATION
Page 8 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 2
(J8) CERAMIC DIP / 8 LEADS CASE OUTLINE
NOTE:
1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
2. 8 LEAD D MAX = .0405 (10.287)
θja = +110°C/W
θjc = +30°C/W
FIGURE 2
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LINEAR TECHNOLOGY CORPORATION
Page 9 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 3
(W10) GLASS SEALED FLATPACK / 10 LEADS CASE OUTLINE
NOTE: 1. THIS DIMENSION ALLOWS FOR
OFF-CENTER LID, MENISCUS AND GLASS OVER
RUN.
NOTE: 2. INCREASE DIMENSION BY 0.003 INCH
WHEN LEAD FINISH IS APPLIED (SOLDER DIPPED).
θja = +170°C/W
θjc = +40°C/W
FIGURE 3
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LINEAR TECHNOLOGY CORPORATION
Page 10 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
TERMINAL CONNECTIONS
DEVICE OPTION #1
DEVICE OPTION #2
FIGURE 4
DEVICE OPTION #3
FIGURE 5
FIGURE 6
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LINEAR TECHNOLOGY CORPORATION
Page 11 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 8 LEADS
FIGURE 7
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LINEAR TECHNOLOGY CORPORATION
Page 12 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 8 LEADS
FIGURE 8
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LINEAR TECHNOLOGY CORPORATION
Page 13 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION #2, CERDIP / 8 LEADS
FIGURE 9
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LINEAR TECHNOLOGY CORPORATION
Page 14 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 2, CERDIP / 8 LEADS
FIGURE 10
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LINEAR TECHNOLOGY CORPORATION
Page 15 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 3, GLASS SEALED FLATPACK / 10 LEAD
FIGURE 11
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LINEAR TECHNOLOGY CORPORATION
Page 16 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 3, GLASS SEALED FLATPACK / 10 LEAD
FIGURE 12
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LINEAR TECHNOLOGY CORPORATION
Page 17 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
TOTAL DOSE BIAS CIRCUIT
FIGURE 13
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LINEAR TECHNOLOGY CORPORATION
Page 18 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) NOTE 9
See applicable notes on page 20.
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LINEAR TECHNOLOGY CORPORATION
Page 19 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE 10
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LINEAR TECHNOLOGY CORPORATION
Page 20 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
0.1Hz TO 10Hz NOISE TEST CIRCUIT
FIGURE 14
CURRENT NOISE MEASUREMENT
Current Noise is measured and calculated by the following formula:
FIGURE 15
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LINEAR TECHNOLOGY CORPORATION
Page 21 of 22
SPEC NO. 05-08-5030 REV. P
RH37C, PRECISION OPERATIONAL AMPLIFIER
TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS
TA = 25°C
PARAMETER
VOS
+IIB
-IIB
ENDPOINT LIMIT
MIN
MAX
-100
100
-80
80
-80
80
DELTA
MIN
-75
-10
-10
MAX
75
10
10
UNITS
µV
nA
nA
TABLE 1V: ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
FINAL ELECTRICAL TEST REQUIREMENTS (METHOD
5004)
GROUP A TEST REQUIREMENTS (METHOD 5005)
GROUP B AND D FOR CLASS S ENDPOINT ELECTRICAL
PARAMETERS (METHOD 5005)
SUBGROUP
1*, 2, 3, 4, 5, 6, 7
1, 2, 3, 4, 5, 6, 7
1, 2, 3
*PDA APPLIES TO SUBGROUP 1.
PDA TEST NOTE: The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cool down as
the final electrical test in accordance with method 5004 of MIL-STD-883. The verified failures of Group A, Subgroup
1 and delta rejects after burn-in divided by the total number of devices submitted for burn-in in that lot shall be used to
determine the percent for the lot.
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LINEAR TECHNOLOGY CORPORATION
Page 22 of 22