RH27C - SPEC NO. 05-08-5029

SPEC NO. 05-08-5029 REV. V
REV
0
A
B
C
D
E
F
RH27, PRECISION OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
DATE
06/12/96
08/01/97
INITIAL RELEASE
• PAGE 2 - ADDED PARAGRAPHS 3.2.1 - 3.2.3 REFERENCING THE PACKAGE OPTIONS.
PARAGRAPH 3.3.b, ADDED “(SEE PARAGRAPH 3.2)”. PARAGRAPH 3.2.3, CHANGED
PACKAGE OPTION FROM “10LEAD FLATPACK” TO “10 LEAD BOTTOM BRAZED
FLATPACK”.
• PAGE 3, PARAGRAPH 3.6 – CHANGED “TABLE I” AND “TABLE IA” TO “TABLE 1” AND
“TABLE 1A” TO MATCH THE ACTUAL TABLES ON PAGES 17 AND 18.
• PAGE 4 – DELETED PARAGRAPH 3.12.1.
• PAGE 6, FIGURE 1, PAGE 7, FIGURE 2, AND PAGE 8, FIGURE 3 - ADDED θja, θjc, AND TJMAX.
• PAGE 9, FIGURE 6 – CHANGED TO VIEW OF THE 10 LEAD W PACKAGE.
• PAGES 10 - 13, FIGURES 7 – 10 – REMOVED REFERENCE TO LTC SPEC.
• PAGES 14 AND 15, FIGURES 11 AND 12 – REMOVED NOTE ON CALCULATION OF TJMAX
SUPPLIED BY CUSTOMER. CHANGED PACKAGE TYPE FROM “FLATPACK” TO “BOTTOM
BRAZED FLATPACK” ON BOTH PAGES.
• PAGE 17 – REMOVED EXTRA HEADER FOR PRE-IRRADIATION ELECTRICAL TABLE.
• PAGE 20 – CHANGED DELTA LIMITS ON +IB AND –IB PARAMETERS FROM MIN –10, MAX 10
TO –30, MAX 30.
• PAGE 4, ADDED PARAGRAPHS 3.8.1, 3.8.2, 3.8.3.
• PAGE 5, PARAGRAPH 4.4.2, GROUP B INSPECTION, WAS REDEFINED.
• PAGE 6, PARAGRAPH 4.4.3, GROUP D INSPECTION, WAS REDEFINED. PARAGRAPH 4.5,
SOURCE INSPECTION WAS REDEFINED.
• PAGE 5, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES. ADDED A SECOND PAGE FOR REVISION RECORD. UPDATED
ENTIRE SPEC TO NEXT REVISION DUE TO THE ADDITIONAL PAGE.
• PAGE 3, CHANGED PARAGRAPH 3.2.3, PACKAGE OPTION FROM “10 LEAD BOTTOM
BRAZED FLATPACK” TO “10 LEAD CERPAK”. PAGE 9 CHANGED “(WB) BOTTOM BRAZED
FLATPACK” TO “(W) CERPAK”. PAGE 10 CHANGED OPTION 3 FROM “(WB) BOTTOM
BRAZED FLATPACK” TO “(W) CERPAK”. PAGE 15, 16, CHANGED FIGURE 11, 12, FROM
“BOTTOM BRAZED FLATPACK” TO “CERPAK”. PAGE 4, CHANGED OPTION 3 TO “CERPAK”.
• PAGE 7, TO5 CASE OUTLINE, CHANGED θjc FROM 60°C/W TO 40°C/W, θja DOES NOT
CHANGE.
• PAGE 8, CERDIP CASE OUTLINE, CHANGED θja FROM 120°C/W TO 110°C/W, θjc CHANGED
FROM 50°C/W TO 30°C/W.
09/29/97
12/01/97
03/20/98
10/16/98
7/19/99
CONTINUED ON NEXT PAGE…..
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
APPLICATION
1
V
18
V
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
2
V
19
V
3
V
20
V
4
V
21
V
5
V
22
V
SIGNOFFS
6
V
7
V
DATE
8
V
9
V
10
V
11
V
12
V
13
V
14
V
15
V
16
V
17
V
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
MICROCIRCUIT, LINEAR,
RH27, OPERATIONAL
AMPLIFIER
SIZE
CAGE CODE DRAWING NUMBER REV
64155
05-08-5029
V
CONTRACT:
FOR OFFICIAL USE ONLY
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 1 of 22
SPEC NO. 05-08-5029 REV. V
REV
G
H
J
K
RH27, PRECISION OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
• PAGE 9, FIGURE 3, CHANGED θja AND θjc.
• PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3 HAD FIGURES 1, 2, 3 REMOVED.
• PAGE 4, PARAGRAPH 3.7 CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND AS
SPECIFIED IN TABLE III HEREIN”, LINE 2. PARAGRAPH 3.9 ADDED “HEREIN” AFTER “TABLE
II”, LINE 2.
• PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.1,
ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.2.2, CHANGED VERBIAGE IN
LINE 1 FROM “ALL FOOTNOTES OF TABLE IIA OF MIL-STD-883” TO “ALL FOOTNOTES
PERTAINING TO TABLE IIA IN MIL-STD-883”.
• PAGE 6, PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF
TABLE IV OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD883”.
• PAGE 9, CHANGED THETA JA TO θJA=170°C/W AND THETA JC TO θJC=40°C/W FROM
θJA=225°C/W AND θJC=18°C/W PER PACKAGE ENGINEER.
• PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3, ADDED “OPTION” BEFORE EACH DEVICE SELECTION.
• PAGE 4, PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II.
PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV.
PARAGRAPH 3.10.3, ADDED “DEVICE OPTIONS 1, 2, AND 3” TO LINE 1.
DATE
09/29/99
01/04/00
09/05/00
11/07/02
• PAGE 5, PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads
per second” TO “…dosage rate of less than or equal to 10 Rads per second”.
PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
• PAGE 6, PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
• PAGES 8 THROUGH 18, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
• PAGE 9, CASE OUTLINE EDITED TO REFLECT ONLY THE 8 LEAD PACKAGE
INFORMATION.
FIGURE 2, SHOULDER OF LEAD WIDTH MAXIMUM INCREASED BY .003 INCHES.
• PAGE 10, CASE OUTLINE WAS UPDATED TO MEET MIL-STD-1835.
FIGURE 3, PACKAGE THICKNESS MAXIMUM INCREASED BY .005 INCHES. PACKAGE WIDTH
AND LENGTH MAXIMUMS INCREASED BY .01 AND .02 INCHES, RESPECTIVELY.
•
•
•
•
•
•
•
PAGE 11, MOVED FIGURES 4, 5, 6 FOR BETTER FIT ON PAGE.
PAGE 13, FIGURE 8, ADDED PACKAGE PINOUTS.
PAGE 14, FIGURE 9, ADDED PACKAGE PINOUTS.
PAGE 15, FIGURE 10, ADDED PACKAGE PINOUTS.
PAGE 16, FIGURE 11, ADDED PACKAGE PINOUTS.
PAGE 17, FIGURE 12, ADDED PACKAGE PINOUTS.
PAGE 19, ADDED NOTE 8 AFTER TABLE II.
L
•
PAGE 9, CHANGED OUTLINE DRAWING PIN 1 NOTCH MOVED TO INSIDE LEAD
LOCATION.
M
N
•
•
P
Q
PAGE 4, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
PAGE 5, CHANGED IN 4.2 & 4.3 PARAGRAPHS IN CONJUNCTION TO 3.3 CHANGED TO
PARAGRAPH 3.4
• PAGE 5, PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
• PAGE 4, PARAGRAPH 3.10.3 ADDED OPTION 3 IS ALLOY 42 FOR FLATPACK.
05/19/03
03/16/05
07/16/07
09/10/07
10/19/07
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 2 of 22
SPEC NO. 05-08-5029 REV. V
REVISION RECORD
DESCRIPTION
REV
R
S
T
U
V
RH27, PRECISION OPERATIONAL AMPLIFIER
•
•
PAGE 6, PARAGRAPH 3.11.1 CHANGED VERBIAGE
PAGE 5, PARAGRAPH 3.10.3 CHANGED OPTION 2 TO ALLOY 42 PACKAGE
REQUIREMENT.
• PAGE 6, PARAGRAPH 4.4.2 CHANGED VERBIAGE.
• PAGE 10, FIGURE 3 NOTE 2 ADDED TO LEAD THICKNESS.
• ADDED OPTION 4 & OPTION 5 THROUGH OUT SPEC.
• Page 16, ADDED DYNAMIC BURN-IN CIRCUIT INFORMATION
• Removed the “C” from RH27 header.
• Page 19, 20, Added updated data sheet.
• PAGE 4, PARAGRAPH 3.2.6, ADDED OPTION 6, RH27AEW (GLASS SEAL FLATPACK, 10
LEADS).
• PAGE 5, PARAGRAPH 3.8.3, ADDED OPTION 6 TO BURN-IN REQUIREMENT.
• PAGE 5, PARAGRAPH 3.10.3, ADDED OPTION 6 TO LEAD MATERIAL AND FINISH.
• PAGE 10, FIGURE 3, ADDED DEVICE OPTION 6 TO W10 GLASS SEALED FLATPACK.
• PAGE 11, FIGURE 6, ADDED DEVICE OPTION 6 TO GLASS SEALED FLATPACK
TERMINAL CONNECTIONS.
• PAGE 16, FIGURE 11, ADDED OPTION 6 TO STATIC BURN-IN CIRCUIT.
• PAGE 17, FIGURE 12, ADDED OPTION 6 TO DYNAMIC BURN-IN CIRCUIT.
• PAGE 5, PARAGRAPH 3.5, AMENDED ESD CLASSIFICATION FROM CLASS 1 TO
CLASS 2.
DATE
04/29/08
05/27/08
01/23/09
01/20/12
05/23/12
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 3 of 22
SPEC NO. 05-08-5029 REV. V
1.0
SCOPE:
1.1
2.0
RH27, PRECISION OPERATIONAL AMPLIFIER
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the contents
of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other
referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH27 Precision Operational
Amplifier, processed to space level manufacturing flow.
3.2
Part Number:
3.2.1
Option 1 – RH27CH (TO5 Metal Can, 8 Leads)
3.2.2
Option 2 – RH27CJ8 (Ceramic Dip, 8 Leads)
3.2.3
Option 3 – RH27CW (Glass Seal Flatpack, 10 Leads)
3.2.4
Option 4 – RH27EW (Glass Seal Flatpack, 10 Leads)
3.2.5
Option 5 – RH27EH (TO5 Metal Can, 8 Leads)
3.2.6
Option 6 – RH27AEW (Glass Seal Flatpack, 10 Leads)
Note: RH27AEW is marked and processed as RH27EW. Orders will be
delivered with an additional screening at 25°C, –55°C to 125°C to the VOS
specification shown on Table 1.
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 4 of 22
SPEC NO. 05-08-5029 REV. V
3.3
3.4
RH27, PRECISION OPERATIONAL AMPLIFIER
Part Marking Includes:
a.
LTC Logo
b.
LTC Part Number (See Paragraph 3.2)
c.
Date Code
d.
Serial Number
e.
ESD Identifier per MIL-PRF-38535, Appendix A
The Absolute Maximum Ratings:
Supply Voltage
. . . . . .
. .
Internal Power Dissipation
.
.
.
.
. .
Input Voltage
Output Short Circuit Duration . .
.
Differential Input Current 1/
.
Operating Temperature Range
.
Junction Temperature Range
Storage Temperature Range
Lead Temperature (Soldering, 10 sec)
. . . . . . . . . . +22V
. . . . . . . . . . 500mW
. . . . . . . . . . Equal to Supply Voltage
. . . . . . . . . . Indefinite
. . . . . . . . . . +25mA
. . . . . . . . . . -55°C to +125°C
. . . . . . . . . . -55°C to +150°C
. . . . . . . . . . -65°C to +150°C
. . . . . . . . +300°C
1/ The RH27’s inputs are protected by back-to-back diodes. Current limiting resistors are not used
in order to achieve low noise. If differential input voltage exceeds +0.7V, the input current should be
limited to 25mA.
3.5
Electrostatic discharge sensitivity, ESDS, shall be Class 2.
3.6
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I and Table II.
3.7
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
3.8
Burn-In Requirement:
3.8.1
Option 1, 5 (TO5): Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8
3.8.2
Option 2 (Ceramic Dip): Static Burn-In, Figure 9; Dynamic Burn-In, Figure 10
3.8.3
Options 3, 4, 6: (Glass Sealed Flatpack) : Static Burn-In, Figure 11; Dynamic Burn-In,
Figure 12
3.9
Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after
each burn-in, and the delta rejects are included in the PDA calculation.
3.10
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.10.1
3.10.2
Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1, Figure 2, and Figure 3.
Terminal Connections: The terminal connections shall be as specified in Figure 4, Figure 5,
and Figure 6.
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 5 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
3.10.3
Lead Material and Finish: The lead material and finish for Device Options 1, 5 shall be Kovar
and Options 2, 3, 4, and 6 are Alloy 42. The lead finishes shall be hot solder dip (Finish letter
A) in accordance with MIL-PRF-38535.
3.11
4.0
Radiation Hardness Assurance (RHA):
3.11.1
The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as
a guideline.
3.11.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
3.11.3
Total dose bias circuit is specified in Figure 13.
3.12
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.
3.13
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.
Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified
Class S manufacturing lines.
4.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
4.3
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test
method. Electrical testing shall be as specified in Table IV herein.
4.3.1
4.4
Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1
Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
4.4.2
Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2
(Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed prior
to the first shipment from any inspection lot and Attributes provided when a Full Space Data Pack
is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This subgroup may or
may not be from devices built in the same package style as the current inspection lot. Attributes
and variables data for this subgroup will be provided upon request at no charge.
4.4.2.1
Group B, Subgroup 2c = 10%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
Group B, Subgroup 3 = 10%
whichever is the larger quantity)
Group B, Subgroup 4 = 5%
Group B, Subgroup 6 = 15%
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LINEAR TECHNOLOGY CORPORATION
Page 6 of 22
SPEC NO. 05-08-5029 REV. V
4.4.2.2
4.4.3
4.5
4.6
RH27, PRECISION OPERATIONAL AMPLIFIER
All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The
quantity (accept number) of all other subgroups are per MIL-STD-883, Method 5005,
Table IIa.
Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each assembly
location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is
ordered.
4.4.3.1
Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
4.4.3.2
All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The
quantity (accept number) or sample number and accept number of all other subgroups
are per MIL-STD-883, Method 5005, Table IV.
Source Inspection:
4.5.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal
visual.
4.5.2
The procuring activity has the right to perform source inspection at the supplier’s facility prior to
shipment for each lot of deliverables when specified as a customer purchase order line item. This
may include wafer lot acceptance and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
4.6.1
Lot Serial Number Sheets identifying all devices accepted through final inspection by serial
number.
4.6.2
100% attributes (completed lot specific traveler; includes Group A Summary)
4.6.3
Burn-In Variables Data and Deltas (if applicable)
4.6.4
Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)
4.6.5
Generic Group D data (4.4.3 herein)
4.6.6
SEM photographs (3.13 herein)
4.6.7
Wafer Lot Acceptance Report (3.13 herein)
4.6.8
X-Ray Negatives and Radiographic Report
4.6.9
A copy of outside test laboratory radiation report if ordered
4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is noted
on the Purchase Order Review Form as “No Charge Data”.
5.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices
shall be packaged in conductive material or packaged in anti-static material with an external conductive field
shielding barrier.
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 7 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 1, 5
(H) TO5 / 8 LEADS CASE OUTLINE
θja = +150°C/W
θjc = +40°C/W
FIGURE 1
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LINEAR TECHNOLOGY CORPORATION
Page 8 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 2
(J8) CERAMIC DIP / 8 LEADS CASE OUTLINE
NOTE: 1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
2. 8 LEAD D MAX = .405 (10.287)
θja = +110°C/W
θjc = +30°C/W
FIGURE 2
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LINEAR TECHNOLOGY CORPORATION
Page 9 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
DEVICE OPTION # 3, 4, 6
(W10) GLASS SEALED FLATPACK / 10LEADS CASE OUTLINE
NOTE: 1. THIS DIMENSION ALLOWS FOR OFFCENTER LID, MENISCUS AND GLASS OVER RUN.
NOTE: 2. INCREASE DIMENSION BY 0.003 INCH
WHEN LEAD FINISH IS APPLIED (SOLDER DIPPED).
θja = +170°C/W
θjc = +40°C/W
FIGURE 3
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LINEAR TECHNOLOGY CORPORATION
Page 10 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
TERMINAL CONNECTIONS
DEVICE OPTION #1, 5 TO5 10 LEAD METAL CAN
FIGURE 4
DEVICE OPTION #2, 8 LEAD CERAMIC DIP
DEVICE OPTION #3, 4, 6 GLASS SEALED
10 LEAD FLATPACK
FIGURE 5
FIGURE 6
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LINEAR TECHNOLOGY CORPORATION
Page 11 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 1, 5 TO5 METAL CAN / 8 LEADS
FIGURE 7
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LINEAR TECHNOLOGY CORPORATION
Page 12 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 1, 5 TO5 METAL CAN / 8 LEADS
FIGURE 8
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LINEAR TECHNOLOGY CORPORATION
Page 13 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION #2, CERDIP / 8 LEADS
FIGURE 9
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LINEAR TECHNOLOGY CORPORATION
Page 14 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 2, CERDIP / 8 LEADS
FIGURE 10
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LINEAR TECHNOLOGY CORPORATION
Page 15 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 3, 4, 6 GLASS SEALED FLATPACK / 10 LEAD
Notes:
1. Unless otherwise specified, components
tolerances shall be per military specification.
2. Tj = 150°C maximum *
3. Ta = 125°C
4. Burn-in Voltages: V1 = +18V to +19.8V
V2 = -18V to -19.8V
*Tj Calculation is based on:
a) Icc = 3.85mA maximum @ ±19.8V
b) θja of 112°C/W as supplied by customer
FIGURE 11
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LINEAR TECHNOLOGY CORPORATION
Page 16 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 3, 4, 6 GLASS SEALED FLATPACK / 10 LEAD
FIGURE 12
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LINEAR TECHNOLOGY CORPORATION
Page 17 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
TOTAL DOSE BIAS CIRCUIT
FIGURE 13
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LINEAR TECHNOLOGY CORPORATION
Page 18 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) NOTE 9
NOTES ARE ON THE NEXT PAGE.
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 19 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE 10
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LINEAR TECHNOLOGY CORPORATION
Page 20 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
0.1Hz TO 10Hz NOISE TEST CIRCUIT
FIGURE 14
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CURRENT NOISE MEASUREMENT
Current Noise is measured and calculated by the following formula:
FIGURE 15
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LINEAR TECHNOLOGY CORPORATION
Page 21 of 22
SPEC NO. 05-08-5029 REV. V
RH27, PRECISION OPERATIONAL AMPLIFIER
TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS
TA = 25°C, VCC = +15V
PARAMETER
VOS
+IB
-IB
ENDPOINT LIMIT
MIN
MAX
-100
100
-80
80
-80
80
DELTA
MIN
-75
-30
-30
MAX
75
30
30
UNITS
µV
nA
nA
TABLE IV: ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
FINAL ELECTRICAL TEST REQUIREMENTS (METHOD
5004)
GROUP A TEST REQUIREMENTS (METHOD 5005)
GROUP B AND D FOR CLASS S ENDPOINT ELECTRICAL
PARAMETERS (METHOD 5005)
SUBGROUP
1*, 2, 3, 4, 5, 6, 7
1, 2, 3, 4, 5, 6, 7
1, 2, 3
*PDA APPLIES TO SUBGROUP 1.
PDA TEST NOTE: The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cooldown as the
final electrical test in accordance with method 5004 of MIL-STD-883. The verified failures of Group A, Subgroup 1 and
delta rejects after burn-in divided by the total number of devices submitted for burn-in in that lot shall be used to determine
the percent for the lot.
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LINEAR TECHNOLOGY CORPORATION
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