RH07 - SPEC NO. 05-08-5010

SPEC NO. 05-08-5010 REV. K
REV
0
A
B
C
D
RH07, OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
DATE
06/12/96
12/12/97
INITIAL RELEASE
• PAGE 2: ADDED PARAGRAPHS 3.2.1, 3.2.2, AND 3.2.3.
• PAGE 2: PARAGRAPH 3.3.b, ADDED “see paragraph 3.2”.
• PAGE 3: ADDED PARAGRAPHS 3.8.1, 3.8.2, 3.8.3 TO EXPLAIN DEVICE OPTION BURN-IN.
PARAGRAPH 3.10.1, ADDED FIG. 3 FOR WB PKG. PARAGRAPH 3.10.2, ADDED FIGURE 6 FOR
WB PACKAGE.
• PAGE 4: PARAGRAPH 3.11.3, FIGURE 9 BECAME FIGURE 13. PARAGRAPH 3.12, WAFER
LOT ACCEPTANCE EXPLANATION WAS REWRITTEN. PARAGRAPH 4.4.2, GROUP B
INSPECTION, REDEFINED.
• PAGE 5: PARAGRAPH 4.4.3, GROUP D INSPECTION, REDEFINED. PARAGRAPH 4.5.1,
SOURCE INSPECTION, REDEFINED.
• PAGES 6, 7, 8, FIGS. 1, 2, 3: ADDED θja AND θjc TO CASE OUTLINE.
• PAGE 9, ADDED FIGURE 6 FOR WB PACKAGE.
• PAGE 10, FIG 5 BECAME FIG. 7. PAGE 11, FIG. 6 BECAME FIG. 8. PAGE 12, FIG. 7 BECAME
FIG. 9. PAGE 13, FIG. 8 BECAME FIG. 10. PAGE 14, ADDED FIG. 11. PAGE 15, ADDED FIG. 12.
PAGE 17, MOVED NOTES TO PAGE 18.
PAGE 5, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF
CATASTROPHIC FAILURES.
ADDED A SECOND PAGE FOR REVISION RECORD. UPDATED ENTIRE SPEC TO NEXT REVISION
DUE TO THE ADDITIONAL PAGE.
PAGE 7, CHANGED TO5 CASE OUTLINE θja FROM 180°C/W TO 150°C/W, θjc REMAINED THE
SAME.
PAGE 8, CHANGED CERDIP CASE OUTLINE θja FROM 100°C/W TO 110°C/W, θjc CHANGED FROM
25°C/W TO 30°C/W.
CHANGED PACKAGE “WB” (BOTTOM BRAZED FLATPACK) TO “W” (GLASS SEAL FLATPACK)
ON PAGES 3, 4, 9, 10, 15, AND 16.
• PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3 HAD FIGURES 1, 2, AND 3 REMOVED.
•
04/20/98
07/19/99
12/29/99
PAGE 4, PARAGRAPH 3.7 CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND
AS SPECIFIED IN TABLE III HEREIN”, LINE 2. PARAGRAPH 3.9, ADDED “HEREIN” AFTER
“TABLE II” LINE 2.
CONTINUED ON NEXT PAGE…..
REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION
INDEX
REVISION
INDEX
PAGE NO.
REVISION
PAGE NO.
REVISION
APPLICATION
1
K
18
K
ORIG
DSGN
ENGR
MFG
CM
QA
PROG
FUNCT
2
K
19
K
3
K
20
K
4
K
5
K
SIGNOFFS
6
K
7
K
DATE
8
K
9
K
10
K
11
K
12
K
13
K
14
K
15
K
16
K
17
K
LINEAR TECHNOLOGY CORPORATION
MILPITAS, CALIFORNIA
TITLE:
MICROCIRCUIT, LINEAR,
RH07, OPERATIONAL
AMPLIFIER
SIZE CAGE CODE DRAWING NUMBER REV
64155
05-08-5010
K
CONTRACT:
FOR OFFICIAL USE ONLY
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 1 of 20
SPEC NO. 05-08-5010 REV. K
REV
D
E
RH07, OPERATIONAL AMPLIFIER
REVISION RECORD
DESCRIPTION
• PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.1,
ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.2.2 CHANGED VERBIAGE
IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IIA OF MIL-STD-883” TO “ALL FOOTNOTES
PERTAINING TO TABLE IIA OF MIL-STD-883”.
• PAGE 6: PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF
TABLE IV OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV OF MIL-STD883”.
• PAGE 3:
PARAGRAPH 3.2.1 ADDED “OPTION 1”, PARAGRAPH 3.2.2, ADDED “OPTION 2”, PARAGRAPH
3.2.3, ADDED “OPTION 3”.
DATE
12/29/99
09/20/02
• PAGE 4:
PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II.
PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV.
PARAGRAPH 3.9, TABLE II CHANGED TO TABLE III.
PARAGRAPH 3.10.3, ADDED “DEVICE OPTIONS 1, 2, AND 3” TO LINE 1.
PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per
second” TO “…dosage rate of less than or equal to 10 Rads per second”.
• PAGE 5:
PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING.
• PAGE 6:
PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING.
PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA
AVAILABLE.
PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA.
•
PAGES 7 THROUGH 17, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND
PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE.
•
PAGE 10, MOVED FIGURES TO BETTER FIT ON THE PAGE.
•
PAGE 11, STATIC BURN-IN CIRCUIT CHANGED FROM 04-06-0202 TO 04-06- 0001, PER
ENGINEERING REQUEST.
•
PAGE 18, TABLE I NOTE CHANGED FROM “Note E” to “NOTE 5”.
•
PAGE 19, TABLE II NOTE CHANGED FROM “Note F” TO “NOTE 6”.
F
•
G
H
•
•
J
•
•
CHANGED PACKAGE OUTLINE DRAWING FOR THE “W” FLATPAK, 10 LEAD, GLASS SEAL ,
DETAIL A, NOTCH MOVED TO THE INSIDE LEAD LOCATION.
PAGE 4, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC.
PAGE 5, CHANGED IN BOTH PARAGRAPHS 4.2, 4.3 IN CONJUNCTION TO 3.3 CHANGED TO
3.4 AND PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1
PAGE 4, PARAGRAPH 3.10.3 ADDED OPTION 3 ALLOY 42 FOR FLATPACK.
PAGE 4, PARAGRAPH 3.11.1 CHANGED VERBIAGE. PARAGRAPH 3.10.3 CHANGED OPTION 2
TO ALLOY 42 PACKAGE REQUIREMENT.
PAGE 5, PARAGRAPH 4.4.2 CHANGED VERBIAGE
PAGE 9, FIGURE 3 NOTE 2 ADDED TO LEAD THICKNESS.
K
•
•
05/19/03
03/16/05
10/11/07
04/29/08
05/27/08
___________________________________________________________________________________________________
LINEAR TECHNOLOGY CORPORATION
Page 2 of 20
SPEC NO. 05-08-5010 REV. K
1.0
SCOPE:
1.1
2.0
RH07, OPERATIONAL AMPLIFIER
This specification defines the performance and test requirements for a microcircuit processed to a space
level manufacturing flow.
APPLICABLE DOCUMENTS:
2.1
Government Specifications and Standards: the following documents listed in the Department of Defense
Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this
specification to the extent specified herein.
SPECIFICATIONS:
2.2
3.0
MIL-PRF-38535
Integrated Circuits (Microcircuits) Manufacturing, General Specification for
MIL-STD-883
Test Method and Procedures for Microcircuits
MIL-STD-1835
Microcircuits Case Outlines
Order of Precedence: In the event of a conflict between the documents referenced herein and the contents
of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other
referenced specifications.
REQUIREMENTS:
3.1
General Description: This specification details the requirements for the RH07 Operational Amplifier,
processed to space level manufacturing flow.
3.2
Part Number:
3.3
3.2.1
Option 1 – RH07H (TO5 Metal Can, 8 Leads)
3.2.2
Option 2 – RH07J8 (Ceramic Dip, 8 Leads)
3.2.3
Option 3 – RH07W (Glass Sealed Flatpack, 10 Leads)
Part Marking Includes:
a.
LTC Logo
b.
LTC Part Number (See Paragraph 3.2)
c.
Date Code
d.
Serial Number
e.
ESD Identifier per MIL-PRF-38535, Appendix A
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LINEAR TECHNOLOGY CORPORATION
Page 3 of 20
SPEC NO. 05-08-5010 REV. K
3.4
RH07, OPERATIONAL AMPLIFIER
The Absolute Maximum Ratings:
Supply Voltage
. . . . . . . . . . . . . . . . +22V
Differential Input Voltage . . . . . . . . . . . . . +30V
. . . . . . . . . . . . . . . . +22V
Input Voltage
Output Short Circuit Duration 1/ . . . . . . . . . . Indefinite
. . . . . . . . . . -55°C to +125°C
Operating Temperature Range
. . . . . . . . . . -65°C to +150°C
Storage Temperature Range
. . . . . . . . +300°C
Lead Temperature (Soldering, 10 sec)
1/ Parameter is guaranteed by design, characterization, or correlation to other tested parameters.
3.5
Electrostatic discharge sensitivity, ESDS, shall be Class 1.
3.6
Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in
Table I and Table II.
3.7
Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein,
MIL-STD-883, Method 5004, and as specified in Table IV herein.
3.8
Burn-In Requirement:
3.8.1
Option 1 (TO5): Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8
3.8.2
Option 2 (Ceramic Dip): Static Burn-In, Figure 9; Dynamic Burn-In, Figure 10
3.8.3
Option 3 (Glass Sealed Flatpack) : Static Burn-In, Figure 11; Dynamic Burn-In,
Figure 12
3.9
Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after each
burn-in, and the delta rejects are included in the PDA calculation.
3.10
Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and
electrical requirements shall be specified herein.
3.11
3.10.1
Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with
Figure 1, Figure 2, and Figure 3.
3.10.2
Terminal Connections: The terminal connections shall be as specified in Figure 4, Figure 5,
and Figure 6.
3.10.3
Lead Material and Finish: The lead material and finish for Device Options 1, shall be Kovar
and Options 2, 3 are Alloy 42. The lead finishes shell be hot solder dip (Finish letter A) in
accordance with MIL-PRF-38535.
Radiation Hardness Assurance (RHA):
3.11.1
The manufacturer shall perform a lot sample test as an internal process monitor for total dose
radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as
a guideline.
3.11.2
For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation,
the manufacturer will provide certified RAD testing and report through an independent test
laboratory when required as a customer purchase order line item.
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LINEAR TECHNOLOGY CORPORATION
Page 4 of 20
SPEC NO. 05-08-5010 REV. K
3.11.3
4.0
RH07, OPERATIONAL AMPLIFIER
Total dose bias circuit is specified in Figure 13.
3.12
Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A,
except for the following: Topside glassivation thickness shall be a minimum of 4KÅ.
3.13
Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM
photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when
specified as a customer purchase order line item.
VERIFICATION (QUALITY ASSURANCE PROVISIONS)
4.1
Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535.
Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified
Class S manufacturing lines.
4.2
Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method
5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and
3.4 of the test method.
4.3
Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML
allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test
method. Electrical testing shall be as specified in Table IV herein.
4.3.1
4.4
Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails
the burn-in or re-burn-in PDA requirements.
Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3
herein and as follows:
4.4.1
Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per
MIL-STD-883, Method 5005, and specified in Table IV herein.
4.4.2
Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a
minimum, Subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2
(Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed prior
to the first shipment from any inspection lot and Attributes provided when a Full Space Data Pack
is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This subgroup may or
may not be from devices built in the same package style as the current inspection lot. Attributes
and variables data for this subgroup will be provided upon request at no charge.
4.4.2.1
Group B, Subgroup 2c = 10%
Group B, Subgroup 3 = 10%
Group B, Subgroup 5 = *5%
(*per wafer or inspection lot
whichever is the larger quantity)
Group B, Subgroup 4 = 5%
Group B, Subgroup 6 = 15%
4.4.2.2 All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity
(accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa.
4.4.3
Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a
minimum, periodic full Group D sampling is performed on each package family for each assembly
location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is
ordered.
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LINEAR TECHNOLOGY CORPORATION
Page 5 of 20
SPEC NO. 05-08-5010 REV. K
4.5
4.6
RH07, OPERATIONAL AMPLIFIER
4.4.3.1
Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series).
4.4.3.2
All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The
quantity (accept number) or sample number and accept number of all other subgroups
are per MIL-STD-883, Method 5005, Table IV.
Source Inspection:
4.5.1
The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal
visual.
4.5.2
The procuring activity has the right to perform source inspection at the supplier’s facility prior to
shipment for each lot of deliverables when specified as a customer purchase order line item. This
may include wafer lot acceptance and final data review.
Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered:
4.6.1
Lot Serial Number Sheets identifying all devices accepted through final inspection by serial
number.
4.6.2
100% attributes (completed lot specific traveler; includes Group A Summary)
4.6.3
Burn-In Variables Data and Deltas (if applicable)
4.6.4
Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping)
4.6.5
Generic Group D data (4.4.3 herein)
4.6.6
SEM photographs (3.13 herein)
4.6.7
Wafer Lot Acceptance Report (3.13 herein)
4.6.8
X-Ray Negatives and Radiographic Report
4.6.9
A copy of outside test laboratory radiation report if ordered
4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this
specification and have successfully completed the mandatory tests and inspections herein.
Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is noted
on the Purchase Order Review Form as “No Charge Data”.
5.0
Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices
shall be packaged in conductive material or packaged in anti-static material with an external conductive field
shielding barrier.
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LINEAR TECHNOLOGY CORPORATION
Page 6 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
DEVICE OPTION # 1
(H) TO5 / 8 LEADS CASE OUTLINE
θja = +150°C/W
θjc = +40°C/W
FIGURE 1
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LINEAR TECHNOLOGY CORPORATION
Page 7 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
DEVICE OPTION # 2
(J8) CERAMIC DIP / 8 LEADS CASE OUTLINE
NOTE: 1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS.
2. 8 LEAD D MAX = .405 (10.287)
θja = +110°C/W
θjc = +30°C/W
FIGURE 2
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LINEAR TECHNOLOGY CORPORATION
Page 8 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
DEVICE OPTION # 3
(W10) GLASS SEALED FLATPACK / 10LEADS CASE OUTLINE
NOTE: 1. THIS DIMENSION ALLOWS FOR OFFCENTER LID, MENISCUS AND GLASS OVER RUN.
NOTE: 2. INCREASE DIMENSION BY 0.003 INCH
WHEN LEAD FINISH IS APPLIED (SOLDER DIPPED).
θja = +170°C/W
θjc = +40°C/W
Figure 3
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LINEAR TECHNOLOGY CORPORATION
Page 9 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
TERMINAL CONNECTIONS
DEVICE OPTION #1, TO5 8 LEAD METAL CAN
DEVICE OPTION #2, 8 LEAD CERAMIC DIP
FIGURE 4
DEVICE OPTION #3, GLASS SEALED
10 LEAD FLATPACK
FIGURE 5
FIGURE 6
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LINEAR TECHNOLOGY CORPORATION
Page 10 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 8 LEADS
FIGURE 7
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LINEAR TECHNOLOGY CORPORATION
Page 11 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 1, TO5 METAL CAN / 8 LEADS
FIGURE 8
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LINEAR TECHNOLOGY CORPORATION
Page 12 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION #2, CERDIP / 8 LEADS
FIGURE 9
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LINEAR TECHNOLOGY CORPORATION
Page 13 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 2, CERDIP / 8 LEADS
FIGURE 10
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LINEAR TECHNOLOGY CORPORATION
Page 14 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
STATIC BURN-IN CIRCUIT
OPTION 3, GLASS SEALED FLATPACK / 10 LEAD
FIGURE 11
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LINEAR TECHNOLOGY CORPORATION
Page 15 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
DYNAMIC BURN-IN CIRCUIT
OPTION 3, GLASS SEALED FLATPACK / 10 LEAD
FIGURE 12
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LINEAR TECHNOLOGY CORPORATION
Page 16 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
TOTAL DOSE BIAS CIRCUIT
FIGURE 13
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LINEAR TECHNOLOGY CORPORATION
Page 17 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) NOTE 5
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LINEAR TECHNOLOGY CORPORATION
Page 18 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE 6
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LINEAR TECHNOLOGY CORPORATION
Page 19 of 20
SPEC NO. 05-08-5010 REV. K
RH07, OPERATIONAL AMPLIFIER
TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS
TA = 25°C, VCC = +15V
PARAMETER
VOS
+IIB
-IIB
ENDPOINT LIMIT
MIN
MAX
-175
175
-4.5
4.5
-4.5
4.5
DELTA
MIN
-100
-1.5
-1.5
MAX
100
1.5
1.5
UNITS
µV
nA
nA
TABLE IV: ELECTRICAL TEST REQUIREMENTS
MIL-STD-883 TEST REQUIREMENTS
FINAL ELECTRICAL TEST REQUIREMENTS (METHOD
5004)
GROUP A TEST REQUIREMENTS (METHOD 5005)
GROUP B AND D FOR CLASS S ENDPOINT ELECTRICAL
PARAMETERS (METHOD 5005)
SUBGROUP
1*, 2, 3, 4, 5, 6
1, 2, 3, 4, 5, 6
1, 2, 3
*PDA APPLIES TO SUBGROUP 1.
PDA TEST NOTE: The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cooldown as the
final electrical test in accordance with method 5004 of MIL-STD-883. The verified failures of Group A, Subgroup 1 and
delta rejects after burn-in divided by the total number of devices submitted for burn-in in that lot shall be used to determine
the percent for the lot.
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LINEAR TECHNOLOGY CORPORATION
Page 20 of 20