INFINEON BSP452

Smart High-Side Power Switch
BSP452
• High-side switch
• Short-circuit protection
• Input protection
• Overtemperature protection with hysteresis
• Overload protection
• Overvoltage protection
• Switching inductive load
• Clamp of negative output voltage with inductive loads
• Undervoltage shutdown
• Maximum current internally limited
• Electrostatic discharge (ESD) protection
1
• Reverse battery protection )
• AEC qualified
SOT 223
•Package:
Green product
(RoHS compliant)
Type
Ordering code
BSP 452
Q67000-S271
SOT-223
1
SOT-223
PG-SOT-223
Application
• µC compatible power switch for 12 V DC grounded loads
• All types of resistive, inductive and capacitive loads
• Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,monolithically
integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
Blockdiagramm:
+ Vbb
Voltage
Overvoltage
Current
Gate
source
protection
limit
protection
V Logic
ESDDiode
Voltage
Charge pump
sensor
Level shifter
Rectifier
3
R
IN
4
Limit for
unclamped
ind. loads
OUT
Temperature
sensor
1
in
Load
ESD
Logic
miniPROFET
GND
2
Signal GND
1)
Load GND
With resistor RGND=150 Ω in GND connection, resistor in series with IN connections reverse load current
limited by connected load.
Data Sheet
1
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Pin
Symbol
Function
1
OUT
O
Output to the load
2
GND
-
Logic ground
3
IN
I
Input, activates the power switch in case of logical high signal
4
Vbb
+
Positive power supply voltage
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter
Supply voltage
Load current
self-limited
2)
Maximum input voltage
Maximum input current
Inductive load switch-off energy dissipation,
IL = 0.5A , TA = 150°C
single pulse
(not tested, specified by design)
Load dump protection3) VLoadDump=UA+Vs
RL= 24Ω
RI=2Ω , td=400ms, IN= low or high, UA=13,5V RL= 80Ω
(not tested, specified by design)
Electrostatic discharge capability (ESD)5)
PIN 3
PIN 1,2,4
Symbol
Vbb
IL
VIN
IIN
EAS
Operating temperature range
Storage temperature range
6
Max. power dissipation (DC) )
TA = 25 °C
Tj
Tstg
Ptot
chip - soldering point:
chip - ambient:6)
RthJS
RthJA
Thermal resistance
VLoad dump4)
VESD
Values
40
IL(SC)
-5.0...Vbb
±5
0.5
Unit
V
A
V
mA
J
60
80
V
±1
±2
-40 ...+150
-55 ...+150
1.8
kV
7
70
K/W
°C
W
2)
At VIN > Vbb, the input current is not allowed to exceed ±5 mA.
Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a 150 Ω resistor in the GND connection
A resistor for the protection of the input is integrated.
4)
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
5)
HBM according to MIL-STD 883D, Methode 3015.7
6)
BSP 452 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
3)
Data Sheet
2
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Electrical Characteristics
Parameter and Conditions
Symbol
Values
typ
max
---
0.16
--
0.2
0.4
Ω
0.7
--
--
A
ton
toff
---
60
60
100
150
µs
dV /dton
--
2
4
V/µs
-dV/dtoff
--
2
4
V/µs
VIN
VIN(T+)
-3.0
--
---
Vbb
3.5
V
V
VIN(T-)
1.5
--
--
V
∆VIN(T)
IIN(off)
-10
0.5
--
-60
V
µA
IIN(on)
10
--
100
µA
RIN
1.5
2.8
3.5
kΩ
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
min
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1)
IL = 0.5 A, Vin = high
Tj = 25°C
Tj = 150°C
7)
Nominal load current (pin 4 to 1)
ISO Standard: VON = Vbb - VOUT = 0.5 V
TS = 85 °C
Turn-on time
to 90% VOUT
Turn-off time
to 10% VOUT
RL = 24 Ω
Slew rate on
10 to 30% VOUT, RL = 24 Ω
Slew rate off
70 to 40% VOUT, RL = 24 Ω
Input
Allowable input voltage range, (pin 3 to 2)
Input turn-on threshold voltage
Tj = -40...+150°C
Input turn-off threshold voltage
Tj = -40...+150°C
Input threshold hysteresis
Off state input current (pin 3)
VIN(off) = 1.2 V
Tj = -40...+150°C
On state input current (pin 3) VIN(on) = 3.0 V to Vbb
Tj = -40...+150°C
Input resistance
7)
RON
IL(ISO)
Unit
IL(ISO) is limited by current limitation, see IL(SC), next page
Data Sheet
3
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
min
Operating Parameters
Operating voltage8)
Undervoltage shutdown
Undervoltage restart
Tj =-40...+150°C
Tj =-40...+150°C
Tj =-40...+25°C
Tj =+150°C
Undervoltage restart of charge pumpe
see diagram page 77
Undervoltage hysteresis
∆Vbb(under) = Vbb(u rst) - Vbb(under)
Overvoltage shutdown
Tj =-40...+150°C
Overvoltage restart
Tj =-40...+150°C
Overvoltage hysteresis
Tj =-40...+150°C
Standby current (pin 4), Vin = low Tj =-40...+150°C
Operating current (pin 2), Vin = 5 V
leakage current (pin 1) Vin = low
Tj =-40...+25°C
Tj =150°C
Protection Functions
Current limit (pin 4 to 1)
Tj = 25°C
Vbb = 20V
Tj = -40...+150°C
Overvoltage protection Ibb=4mA Tj =-40...+150°C
Output clamp (ind. load switch off)
at VOUT=Vbb-VON(CL), Ibb = 4mA
Thermal overload trip temperature
Thermal hysteresis
9
Inductive load switch-off energy dissipation )
Tj Start = 150 °C, single pulse, IL = 0.5 A, Vbb = 12 V
(not tested, specified by design)
10
Reverse battery (pin 4 to 2) )
Vbb(on)
Vbb(under)
Vbb(u rst)
Values
typ
5.0
3.5
--
----
Vbb(ucp)
--
∆Vbb(under)
Unit
max
V
V
V
5.6
34
5
6.5
7.0
7
--
0.3
--
V
Vbb(over)
Vbb(o rst)
∆Vbb(over)
Ibb(off)
IGND
IL(off)
34
33
-----
--0.7
10
1
2
42
--25
1.6
5
7
V
V
V
µA
mA
µA
IL(SC)
1.5
--47
2
2.4
---
A
Vbb(AZ)
VON(CL)
0.7
0.7
41
41
V
V
Tjt
∆Tjt
EAS
150
---
-10
--
--0.5
°C
K
J
-Vbb
--
--
30
V
V
(not tested, specified by design)
8)
At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT ≈Vbb - 2 V
While demagnetizing load inductance, dissipated energy in PROFET is EAS= ∫ VON(CL) * iL(t) dt, approx.
2
V
EAS= 1/2 * L * IL * (V ON(CL)
)
ON(CL) - Vbb
10)
Requires 150 Ω resistor in GND connection. Reverse load current (through intrinsic drain-source diode) is normally limited by the
connected load.
9)
Data Sheet
4
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Max. allowable power dissipation
Ptot = f (TA,TSP)
Current limit characteristic
IL(SC) = f (Von); (Von see testcircuit)
Ptot [W]
IL(SC) [A]
18
2
16
1.8
1.6
14
1.4
12
TSP
150°C
1.2
25°C
1
-40°C
10
8
0.8
6
0.6
4
0.4
TA
2
0.2
0
0
0
25
50
75
100
125
150
0
2
4
6
8
10
12
TA, TSP[°C]
14
Von [V]
On state resistance (Vbb-pin to OUT-pin)
RON = f (Tj); Vbb = 13.5 V; IL = 0.5 A
Typ. input current
IIN = f (VIN); Vbb = 13,5 V
RON [Ω]
IIN [µA]
0.4
50
-40°C
45
0.35
40
+ 25°C
0.3
35
98%
0.25
+150°C
30
0.2
25
20
0.15
15
0.1
10
0.05
5
0
0
-50
-25
0
25
50
75
0
100 125 150
Tj [°C]
Data Book
Data Sheet
5
5
2
4
6
8
10
12
14
VIN [V]
20 08 96
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Typ. operating current
IGND = f (Tj); Vbb = 13,5 V; VIN = high
Typ. overload current
IL(lim) = f (t); Vbb = 13,5 V, no heatsink, Param.: Tjstart
IGND [mA]
IL(lim) [A]
0.8
1.4
0.7
1.2
0.6
1
0.5
0.8
+150°C
0.4
+25°C
-40°C
0.6
0.3
0.4
0.2
0.2
0.1
0
0
-50
-25
0
25
50
75
100
125
150
-50
0
50
100 150 200 250 300 350 400
Tj [°C]
t [ms]
Typ. standby current
Ibb(off) = f (Tj); Vbb = 13,5 V; VIN = low
Short circuit current
IL(SC) = f (Tj); Vbb = 13,5 V
Ibb(off) [µA]
IL(SC) [A]
8
1.4
7
1.2
6
1
5
0.8
4
0.6
3
0.4
2
0.2
1
0
-50
0
-50
-25
Data Sheet
0
25
50
75
100
125
150
-25
0
25
50
75
100
125
150
Tj [°C]
Tj [°C]
6
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Typ. input turn on voltage threshold
VIN(T+) = f (Tj);
Figure 6: Undervoltage restart of charge pumpe
VIN(T+) [V]
VON [V]
3
13V
2.5
2
V bb(over)
1.5
V
1
V
bb(o rs t)
bb(u rs t)
V
0.5
bb(u c p)
V bb(under)
0
-50
-25
0
25
50
75
100
125
150
Tj [°C]
Vbb [V]
charge pump starts at Vbb(ucp) about 7 V typ.
Test circuit
Typ. on-state resistance (Vbb-Pin to Out-Pin)
RON = f (Vbb,IL); IL=0.5A, Tj = 25°C
RON [mΩ]
300
250
200
150
100
50
0
0
5
10
15
20
25
Vbb [V]
Data Sheet
7
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Package Outlines
1.6 ±0.1
6.5 ±0.2
0.1 max
+0.2
acc. to
DIN 6784
1
2
3.5 ±0.2
4
0.5 min
B
7 ±0.3
3 ±0.1
15˚max
A
3
0.28 ±0.04
2.3
0.7 ±0.1
4.6
0.25
Figure 1
M
0.25
A
M
B
PG-SOT-223 (Plastic Dual Small Outline Package) (RoHS-compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Please specify the package needed (e.g. green package) when placing an order
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
8
Dimensions in mm
V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Revision History
Version
1.0
Data Sheet
Date
Changes
2007-05-25
Creation of the green datasheet.
First page :
Adding the green logo and the AEC qualified
Adding the bullet AEC qualified and the RoHS compliant features
Package page
Modification of the package to be green.
9
V1.0, 2007-05-25
Edition 2007-05-25
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 5/29/07.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.