INFINEON BSP452

miniPROFET® BSP 452
• High-side switch
• Short-circuit protection
• Input protection
• Overtemperature protection with hysteresis
• Overload protection
• Overvoltage protection
• Switching inductive load
• Clamp of negative output voltage with inductive loads
• Undervoltage shutdown
• Maximum current internally limited
• Electrostatic discharge (ESD) protection
1
• Reverse battery protection )
SOT-223
1
SOT-223
Package: SOT 223
Type
Ordering code
BSP 452
Q67000-S271
Application
• µC compatible power switch for 12 V DC grounded loads
• All types of resistive, inductive and capacitive loads
• Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,monolithically
integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
Blockdiagramm:
+ Vbb
Voltage
Overvoltage
Current
Gate
source
protection
limit
protection
V Logic
ESDDiode
Voltage
Charge pump
sensor
Level shifter
Rectifier
3
R
IN
4
Limit for
unclamped
ind. loads
OUT
Temperature
sensor
1
in
Load
ESD
Logic
GND
miniPROFET
2
Signal GND
1)
Load GND
With resistor RGND=150 Ω in GND connection, resistor in series with IN connections reverse load current
limited by connected load.
Data Book
1
20.08.96
miniPROFET® BSP 452
Pin
Symbol
Function
1
OUT
O
Output to the load
2
GND
-
Logic ground
3
IN
I
Input, activates the power switch in case of logical high signal
4
Vbb
+
Positive power supply voltage
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter
Supply voltage
Load current
self-limited
2)
Maximum input voltage
Maximum input current
Inductive load switch-off energy dissipation,
single pulse
IL = 0.5A , TA = 150°C
(not tested, specified by design)
3
Load dump protection ) VLoadDump=UA+Vs
RL= 24Ω
RI=2Ω , td=400ms, IN= low or high, UA=13,5V RL= 80Ω
(not tested, specified by design)
Electrostatic discharge capability (ESD)5)
PIN 3
PIN 1,2,4
Symbol
Vbb
IL
VIN
IIN
EAS
Operating temperature range
Storage temperature range
6
Max. power dissipation (DC) )
TA = 25 °C
Tj
Tstg
Ptot
chip - soldering point:
chip - ambient:6)
RthJS
RthJA
Thermal resistance
VLoad dump4)
VESD
Values
40
IL(SC)
-5.0...Vbb
±5
0.5
Unit
V
A
V
mA
J
60
80
V
±1
±2
-40 ...+150
-55 ...+150
1.8
kV
7
70
K/W
°C
W
2)
At VIN > Vbb, the input current is not allowed to exceed ±5 mA.
Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a 150 Ω resistor in the GND connection
A resistor for the protection of the input is integrated.
4)
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
5)
HBM according to MIL-STD 883D, Methode 3015.7
6)
BSP 452 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
3)
Data Book
2
20.08.96
miniPROFET® BSP 452
Electrical Characteristics
Parameter and Conditions
Symbol
Values
typ
max
---
0.16
--
0.2
0.4
Ω
0.7
--
--
A
ton
toff
---
60
60
100
150
µs
dV /dton
--
2
4
V/µs
-dV/dtoff
--
2
4
V/µs
VIN
VIN(T+)
-3.0
--
---
Vbb
3.5
V
V
VIN(T-)
1.5
--
--
V
∆VIN(T)
IIN(off)
-10
0.5
--
-60
V
µA
IIN(on)
10
--
100
µA
RIN
1.5
2.8
3.5
kΩ
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
min
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1)
IL = 0.5 A, Vin = high
Tj = 25°C
Tj = 150°C
7)
Nominal load current (pin 4 to 1)
ISO Standard: VON = Vbb - VOUT = 0.5 V
TS = 85 °C
Turn-on time
to 90% VOUT
Turn-off time
to 10% VOUT
RL = 24 Ω
Slew rate on
10 to 30% VOUT, RL = 24 Ω
Slew rate off
70 to 40% VOUT, RL = 24 Ω
Input
Allowable input voltage range, (pin 3 to 2)
Input turn-on threshold voltage
Tj = -40...+150°C
Input turn-off threshold voltage
Tj = -40...+150°C
Input threshold hysteresis
Off state input current (pin 3)
VIN(off) = 1.2 V
Tj = -40...+150°C
On state input current (pin 3) VIN(on) = 3.0 V to Vbb
Tj = -40...+150°C
Input resistance
7)
RON
IL(ISO)
Unit
IL(ISO) is limited by current limitation, see IL(SC), next page
Data Book
3
20.08.96
miniPROFET® BSP 452
Parameter and Conditions
Symbol
at Tj = 25 °C, Vbb = 13.5V unless otherwise specified
min
Operating Parameters
Operating voltage8)
Undervoltage shutdown
Undervoltage restart
Tj =-40...+150°C
Tj =-40...+150°C
Tj =-40...+25°C
Tj =+150°C
Undervoltage restart of charge pumpe
see diagram page 77
Undervoltage hysteresis
∆Vbb(under) = Vbb(u rst) - Vbb(under)
Overvoltage shutdown
Tj =-40...+150°C
Overvoltage restart
Tj =-40...+150°C
Overvoltage hysteresis
Tj =-40...+150°C
Standby current (pin 4), Vin = low Tj =-40...+150°C
Operating current (pin 2), Vin = 5 V
leakage current (pin 1) Vin = low
Tj =-40...+25°C
Tj =150°C
Protection Functions
Current limit (pin 4 to 1)
Tj = 25°C
Vbb = 20V
Tj = -40...+150°C
Overvoltage protection Ibb=4mA Tj =-40...+150°C
Output clamp (ind. load switch off)
at VOUT=Vbb-VON(CL), Ibb = 4mA
Thermal overload trip temperature
Thermal hysteresis
Inductive load switch-off energy dissipation9)
Tj Start = 150 °C, single pulse, IL = 0.5 A, Vbb = 12 V
(not tested, specified by design)
10
Reverse battery (pin 4 to 2) )
Vbb(on)
Vbb(under)
Vbb(u rst)
Values
typ
5.0
3.5
--
----
Vbb(ucp)
--
∆Vbb(under)
Unit
max
V
V
V
5.6
34
5
6.5
7.0
7
--
0.3
--
V
Vbb(over)
Vbb(o rst)
∆Vbb(over)
Ibb(off)
IGND
IL(off)
34
33
-----
--0.7
10
1
2
42
--25
1.6
5
7
V
V
V
µA
mA
µA
IL(SC)
1.5
--47
2
2.4
---
A
Vbb(AZ)
VON(CL)
0.7
0.7
41
41
Tjt
∆Tjt
EAS
150
---
-10
--
--0.5
°C
K
J
-Vbb
--
--
30
V
V
(not tested, specified by design)
8)
At supply voltage increase up to Vbb= 5.6 V typ without charge pump, VOUT ≈Vbb - 2 V
While demagnetizing load inductance, dissipated energy in PROFET is EAS= ∫ VON(CL) * iL(t) dt, approx.
2
V
EAS= 1/2 * L * IL * (V ON(CL)
)
ON(CL) - Vbb
10)
Requires 150 Ω resistor in GND connection. Reverse load current (through intrinsic drain-source diode) is normally limited by the
connected load.
9)
Data Book
4
20.08.96
V
V
miniPROFET® BSP 452
Max. allowable power dissipation
Ptot = f (TA,TSP)
Current limit characteristic
IL(SC) = f (Von); (Von see testcircuit)
Ptot [W]
IL(SC) [A]
18
2
16
1.8
1.6
14
1.4
12
TSP
150°C
1.2
25°C
1
-40°C
10
8
0.8
6
0.6
4
0.4
TA
2
0.2
0
0
0
25
50
75
100
125
150
0
2
4
6
8
10
12
TA, TSP[°C]
Von [V]
On state resistance (Vbb-pin to OUT-pin)
RON = f (Tj); Vbb = 13.5 V; IL = 0.5 A
Typ. input current
IIN = f (VIN); Vbb = 13,5 V
RON [Ω]
IIN [µA]
0.4
14
50
-40°C
45
0.35
40
+ 25°C
0.3
35
98%
0.25
+150°C
30
0.2
25
20
0.15
15
0.1
10
0.05
5
0
0
-50
-25
0
25
50
75
0
100 125 150
Tj [°C]
Data Book
5
2
4
6
8
10
12
14
VIN [V]
20.08.96
miniPROFET® BSP 452
Typ. operating current
IGND = f (Tj); Vbb = 13,5 V; VIN = high
Typ. overload current
IL(lim) = f (t); Vbb = 13,5 V, no heatsink, Param.: Tjstart
IGND [mA]
IL(lim) [A]
0.8
1.4
0.7
1.2
0.6
1
0.5
0.8
+150°C
0.4
+25°C
-40°C
0.6
0.3
0.4
0.2
0.2
0.1
0
0
-50
-25
0
25
50
75
100
125
150
-50
0
50
100 150 200 250 300 350 400
Tj [°C]
t [ms]
Typ. standby current
Ibb(off) = f (Tj); Vbb = 13,5 V; VIN = low
Short circuit current
IL(SC) = f (Tj); Vbb = 13,5 V
Ibb(off) [µA]
IL(SC) [A]
8
1.4
7
1.2
6
1
5
0.8
4
0.6
3
0.4
2
0.2
1
0
-50
0
-50
-25
0
25
50
75
100
125
150
Tj [°C]
Data Book
6
-25
0
25
50
75
100
125
150
Tj [°C]
20.08.96
miniPROFET® BSP 452
Typ. input turn on voltage threshold
VIN(T+) = f (Tj);
Figure 6: Undervoltage restart of charge pumpe
VIN(T+) [V]
VON [V]
3
13V
2.5
2
V bb(over)
1.5
V
1
V
bb(o rs t)
bb(u rs t)
V
0.5
bb(u c p)
V bb(under)
0
-50
-25
0
25
50
75
100
125
150
Vbb [V]
Tj [°C]
charge pump starts at Vbb(ucp) about 7 V typ.
Test circuit
Typ. on-state resistance (Vbb-Pin to Out-Pin)
RON = f (Vbb,IL); IL=0.5A, Tj = 25°C
RON [mΩ]
300
250
200
150
100
50
0
0
5
10
15
20
25
Vbb [V]
Data Book
7
20.08.96
mini PROFET® BSP 452
Package:
all dimensions in mm.
SOT 223/4:
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 München
© Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon
Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
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Due to technical requirements components may contain dangerous substances. For information on the types in question please
contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of
Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended
to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
Semiconductor Group
8
20.08.96