FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16891 Generic Copy Issue Date: 02-Apr-2013 TITLE: Wafer Capacity Expansion for Trench 3 MOSFETs PROPOSED FIRST SHIP DATE: 03-JUL-2013 AFFECTED CHANGE CATEGORY(S): ON Semiconductor Wafer Fab Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Melyssa Hutchins<[email protected]> SAMPLES: Contact your local ON Semiconductor Sales Office or Brian Goodburn<[email protected]> ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Donna Scheuch<[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: This Product Change Notice is to announce that ON Semiconductor is adding wafer fabrication capacity for their Trench 3 MOSFET technology silicon platforms. ON Semiconductor has qualified United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. Upon expiration of this FPCN, ON Semiconductor will supply parts utilizing the UMC fab. Device quality and reliability will continue to meet ON Semiconductors high standards. Issue Date: 03-Apr-2013 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16891 RELIABILITY DATA SUMMARY: Reliability Test Results: Test Name Prep Sample preparation and initial part testing HTRB High Temp Reverse Bias HTGB High Temp Gate Bias MSL 1 PC IOL MSL 1 PC - TC Intermittent Operating Life + PC Temperature Cycling + PC MSL 1 PC - AC MSL 1 PC HAST Test Conditions Test Results Read Point (rej/ ss) (rej/ ss) (rej/ ss) (rej/ ss) NTMFS4933 NTMFS4933 NTMFS4935 NTMFS4935 Initial Electrical done done done done 504 Hrs 0/77 0/77 0/77 0/77 504 Hrs 0/77 0/77 0/77 0/77 7500 Hrs 0/77 0/77 0/77 0/77 -55 °C to + 150°C 500 Cyc 0/77 0/77 0/77 0/77 Autoclave + PC 121°C/100% RH/15psig 96 Hrs 0/77 0/77 0/77 0/77 Highly Accelerated Stress Test Temp= +131°C, RH=85% , p = 18.8 psig, bias 96 Hrs 0/77 0/77 0/77 0/77 various TA = 150°C , Vdss = 80% of max rated TA = 150°C , Vgss = 100% of max rated Ta=+25°C, delta Tj=100°C On/of = 2 min ELECTRICAL CHARACTERISTIC SUMMARY: There is no change in electrical parametric performance. Characterization data is available upon request. CHANGED PART IDENTIFICATION: There will be no physical change to the Devices assembled with Die from the United Microelectronics Corp (UMC) wafer fabrication facility. There will be Wafer Lot traceability from the manufacturing Lot to determine the Die origin. Issue Date: 03-Apr-2013 Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16891 List of affected General Parts: NC4901NT1G NC4901NT3G NC4902NT1G NC4902NT3G NTMFS4923NET1G NTMFS4923NET3G NTMFS4925NET1G NTMFS4925NET3G NTMFS4925NT1G NTMFS4925NT3G NTMFS4926NET1G NTMFS4926NET3G NTMFS4926NT1G NTMFS4927NCT1G NTMFS4927NT1G NTMFS4927NT3G NTMFS4931NT1G NTMFS4931NT3G NTMFS4933NT1G NTMFS4935NBT1G NTMFS4935NBT3G NTMFS4935NCT1G NTMFS4935NCT3G NTMFS4935NT1G NTMFS4935NT3G NTMFS4936NCT1G NTMFS4936NT1G NTMFS4936NT3G NTMFS4937NT1G NTMFS4937NT3G NTMFS4939NT1G NTMFS4939NT3G NTMFS4955NT1G NTTFS4928NTAG NTTFS4928NTWG NTTFS4932NTAG NTTFS4932NTWG NTTFS4937NTAG NTTFS4937NTWG NTTFS4939NTAG NTTFSC4937NTAG Issue Date: 03-Apr-2013 Rev. 06-Jan-2010 Page 3 of 3