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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16891
Generic Copy
Issue Date: 02-Apr-2013
TITLE: Wafer Capacity Expansion for Trench 3 MOSFETs
PROPOSED FIRST SHIP DATE: 03-JUL-2013
AFFECTED CHANGE CATEGORY(S): ON Semiconductor Wafer Fab Site
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or
Melyssa Hutchins<[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office or
Brian Goodburn<[email protected]>
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or
Donna Scheuch<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
This Product Change Notice is to announce that ON Semiconductor is adding wafer fabrication
capacity for their Trench 3 MOSFET technology silicon platforms. ON Semiconductor has qualified
United Microelectronics Corp (UMC), a wafer fabrication facility located in Taiwan. Upon expiration
of this FPCN, ON Semiconductor will supply parts utilizing the UMC fab.
Device quality and
reliability will continue to meet ON Semiconductors high standards.
Issue Date: 03-Apr-2013
Rev. 06-Jan-2010
Page 1 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16891
RELIABILITY DATA SUMMARY:
Reliability Test Results:
Test
Name
Prep
Sample
preparation and
initial part testing
HTRB
High Temp
Reverse Bias
HTGB
High Temp Gate
Bias
MSL 1
PC IOL
MSL 1
PC - TC
Intermittent
Operating Life +
PC
Temperature
Cycling + PC
MSL 1
PC - AC
MSL 1
PC HAST
Test Conditions
Test
Results
Read Point
(rej/ ss)
(rej/ ss)
(rej/ ss)
(rej/ ss)
NTMFS4933
NTMFS4933
NTMFS4935
NTMFS4935
Initial
Electrical
done
done
done
done
504 Hrs
0/77
0/77
0/77
0/77
504 Hrs
0/77
0/77
0/77
0/77
7500 Hrs
0/77
0/77
0/77
0/77
-55 °C to + 150°C
500 Cyc
0/77
0/77
0/77
0/77
Autoclave + PC
121°C/100%
RH/15psig
96 Hrs
0/77
0/77
0/77
0/77
Highly
Accelerated
Stress Test
Temp= +131°C,
RH=85% , p = 18.8
psig, bias
96 Hrs
0/77
0/77
0/77
0/77
various
TA = 150°C , Vdss
= 80% of max
rated
TA = 150°C , Vgss
= 100% of max
rated
Ta=+25°C, delta
Tj=100°C
On/of = 2 min
ELECTRICAL CHARACTERISTIC SUMMARY:
There is no change in electrical parametric performance. Characterization data is available upon
request.
CHANGED PART IDENTIFICATION:
There will be no physical change to the Devices assembled with Die from the United
Microelectronics Corp (UMC) wafer fabrication facility. There will be Wafer Lot traceability from the
manufacturing Lot to determine the Die origin.
Issue Date: 03-Apr-2013
Rev. 06-Jan-2010
Page 2 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16891
List of affected General Parts:
NC4901NT1G
NC4901NT3G
NC4902NT1G
NC4902NT3G
NTMFS4923NET1G
NTMFS4923NET3G
NTMFS4925NET1G
NTMFS4925NET3G
NTMFS4925NT1G
NTMFS4925NT3G
NTMFS4926NET1G
NTMFS4926NET3G
NTMFS4926NT1G
NTMFS4927NCT1G
NTMFS4927NT1G
NTMFS4927NT3G
NTMFS4931NT1G
NTMFS4931NT3G
NTMFS4933NT1G
NTMFS4935NBT1G
NTMFS4935NBT3G
NTMFS4935NCT1G
NTMFS4935NCT3G
NTMFS4935NT1G
NTMFS4935NT3G
NTMFS4936NCT1G
NTMFS4936NT1G
NTMFS4936NT3G
NTMFS4937NT1G
NTMFS4937NT3G
NTMFS4939NT1G
NTMFS4939NT3G
NTMFS4955NT1G
NTTFS4928NTAG
NTTFS4928NTWG
NTTFS4932NTAG
NTTFS4932NTWG
NTTFS4937NTAG
NTTFS4937NTWG
NTTFS4939NTAG
NTTFSC4937NTAG
Issue Date: 03-Apr-2013
Rev. 06-Jan-2010
Page 3 of 3