INTEGRATED CIRCUITS DATA SHEET 74AHC157; 74AHCT157 Quad 2-input multiplexer Product specification File under Integrated Circuits, IC06 1999 Sep 24 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer FEATURES DESCRIPTION • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V The 74AHC/AHCT157 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard No. 7A. • Balanced propagation delays The 74AHC/AHCT157 are quad 2-input multiplexers which select 4 bits of data from two sources under the control of a common data select input (S). The enable input (E) is active LOW. When E is HIGH, all of the outputs (1Y to 4Y) are forced LOW regardless of all other input conditions. • All inputs have Schmitt-trigger actions • Multiple input enable for easy expansion • Ideal for memory chip select decoding • Inputs accept voltages higher than VCC Moving the data from two groups of registers to four common output buses is a common use of the ‘157’. The state of the common data select input (S) determines the particular register from which the data comes. It can also be used as a function generator. • For AHC only: operates with CMOS input levels • For AHCT only: operates with TTL input levels • Specified from −40 to +85 and +125 °C. The device is useful for implementing highly irregular logic by generating any four of the 16 different functions of two variables with one variable common. FUNCTION TABLE See note 1. INPUT OUTPUT E S nI0 nI1 nY H X X X L L L L X L L L H X H L H X L L L H X H H The ‘157’ is the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determine by the logic levels applied to S. The logic equations are: 1Y = E × (1I1 × S + 1I0 × S); 2Y = E × (2I1 × S + 2I0 × S); 3Y = E × (3I1 × S + 3I0 × S); 4Y = E × (4I1 × S + 4I0 × S). The ‘157’ is identical to the ‘158’ but has non-inverting (true) outputs. Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care. ORDERING INFORMATION OUTSIDE NORTH AMERICA PACKAGES NORTH AMERICA PINS PACKAGE MATERIAL CODE 74AHC157D 74AHC157D 16 SO plastic SOT109-1 74AHC157PW 74AHC157PW DH 16 TSSOP plastic SOT403-1 74AHCT157D 74AHCT157D 16 SO plastic SOT109-1 74AHCT157PW 74AHCT157PW DH 16 TSSOP plastic SOT403-1 1999 Sep 24 2 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns. TYPICAL SYMBOL PARAMETER CONDITIONS UNIT AHC tPHL/tPLH AHCT propagation delay nI0, nI1 to nY CL = 15 pF; VCC = 5 V 3.2 3.4 ns S to nY CL = 15 pF; VCC = 5 V 4.5 5.1 ns E to nY CL = 15 pF; VCC = 5 V 3.7 4.0 ns VI = VCC or GND 3.0 3.0 pF 4.0 4.0 pF 4 outputs switching via S 31 41 pF 1 output switching via I 13 16 pF CI input capacitance CO output capacitance CPD power dissipation capacitance CL = 50 pF; f = 1 MHz; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; ∑ (CL × VCC2 × fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. PINNING PIN SYMBOL DESCRIPTION 1 S common data select input 2, 5, 11 and 14 1I0 to 4I0 data inputs from source 0 3, 6, 10 and 13 1I1 to 4I1 data inputs from source 1 4, 7, 9 and 12 1Y to 4Y multiplexer outputs 8 GND ground (0 V) 15 E enable input (active LOW) 16 VCC DC supply voltage 1999 Sep 24 3 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer handbook, halfpage 16 VCC S 1 1I0 2 15 E 1I1 3 14 4I0 1Y 4 13 4I1 1 S 2I0 5 12 4Y 15 E 2I1 6 11 3I0 2Y 7 10 3I1 GND 8 9 3Y 157 handbook, halfpage 2 3 5 6 11 10 14 13 1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1 1Y 2Y 3Y 4Y 4 7 9 12 MNA481 MNA480 Fig.1 Pin configuration. handbook, halfpage 1 15 2 3 Fig.2 Logic symbol. handbook, halfpage G1 EN 1 MUX 4 1I0 3 1I1 5 2I0 6 2I1 1 5 7 6 11 9 10 14 11 3I0 10 3I1 14 4I0 13 4I1 SELECTOR MULTIPLEXER OUTPUTS 1Y 4 2Y 7 3Y 9 4Y 12 12 13 MNA482 Fig.3 IEC logic symbol. 1999 Sep 24 2 S E 1 15 Fig.4 Functional diagram. 4 MNA483 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer handbook, halfpage S E 1I1 1Y 1I0 2I1 2Y 2I0 3I1 3Y 3I0 4I1 4Y 4I0 MNA484 Fig.5 Logic diagram. 1999 Sep 24 5 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL PARAMETER 74AHCT CONDITIONS UNIT MIN. TYP. MAX. MIN. TYP. MAX. 4.5 5.0 5.5 V VCC DC supply voltage 2.0 5.0 5.5 VI input voltage 0 − 5.5 0 − 5.5 V VO output voltage 0 − VCC 0 − VCC V Tamb operating ambient temperature range −40 +25 +85 −40 +25 +85 °C −40 +25 +125 −40 +25 +125 °C tr,tf (∆t/∆f) input rise and fall rates see DC and AC characteristics per device VCC = 3.3 V ±0.3 V − − 100 − − − VCC = 5 V ±0.5 V − 20 − − 20 − ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC supply voltage −0.5 +7.0 V VI input voltage range −0.5 +7.0 V IIK DC input diode current VI < −0.5 V; note 1 − −20 mA VO < −0.5 V or VO > VCC + 0.5 V; note 1 IOK DC output diode current − ±20 mA IO DC output source or sink current −0.5 V < VO < VCC + 0.5 V − ±25 mA ICC DC VCC or GND current − ±75 mA Tstg storage temperature range PD power dissipation per package for temperature range: −40 to +125 °C; note 2 −65 +150 °C − 500 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K. For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K. 1999 Sep 24 6 mW Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer DC CHARACTERISTICS 74AHC family Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). Tamb (°C) TEST CONDITIONS SYMBOL OTHER VIH VIL VOH VOL −40 to +85 25 PARAMETER HIGH-level input voltage LOW-level input voltage VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 1.5 − − 1.5 − 1.5 − 3.0 2.1 − − 2.1 − 2.1 − 5.5 3.85 − − 3.85 − 3.85 − 2.0 − − 0.5 − 0.5 − 0.5 3.0 − − 0.9 − 0.9 − 0.9 5.5 − − 1.65 − 1.65 − 1.65 2.0 1.9 2.0 − 1.9 − 1.9 − 3.0 2.9 3.0 − 2.9 − 2.9 − 4.5 4.4 4.5 − 4.4 − 4.4 − V V HIGH-level output voltage; all outputs VI = VIH or VIL; IO = −50 µA V HIGH-level output voltage VI = VIH or VIL; IO = −4.0 mA 3.0 2.58 − − 2.48 − 2.40 − VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − LOW-level output voltage; all outputs VI = VIH or VIL; IO = 50 µA 2.0 − 0 0.1 − 0.1 − 0.1 3.0 − 0 0.1 − 0.1 − 0.1 4.5 − 0 0.1 − 0.1 − 0.1 LOW-level output voltage VI = VIH or VIL; IO = 4 mA 3.0 − − 0.36 − 0.44 − 0.55 VI = VIH or VIL; IO = 8 mA 4.5 − − 0.36 − 0.44 − 0.55 − 1.0 − 2.0 ±2.5 − ±10.0 µA V V V II input leakage current VI = VCC or GND 5.5 − − 0.1 IOZ 3-state output OFF current VI = VIH or VIL; 5.5 VO = VCC or GND − − ±0.25 − ICC quiescent supply current VI = VCC or GND; IO = 0 5.5 − − 4.0 − 40 − 80 µA CI input capacitance − − 3 10 − 10 − 10 pF 1999 Sep 24 7 µA Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer 74AHCT family Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 OTHER VCC (V) −40 to +125 UNIT MIN. TYP. MAX. MIN. MAX. MIN. MAX. VIH HIGH-level input voltage 4.5 to 5.5 2.0 − − 2.0 − 2.0 − V VIL LOW-level input voltage 4.5 to 5.5 − − 0.8 − 0.8 − 0.8 V VOH HIGH-level output voltage; all outputs VI = VIH or VIL; IO = −50 µA 4.5 4.4 4.5 − 4.4 − 4.4 − V HIGH-level output voltage VI = VIH or VIL; IO = −8.0 mA 4.5 3.94 − − 3.8 − 3.70 − V LOW-level output voltage; all outputs VI = VIH or VIL; IO = 50 µA 4.5 − 0 0.1 − 0.1 − 0.1 V LOW-level output voltage VI = VIH or VIL; IO = 8 mA 4.5 − − 0.36 − 0.44 − 0.55 V II input leakage current VI = VIH or VIL 5.5 − − 0.1 − 1.0 − 2.0 µA IOZ 3-state output OFF current VI = VIH or VIL; 5.5 VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 − − ±0.25 − ±2.5 − ±10.0 µA ICC quiescent supply current VI = VCC or GND; 5.5 IO = 0 − − 4.0 − 40 − 80 µA ∆ICC additional quiescent supply current per input pin VI = VCC − 2.1 V other inputs at VCC or GND; IO = 0 4.5 to 5.5 − − 1.35 − 1.5 − 1.5 mA CI input capacitance − 3 10 − 10 − 10 pF VOL 1999 Sep 24 − 8 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer AC CHARACTERISTICS Type 74AHC157 GND = 0 V; tr = tf ≤ 3.0 ns. TEST CONDITIONS SYMBOL Tamb (°C) PARAMETER −40 to +85 25 WAVEFORMS CL MIN. −40 to +125 UNIT TYP. MAX. MIN. MAX. MIN. MAX. propagation delay see Figs 7 and 8 15 pF − nI0 to nY; nI1 to nY 4.4 9.7 1.0 11.5 1.0 12.5 ns − 4.8 13.6 1.0 16.0 1.0 17.0 ns − 5.9 13.2 1.0 15.5 1.0 16.5 ns propagation delay see Figs 7 and 8 50 pF − nI0 to nY; nI1 to nY 6.3 13.2 1.0 15.0 1.0 16.5 ns − 6.8 17.1 1.0 19.5 1.0 21.5 ns − 8.4 16.7 1.0 19.0 1.0 21.0 ns propagation delay see Figs 7 and 8 15 pF − nI0 to nY; nI1 to nY 3.2 6.4 1.0 7.5 1.0 8.0 ns − 3.6 8.6 1.0 10.0 1.0 11.0 ns − 4.2 8.1 1.0 9.5 1.0 10.5 ns propagation delay see Figs 7 and 8 50 pF − nI0 to nY; nI1 to nY 4.6 8.4 1.0 9.5 1.0 10.5 ns − 5.2 10.6 1.0 12.0 1.0 13.5 ns − 6.0 10.1 1.0 11.5 1.0 13.0 ns VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH propagation delay S to nY propagation delay E to nY see Figs 6 and 8 propagation delay S to nY propagation delay E to nY see Figs 6 and 8 VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay S to nY propagation delay E to nY see Figs 6 and 8 propagation delay S to nY propagation delay E to nY see Figs 6 and 8 Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. 1999 Sep 24 9 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer Type 74AHCT157 GND = 0 V; tr = tf ≤ 3.0 ns. Tamb (°C) TEST CONDITIONS SYMBOL −40 to +85 25 PARAMETER WAVEFORMS CL MIN. −40 to +125 UNIT TYP. MAX. MIN. MAX. MIN. MAX. propagation delay see Figs 7 and 8 15 pF − nI0 to nY; nI1 to nY 3.2 6.4 1.0 7.5 1.0 8.0 ns − 3.7 8.6 1.0 10.0 1.0 11.0 ns − 4.7 8.1 1.0 9.5 1.0 10.5 ns propagation delay see Figs 7 and 8 50 pF − nI0 to nY; nI1 to nY 4.6 8.7 1.0 9.8 1.0 11.0 ns − 5.2 10.4 1.0 12.0 1.0 13.0 ns − 6.7 10.6 1.0 12.0 1.0 13.5 ns VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay S to nY propagation delay E to nY see Figs 6 and 8 propagation delay S to nY propagation delay E to nY see Figs 6 and 8 Note 1. Typical values at VCC = 5.0 V. AC WAVEFORMS handbook, halfpage VCC E INPUT nI0, nI1, S GND t PHL t PHL t PLH VOH VM(1) nY OUTPUT VOL VOL MNA485 VM(1) INPUT VM(1) OUTPUT FAMILY VI INPUT REQUIREMENTS AHC GND to VCC 50% VCC 50% VCC AHCT GND to 3.0 V 1.5 V MNA486 VM(1) INPUT VM(1) OUTPUT FAMILY VI INPUT REQUIREMENTS AHC GND to VCC 50% VCC 50% VCC AHCT GND to 3.0 V 1.5 V 50% VCC 50% VCC Fig.7 The enable input (E) to output (nY) propagation delays. 1999 Sep 24 t PLH VOH VM(1) nY OUTPUT VM(1) INPUT GND Fig.6 VI handbook, halfpage VM(1) 10 The data inputs (nI0, nI1) and common data select input (S) to output (nY) propagation delays. Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer S1 handbook, full pagewidth VCC PULSE GENERATOR VI 1000 Ω VO D.U.T. CL RT MNA219 TEST S1 tPLH/tPHL open tPLZ/tPZL VCC tPHZ/tPZH GND Fig.8 Load circuitry for switching times. 1999 Sep 24 11 VCC open GND Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1999 Sep 24 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 12 o 8 0o Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 1999 Sep 24 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04 MO-153 13 o Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 1999 Sep 24 14 Philips Semiconductors Product specification 74AHC157; 74AHCT157 Quad 2-input multiplexer Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Sep 24 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 68 © Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 245002/01/pp16 Date of release: 1999 Sep 24 Document order number: 9397 750 06359