PHILIPS TDA1549T

INTEGRATED CIRCUITS
DATA SHEET
TDA1549T
Stereo 4fs data input up-sampling
filter with bitstream continuous
calibration DAC (BCC-DAC1)
Objective specification
File under Integrated Circuits, IC01
Philips Semiconductors
August 1994
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
FEATURES
• Easy application
• Finite-duration impulse-response (FIR) filtering and
noise shaping incorporated
• 2nd-order noise shaper
• Wide dynamic range (true 18-bit resolution)
• Low total harmonic distortion
• No zero-crossing distortion
• Superior signal-to-noise ratio
filtering is required. The circuit accepts 18-bit four times
oversampled input data (4fs) in standard Japanese format.
Internal FIR filters remove the main spectral components
and increase the sampling rate to 96 times (96fs). A 2nd
order noise shaper converts this oversampled data to a
5-bit data stream. For low signal levels the converter
operates in the 1-bit bitstream mode with attendant high
differential linearity. Higher level signals are reproduced
using the dynamic continuous calibration technique,
thereby guaranteeing high linearity independent of
process variations, temperature effects and product
ageing.
• Bitstream continuous calibration conversion concept
• Inherently monotonic
• Voltage output (1.5 V RMS) at line drive level
• Single supply rail (3.8 to 5.5 V)
• Optimum output voltage level over the entire supply
range
• Small outline packaging (SO16)
• Wide operating temperature range (−30 to +85 °C)
• Standard Japanese input format
High-precision, low-noise amplifiers convert the
digital-to-analog current to an output voltage capable of
driving a line output. Externally connected capacitors
perform the required 1st order filtering so that no further
post-filtering is required.
• No analog post-filtering required
• Low power consumption
• Integrated operational amplifiers.
Internal reference circuitry ensures that the output voltage
is proportional to the supply voltage, thereby making
optimum use of the supply voltage over a wide range
(3.8 to 5.5 V). This unique configuration of bitstream and
continuous calibration techniques, together with a high
degree of analog and digital integration, results in a
digital-to-analog conversion system with true 18-bit
dynamic range, high linearity and simple low-cost
application.
GENERAL DESCRIPTION
The TDA1549T (BCC-DAC1) is the first of a new
generation of digital-to-analog converters featuring a
unique combination of bitstream and continuous
calibration concepts.
A system of digital filtering, high oversampling, 2nd order
noise shaping and continuous calibration digital-to-analog
conversion ensures that only simple 1st order analog
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA1549T
August 1994
SO16
DESCRIPTION
plastic small outline package; 16 leads; body width 7.5 mm
2
VERSION
SOT162−1
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDD
digital supply voltage
note 1
3.8
5.0
5.5
V
VDDA
analog supply voltage
note 1
3.8
5.0
5.5
V
VDDO
operational amplifier supply
voltage
note 1
3.8
5.0
5.5
V
IDDD
digital supply current
note 2
−
12
18
mA
IDDA
analog supply current
note 2
−
5.5
8
mA
IDDO
operational amplifier supply
current
note 2
−
6.5
9
mA
Ptot
total power dissipation
note 2
−
120
185
mW
note 3
−
50
−
mW
1.425
1.500
1.575
V
VFS(rms)
full-scale output voltage (RMS
value)
VDDD = VDDA = VDDO = 5 V
(THD + N)/S
total harmonic distortion plus
noise-to-signal ratio
at 0 dB signal level
at −60 dB signal level
−
−90
−83
dB
−
0.003
0.007
%
−
−48
−40
dB
−
0.40
1.0
%
at −60 dB signal level;
A-weighted
−
−50
−
dB
−
0.38
−
%
A-weighted;
at code 00000H
100
110
−
dB
S/N
signal-to-noise ratio at bipolar
zero
tcs
current setting time to ±1 LSB
−
0.1
−
µs
BR
input bit rate at data input
−
−
9.216
Mbits
fBCK
input clock frequency
−
−
9.216
MHz
TCFS
full-scale temperature
coefficient at analog outputs
(VOL and VOR)
−
±100 x 10−6
−
Tamb
operating ambient temperature
−30
−
+85
Notes
1. All VDD and ground pins must be connected externally to the same supply.
2. Measured with VDDD, VDDA and VDDO = 5 V at input data code 00000H.
3. Measured with VDDD, VDDA and VDDO = 3.8 V at input data code 00000H.
August 1994
3
°C
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
BLOCK DIAGRAM
Fig.1 Block diagram.
August 1994
4
TDA1549T
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
PINNING
SYMBOL
PIN
DESCRIPTION
WS
1
word select input
BCK
2
bit clock input
TEST
3
test input; pin should be connected to
ground
VOL
4
left channel output
FILTCL
5
capacitor for left channel 1st order
filter function; should be connected
between pins 4 and 5
FILTCR
6
capacitor for right channel 1st order
filter function; should be connected
between pins 6 and 7
VOR
7
right channel output
Vref
8
internal reference voltage for output
channels (1⁄2VDD)
VSSO
9
operational amplifier ground
VDDO
10
operational amplifier supply voltage
VDDA
11
analog supply voltage
VSSA
12
analog ground
n.c.
13
not connected (this pin should be left
open-circuit)
VSSD
14
digital ground
VDDD
15
digital supply voltage
DATA
16
data input
August 1994
Fig.2 Pin configuration.
5
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
FUNCTIONAL DESCRIPTION
Noise Shaper
General
The 2nd-order digital noise shaper converts the 18-bit data
at 96fs into a 5-bit bitstream, while shifting in-band
quantization noise to frequencies well above the audio
band. For low signal levels the noise shaper output is a
1-bit bitstream. This noise shaping technique used in
combination with a special data code and bitstream DAC
enables extremely high signal-to-noise ratios to be
achieved.
The TDA1549T CMOS digital-to-analog bitstream
continuous calibration converter incorporates internal
digital filtering which increases the oversampling rate of 4fs
input data to 96fs, and removes the spectral data
components around 4fs, 8fs, and 12fs. A 2nd order noise
shaper operating at 96fs outputs a 5-bit data bitstream to
the DACs. The filtering required for waveform smoothing
and out-of-band noise reduction is achieved by simple 1st
order analog post-filtering (see Fig.3).
Data encoder
The data encoder converts the 5-bit two's complement
output data from the noise shaper to a 32-bit thermometer
code.
The combination of noise shaping and bitstream
continuous calibration digital-to-analog conversion
enables high performance and extremely low noise to be
achieved.
In traditional unidirectional current converters, half of the
full-scale current flows to the output during small signal
reproduction. The thermal noise and substrate crosstalk
components present in this current severely restrict the
dynamic range which can be attained. In this BCC-DAC1
true low-noise performance is achieved using a special
data code and bidirectional current sources. The special
data code guarantees that only small values of current flow
to the output during small-signal passages while larger
positive or negative signals are generated using the
bidirectional current sources. For every change in the
18-bit input sample only one current source or current sink
is switched on. This intrinsically monotonic thermometer
code ensures the high differential linearity, zero crossover
distortion and superior signal-to-noise ratio associated
with bitstream conversion.
Input
The circuit accepts four times oversampled data in 18-bit
two's complement standard Japanese format with MSB
first. Left and right data channel words are time
multiplexed. The input format is illustrated in Fig.5. The bit
clock (BCK) operates at 192fs, i.e. 48 times the word select
(WS) frequency of 4fs.
Oversampling filter
The oversampling filter consists of:
• A 7th order half-band low-pass FIR filter which
increases the oversampling rate from 4 times to 8 times.
This removes the spectral components around 4fs and
12fs (see Fig.3).
• A linear interpolation section which increases the
oversampling rate to 16 times. This removes the
spectral components around 8fs.
• A sample-and-hold section which provides another
6 times oversampling to 96 times.
The zero-order hold characteristic of this sample-and-hold
section plus the 1st order analog filtering removes the
spectral components around 16fs.
Passband ripple is within 0.1 dB. Stopband attenuation is
>50 dB around multiples of the sampling frequency.
August 1994
6
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
Continuous calibration DAC
Operational amplifiers
The stereo 5-bit DAC uses the dynamic continuous
calibration technique. The DAC currents (16 sources and
16 sinks) of each channel are repeatedly generated from
one single reference current. This duplication is based on
an internal charge storage principle and has an inherently
high accuracy which is insensitive to ageing, temperature
and process variations.
High precision, low-noise amplifiers together with the
internal conversion resistors RCONV1 and RCONV2 convert
the DAC output current to a voltage capable of driving a
line output. This voltage is available at VOL and VOR
(1.5 V RMS typical).
Connecting external capacitors CEXT1 and CEXT2 between
FILTCL and VOL and FILTCR and VOR respectively,
provides the required 1st-order post-filtering for the left
and right channels (see Fig.1). The combinations of
RCONV1 with CEXT1 and RCONV2 with CEXT2 determine the
1st order fall-off frequencies.
Figure 4 shows one such current calibration source.
During calibration the cell is connected to the reference
current sink Iref via switch S2. The calibration transistor M1
is connected as an MOS diode via the switch S1 forcing its
gate potential to assume a value so that the total current of
the calibration cell is equal to the reference current. After
calibration the gate of M1 is allowed to float. The gate
capacitance Cgs retains its potential and the current
through the cell remains exactly equal to the reference
current. This current is now connected to the output. Each
digital-to-analog current source and each current sink is
calibrated precisely in this way.
Internal reference circuitry
Internal reference circuitry ensures that the output voltage
signal is proportional to the supply voltage, thereby
maintaining maximum dynamic range for supply voltages
from 3.8 to 5.5 V and making the circuit also suitable for
battery-powered applications.
Fig.3 Filter and noise shaper characteristics.
August 1994
7
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
(a) calibration.
(b) operation.
Fig.4 Calibration principle.
August 1994
8
TDA1549T
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDD
digital supply voltage
−
7.0
V
VDDA
analog supply voltage
−
7.0
V
VDDO
operational amplifier supply voltage
−
7.0
V
Txtal
maximum crystal temperature
−
+150
°C
Tstg
storage temperature
−65
+150
°C
Tamb
operating ambient temperature
−30
+85
°C
Ves
electrostatic handling
note 1
−2000
+2000
V
note 2
−200
+200
V
Notes
1. Human body model: C = 100 pF; R = 1500 Ω.
2. Machine model: C = 200 pF; L = 0.5 µH; R = 10 Ω.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient in free air
VALUE
UNIT
110
K/W
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
QUALITY SPECIFICATION
Quality specification in accordance with “SNW-FQ-611” is applicable.
August 1994
9
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
CHARACTERISTICS
VDDD = VDDA = VDDO = 5 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDDD
digital supply voltage
note 1
3.8
5.0
5.5
V
VDDA
analog supply voltage
note 1
3.8
5.0
5.5
V
VDDO
operational amplifier supply voltage
note 1
3.8
5.0
5.5
V
IDDD
digital supply current
note 2
−
12
18
mA
IDDA
analog supply current
note 2
−
5.5
8
mA
IDDO
operational amplifier supply current
note 2
−
6.5
9
mA
Ptot
total power dissipation
note 2
−
120
185
mW
note 3
−
50
−
mW
note 4
−
25
−
dB
RR
ripple rejection
Digital inputs; pins WS, BCK and DATA
0.7VDD −
VIH
HIGH level input voltage
VDD + 0.5 V
VIL
LOW level input voltage
−0.5
−
0.3VDD
V
|ILIH|
HIGH level input leakage current
VIH = VDDD = 5 V
−
−
10
µA
|ILIL|
LOW level input leakage current
VIH = VSSD = 0 V
−
−
10
µA
CI
input capacitance
−
−
10
pF
Timing (see Fig.6)
OPERATING FREQUENCY
fBCK
bit clock frequency
−
192fs
−
Hz
fWS
word select frequency
−
fBCK/48
−
Hz
INPUT FREQUENCY
fBCK
clock frequency
−
−
9.216
MHz
BR
bit rate data input
−
−
9.216
MHz
fWS
word select input frequency
−
−
192
kHz
tr
rise time
−
−
32
ns
tf
fall time
−
−
32
ns
Tcy
bit clock cycle time
108
−
−
ns
tH
bit clock HIGH time
22
−
−
ns
tL
bit clock LOW time
22
−
−
ns
tsu
data set-up time
32
−
−
ns
th
data hold time
2
−
−
ns
thWS
word select hold time
2
−
−
ns
tsuWS
word select set-up time
32
−
−
ns
Filter characteristics (see Fig.3)
PBR
pass-band ripple
< 20 kHz
−
0.1
−
dB
SBA
stop-band attenuation
note 5
50
−
−
dB
August 1994
10
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
SYMBOL
PARAMETER
CONDITIONS
TDA1549T
MIN.
TYP.
MAX.
UNIT
Reference values
Vref
reference voltage level
2.45
2.5
2.55
V
RCONV
current-to-voltage conversion
resistance
1.6
2.2
2.8
kΩ
Analog outputs; pins VOL and VOR
RES
resolution
−
−
18
bit
VFS(rms)
full-scale output voltage (RMS value)
1.425
1.5
1.575
V
VOFF
output voltage DC offset with respect
to reference voltage level Vref
−80
−65
−50
mV
TCFS
full-scale temperature coefficient
−
±100 x 10−6 −
at 0 dB input level;
note 6
−
−90
−
0.003
0.007
%
at −60 dB input level;
note 7
−
−48
−40
dB
−
0.40
1.0
%
at −60 dB input level;
A-weighted; note 8
−
−50
−
dB
−
0.32
−
%
at 0 dB input level;
20 Hz to 20 kHz;
note 9
−
−90
−83
dB
−
0.003
0.007
%
A-weighted;
at code 00000H
100
110
−
dB
(THD + N)/S total harmonic distortion plus
noise-to-signal ratio
−83
dB
S/N
signal-to-noise ratio at bipolar zero
tcs
current setting time to ±1 LSB
−
0.1
−
ms
αcs
channel separation
85
100
−
dB
|∆VO|
unbalance between outputs
−
0.2
0.3
dB
|ZO|
dynamic output impedance
−
10
−
W
RL
output load resistance
3
−
−
kΩ
CL
output load capacitance
−
−
200
pF
Notes
1. All VDD and VSS pins must be connected externally to the same supply.
2. Measured with VDDD = VDDA = VDDO = 5 V at input data code 00000H.
3. Measured with VDDD = VDDA = VDDO = 3.8 V at input data code 00000H.
4. Vripple = 1% of the supply voltage and fripple = 100 Hz. Ripple rejection RR to VDDA is dependent on the value of the
external capacitor (CEXT3 in Fig.1) connected to Vref. The value quoted here assumes CEXT3 = 1 µF.
5. Around multiples of 4fs.
6. Measured with a 1 kHz, 0 dB, 18-bit sine wave generated at a sampling rate of 192 kHz.
(THD + N)/S measured over a bandwidth from 20 Hz to 20 kHz.
7. Measured with a 1 kHz, −60 dB, 18-bit sine wave generated at a sampling rate of 192 kHz. (THD + N)/S measured
over a bandwidth from 20 Hz to 20 kHz.
8. Measured with a 1 kHz, −60 dB, 18-bit sine wave generated at a sampling rate of 192 kHz.
(THD + N)/S measured over a bandwidth from 20 Hz to 20 kHz and filtered with A-weighted characteristic.
9. Measured with a 0 dB, 18-bit sine wave from 20 Hz to 20 kHz generated at a sampling rate of 192 kHz. (THD + N)/S
measured over a bandwidth from 20 Hz to 20 kHz.
August 1994
11
Philips Semiconductors
Objective specification
August 1994
TDA1549T
Fig.6 Timing of input signals.
Fig.5 Format of input signals.
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
12
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
APPLICATION INFORMATION
A typical application diagram is illustrated in Fig.7. The left and right channel outputs can drive a line output directly.
(1) C = 100 nF (chip capacitor).
Fig.7 Application diagram.
August 1994
13
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
(1) Level = −60 dB.
(2) Level = 0 dB.
Fig.8 Total harmonic distortion plus noise-to-signal ratio as a function of signal frequency.
In Fig.8 measurements were taken with an 18-bit sine wave generated at a sample rate of 192 kHz. The (THD + N)/S
was measured over a bandwidth of 20 Hz to 20 kHz.
The graph was constructed from average measurement values of a small amount of engineering samples. No guarantee
for typical values is implied.
August 1994
14
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of signal level; (A-weighted).
In Fig.9 measurements were taken with an 18-bit sine wave generated at a sample rate of 192 kHz. The (THD + N)/S
was measured over a bandwidth of 20 Hz to 20 kHz and filtered with A-weighted characteristic.
The graph was constructed from average measurement values of a small amount of engineering samples. No guarantee
for typical values is implied.
August 1994
15
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
PACKAGE OUTLINE
10.5
10.1
handbook, full pagewidth
7.6
7.4
A
10.65
10.00
0.1 S
S
0.9 (4x)
0.4
9
16
2.45
2.25
1.1
1.0
0.3
0.1
2.65
2.35
0.32
0.23
pin 1
index
1
1.1
0.5
8
detail A
1.27
0.49
0.36
0 to 8
o
MBC233 - 1
0.25 M
(16x)
Dimensions in mm.
Fig.10 Plastic small outline package; 16 leads; body width 7.5 mm; (SO16; SOT162-1).
August 1994
16
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
TDA1549T
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
SOLDERING
Plastic small-outline packages
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1994
17
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC (BCC-DAC1)
NOTES
August 1994
18
TDA1549T
Philips Semiconductors
Objective specification
Stereo 4fs data input up-sampling filter with
bitstream continuous calibration DAC
NOTES
August 1994
19
TDA1549T
Philips Semiconductors – a worldwide company
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92156 SURESNES Cedex,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 63 23, 20043 HAMBURG,
Tel. (040)3296-0, Fax. (040)3296 213.
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
Hong Kong: PHILIPS HONG KONG Ltd., 6/F Philips Ind. Bldg.,
24-28 Kung Yip St., KWAI CHUNG, N.T.,
Tel. (852)424 5121, Fax. (852)428 6729
India: Philips INDIA Ltd, Shivsagar Estate, A Block ,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)640 000, Fax. (01)640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l.,
Piazza IV Novembre 3, 20124 MILANO,
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5028, Fax. (03)3740 0580
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB
Tel. (040)783749, Fax. (040)788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Philips Semiconductors
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546.
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)14163160/4163333, Fax. (01)14163174/4163366.
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494.
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382.
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (662)398-0141, Fax. (662)398-3319.
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0 212)279 2770, Fax. (0212)269 3094
United Kingdom: Philips Semiconductors LTD.,
276 Bath road, Hayes, MIDDLESEX UB3 5BX,
Tel. (081)73050000, Fax. (081)7548421
United States: 811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
SCD34
© Philips Electronics N.V. 1994
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