SOT782-1 plastic thermal enhanced very thin small outline package; no leads; 8 terminals 14 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code HVSON8 Package type industry code HVSON8 Package style descriptive code HVSON (thermal enhanced very thin small outline; no leads) Package body material type P (plastic) IEC package outline code --- JEDEC package outline code MO-229 JEITA package outline code --- Mounting method type S (surface mount) Issue date 28-8-2009 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 2.9 - 3 3.1 mm E package width 2.9 - 3 3.1 mm A seated height 0.8 - 0.85 1 mm A2 package height - - 0.82 - mm e nominal pitch - - 0.65 - mm n2 actual quantity of termination - - 8 - SOT782-1 NXP Semiconductors plastic thermal enhanced very thin small outline package; no leads; 8 terminals 2. Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 X B D A E A A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 4 C C A B C v w b y1 C y L K Eh 8 5 Dh 0 1 scale Dimensions Unit(1) mm 2 mm A A1 b max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25 c 0.2 D Dh E Eh e e1 K L 3.10 2.45 3.10 1.65 0.35 0.45 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 2.90 2.35 2.90 1.55 0.25 0.35 v 0.1 w y 0.05 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 maximum per side are not included. References Outline version IEC JEDEC JEITA SOT782-1 --- MO-229 --- sot782-1_po European projection Issue date 09-08-25 09-08-28 Fig. 1. Package outline HVSON8 (SOT782-1) SOT782-1 Package information All information provided in this document is subject to legal disclaimers. 14 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT782-1 NXP Semiconductors plastic thermal enhanced very thin small outline package; no leads; 8 terminals 3. Soldering Footprint information for reflow soldering of HVSON8 package SOT782-1 Gx P D C nSPx Hy SPy Gy SLy By Ay nSPy SPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy SPx SPy Gx Gy Hy nSPx nSPy 0.65 3.25 2.2 0.525 0.3 2.45 1.65 1.1 0.65 3.25 3.25 3.5 1 1 Issue date 12-02-09 12-02-28 sot782-1_fr Fig. 2. Reflow soldering footprint for HVSON8 (SOT782-1) SOT782-1 Package information All information provided in this document is subject to legal disclaimers. 14 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT782-1 NXP Semiconductors plastic thermal enhanced very thin small outline package; no leads; 8 terminals 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT782-1 Package information All information provided in this document is subject to legal disclaimers. 14 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT782-1 NXP Semiconductors plastic thermal enhanced very thin small outline package; no leads; 8 terminals 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 June 2016 SOT782-1 Package information All information provided in this document is subject to legal disclaimers. 14 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5