FN 14 DH X2Q SOT1458-1 plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 26 April 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code DHX2QFN Package type industry code DHX2QFN14 Package style descriptive code TQFP (thin quad flat package) Package style suffix code NA (not applicable) Package body material type P (plastic) Mounting method type S (surface mount) Issue date 10-11-2015 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 2.05 - 2.1 2.15 mm E package width 1.45 - 1.5 1.55 mm A seated height 0.3 - 0.32 0.33 mm e nominal pitch - - 0.4 - mm n2 actual quantity of termination - - 14 - SOT1458-1 NXP Semiconductors plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 2. Package outline DHX2QFN14: plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm SOT1458-1 X B D A A E A1 C detail X terminal 1 index area e1 C e terminal 1 index area v w b 2 6 C A B C y1 C y k 1 7 b 14 8 e Eh L 13 9 Dh L1 0 1 2 Dimensions (mm are the original dimensions) Unit(1) mm A(1) A1 max 0.33 0.05 nom 0.32 0.02 min 0.30 0.00 b c D(1) 3 mm scale Dh E(1) 0.25 2.15 0.85 1.55 0.20 0.10 2.10 0.80 1.50 0.15 2.05 0.75 1.45 Eh e 0.65 0.60 0.4 0.55 e1 k 1.60 0.2 L L1 0.30 0.50 0.25 0.45 0.20 0.40 v 0.1 w y y1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1458-1 --- --- --- sot1458-1_po European projection Issue date 15-11-10 16-04-12 Fig. 1. Package outline DHX2QFN14 (SOT1458-1) SOT1458-1 Package information All information provided in this document is subject to legal disclaimers. 26 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT1458-1 NXP Semiconductors plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 3. Soldering Footprint information for reflow soldering of SOT1458-1 package SOT1458-1 2.75 2.55 2.30 1.95 1.85 0.25 0.15 0.2 0.45 0.4 0.4 0.15 0.2 2.15 1.85 0.6 0.4 0.5 0.6 0.25 0.15 0.75 1.95 0.7 0.18 0.65 0.8 recommended stencil thickness: 0.1 mm occupied area solder resist solder lands solder paste Dimensions in mm Issue date 15-12-23 16-01-04 sot1458-1_fr Fig. 2. Reflow soldering footprint for DHX2QFN14 (SOT1458-1) SOT1458-1 Package information All information provided in this document is subject to legal disclaimers. 26 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT1458-1 NXP Semiconductors plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1458-1 Package information All information provided in this document is subject to legal disclaimers. 26 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT1458-1 NXP Semiconductors plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 26 April 2016 SOT1458-1 Package information All information provided in this document is subject to legal disclaimers. 26 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5