plastic thermal enhanced very thin quad flat package; no leads; 44 terminals

44
HV
QF
N
SOT1113-1
plastic thermal enhanced very thin quad flat package; no
leads; 44 terminals
10 June 2016
Package information
1. Package summary
Terminal position code
Q (quad)
Package type descriptive code
HVQFN44
Package type industry code
HVQFN44
Package style descriptive code
HVQFN (thermal enhanced very thin quad
flatpack; no leads)
Package body material type
P (plastic)
IEC package outline code
---
JEDEC package outline code
---
JEITA package outline code
---
Mounting method type
S (surface mount)
Issue date
23-7-2010
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
8.9
-
9
9.1
mm
E
package width
8.9
-
9
9.1
mm
A
seated height
0.8
-
0.85
1
mm
A2
package height
-
-
-
-
e
nominal pitch
-
-
0.65
-
n2
actual quantity of termination
-
-
44
-
mm
SOT1113-1
NXP Semiconductors
plastic thermal enhanced very thin quad flat package; no leads; 44 terminals
2. Package outline
HVQFN44: plastic thermal enhanced very thin quad flat package; no leads
44 terminals; body 9 x 9 x 0.85 mm
D
B
SOT1113-1
A
terminal 1
index area
E
A
A1
c
detail X
e1
e
L
# v
# w
b
12
22
11
C
C A B
C
y1 C
y
23
e
e2
Eh
1
33
terminal 1
index area
44
34
X
Dh
0
5
scale
Dimensions
Unit
mm
10 mm
A(1)
A1
b
max 1.00 0.05 0.35
nom 0.85 0.03 0.30
min 0.80 0.00 0.25
c
D(1)
Dh
E(1)
0.2
9.1
9.0
8.9
7.25
7.15
7.05
9.1
9.0
8.9
Eh
e
e1
7.25
7.15 0.65
7.05
6.5
e2
L
v
6.5
0.63
0.55
0.47
0.1
w
y
0.05 0.08
y1
01
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1113-1
---
---
---
sot1113-1_po
European
projection
Issue date
09-07-17
10-07-23
Fig. 1. Package outline HVQFN44 (SOT1113-1)
SOT1113-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT1113-1
NXP Semiconductors
plastic thermal enhanced very thin quad flat package; no leads; 44 terminals
3. Soldering
Footprint information for reflow soldering of HVQFN44 package
SOT1113-1
Hx
Gx
6.65
SPx
P
D
X
SPy
Hy
Gy
1.85 6.65
SLy SPy tot
By
Ay
nSPy
C
nSPx
3.2
SPx tot
SLx
Bx
solder land
0.6
Ax
0.3
solder paste deposit
detail X
solder land plus solder paste
nSPx
nSPy
3
3
occupied area
Dimensions in mm
P
Ax
0.65
9.95
Issue date
Ay
Bx
By
C
D
Gx
Gy
Hx
Hy
SLx
SLy
SPx tot
SPy tot
SPx
SPy
9.95
8.0
8.0
0.975
0.3
9.25
9.25
10.2
10.2
7.25
7.25
4.15
4.15
1.1
1.1
12-02-09
12-02-29
sot1113-1_fr
Fig. 2. Reflow soldering footprint for HVQFN44 (SOT1113-1)
SOT1113-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT1113-1
NXP Semiconductors
plastic thermal enhanced very thin quad flat package; no leads; 44 terminals
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT1113-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT1113-1
NXP Semiconductors
plastic thermal enhanced very thin quad flat package; no leads; 44 terminals
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 June 2016
SOT1113-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
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