plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die...

HT
SS
OP
32
SOT549-1
plastic thermal enhanced thin shrink small outline package;
32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed
die pad
8 February 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
HTSSOP32
Package type industry code
HTSSOP32
Package style descriptive code
HTSSOP (thermal enhanced thin shrink small
outline package)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
JEDEC package outline code
MO-153
Mounting method type
S (surface mount)
Issue date
2-11-2005
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
10.9
-
11
11.1
mm
E
package width
6
-
6.1
6.2
mm
A
seated height
[tbd]
-
1.1
1.1
mm
A2
package height
0.85
-
0.9
0.95
mm
n2
actual quantity of termination
-
-
32
-
SOT549-1
NXP Semiconductors
plastic thermal enhanced thin shrink small
outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm; exposed die pad
2. Package outline
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-1
E
D
A
X
c
y
HE
exposed die pad side
v M A
Dh
Z
32
17
A2
Eh
(A3)
A1
A
pin 1 index
θ
Lp
L
1
detail X
16
w M
bp
e
2.5
0
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
Dh
E(2)
Eh
e
HE
L
Lp
v
w
y
Z
θ
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30
0.19
0.20
0.09
11.1
10.9
5.1
4.9
6.2
6.0
3.6
3.4
0.65
8.3
7.9
1
0.75
0.50
0.2
0.1
0.1
0.78
0.48
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT549-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
05-11-02
MO-153
Fig. 1. Package outline HTSSOP32 (SOT549-1)
SOT549-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT549-1
NXP Semiconductors
plastic thermal enhanced thin shrink small
outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm; exposed die pad
3. Soldering
Footprint information for reflow soldering of HTSSOP32 package
SOT549-1
Hx
Gx
P2
0.125
nSPx
0.125
SPx
nSPy
Hy
Gy
SLy
SPy tot
By
SPy
Ay
SPx tot
C
D2
(4×)
P1
SLx
D1
(28×)
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder land plus solder paste
occupied area
nSPx
nSPy
4
3
Gy
Hx
Hy
6.500
11.400
8.850
DIMENSIONS in mm
P1
P2
Ay
By
C
D1
D2
SLx
SLy
0.650
0.700
8.600
6.200
1.200
0.400
0.500
5.200
3.800
Issue date
SPx tot SPy tot
5.100
3.700
SPx
1.000
SPy
Gx
0.800 10.600
09-12-28
12-01-26
sot549-1_fr
Fig. 2. Reflow soldering footprint for HTSSOP32 (SOT549-1)
SOT549-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT549-1
NXP Semiconductors
plastic thermal enhanced thin shrink small
outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm; exposed die pad
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT549-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT549-1
NXP Semiconductors
plastic thermal enhanced thin shrink small
outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm; exposed die pad
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2016
SOT549-1
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
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