Data Sheet, V3.1, January 2009 BGF113 Differential Microphone Filter and ESD Protection Small Signal Discretes Edition 2009-01-29 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF113 Differential Microphone Filter and ESD Protection BGF113 Revision History: 2009-01-29, V3.1 Previous Version: 2008-09-24, V3.0 Page Subjects (major changes since last revision) 6 Figure 2 and Figure 3 updated Data Sheet 3 V3.1, 2009-01-29 BGF113 Differential Microphone Filter and ESD Protection BGF113 BGF113 Features • Differential microphone filter • Integrated ESD protection up to 15 kV contact discharge according to IEC61000-4-2 • More than 40 dB stopband attenuation at 1 GHz • Wafer Level Package with SnAgCu solder balls • RoHS and WEEE compliant package • 400 µm solder ball pitch WLP-8-6-3D Description BGF113 is a differential microphone filter with low pass characteristic offering a high stop band attenuation up to 6 GHz. External pins are protected against 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of 1.16 mm x 1.16 mm and a total height of 0.60 mm. Type Package Marking Chip BGF113 WLP-8-6 GF113 N0728 A2 A3 R1 2 kΩ External IOs B1 R5 25 Ω B3 R3 2.2 kΩ D1 C3 1250pF C1 800pF B2 (GND) D2 C2 (GND) C2 800pF R2 1 kΩ Ω C4 1250pF C1 C3 R4 2.2 kΩ Figure 1 Data Sheet Schematic 4 V3.1, 2009-01-29 BGF113 Differential Microphone Filter and ESD Protection BGF113 Table 1 Maximum Ratings Parameter Symbol Voltage at all pins to GND Operating temperature range Storage temperature range Input power at all pins VP TOP TSTG PIN Values Unit Note / Test Condition Min. Typ. Max. 0 – 4 V – -40 – 85 °C – -65 – 150 °C – – – 60 mW @ +70 °C Electrostatic Discharge According to IEC61000-4-2 Contact discharge from pin B1 or C1 to GND VEXT -15 – 15 kV – Contact discharge between all other pins VINT -2 – 2 kV – Unit Note / Test Condition Table 2 Electrical Characteristics1) Parameter Resistor R1 Resistor R2 Resistors R3, R4 Resistors R5 Capacitors C1, C2 Capacitors C3, C4 Leakage currents ESD diodes to GND Insertion loss2) Pins B1 to B3 or C1 to C3 1) at TA = 25 °C Symbol Values Min. Typ. Max. R1 R2 R3,4 R5 C1,2 C3,4 IR 1900 2000 2100 Ω – 800 1000 1200 Ω – 1760 2200 2640 Ω – 20 25 30 Ω – 640 800 960 pF – 1000 1250 1500 pF – – 0.1 0.1 100 100 nA µA IL 20 V = ±3 V V = ±14 V f = 0.1 ... 6 GHz ZS = ZL = 50 Ω dB 2) Insertion loss (see also Figure 2) strongly depends upon source and load impedance and GND connection on the circuit board. For RF test purposes a 50 Ω environment is used. Data Sheet 5 V3.1, 2009-01-29 BGF113 Differential Microphone Filter and ESD Protection BGF113 BGF113 insertion loss 0 -10 -20 dB -30 -40 -50 -60 -70 -80 0.1 1 10 100 1000 10000 100 1000 10000 MHz Insertion loss B1 - B3 or C1 - C3, ZS = ZL = 50 Ω Figure 2 BGF113 cross talk 0 -10 -20 -30 -40 dB -50 -60 -70 -80 -90 -100 -110 -120 0.1 1 10 MHz Figure 3 Data Sheet Cross talk B1 - C3 or C1 - B3, ZS = ZL = 50 Ω 6 V3.1, 2009-01-29 BGF113 Differential Microphone Filter and ESD Protection BGF113 Package outlines Solder balls face up 0.6 ±0.05 B 0.4 C (0.18 ±0.05 ) A3 A2 B3 B2 B1 C3 C2 C1 2 x 0.4 = 0.8 8x 0.08 C 8x COPLANARITY ø0.05 M A B A 0.25 ±0.04 1) 1.16 ±0.05 2 x 0.4 = 0.8 (0.18 ±0.05 ) (0.18 ±0.05) 0.1 C 0.4 0.2 ±0.05 STANDOFF SEATING PLANE 3) Pin A1 2) Corner Index Area 1.16 ±0.05 (0.18 ±0.05) Solder balls face down 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-8-6-N-PO V01 Figure 4 WLP-8-6 (dimensions in mm) Tape and reel specification 0.25 Pin 1 Corner Index Area Figure 5 1.33 8 1.33 4 0.75 WLP-8-6-TP V01 Tape for WLP-8-6 (dimensions in mm) You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 7 V3.1, 2009-01-29