INTEGRATED CIRCUITS DATA SHEET TJA1010 Octal Low Side Driver (OLSD) Preliminary specification File under Integrated Circuits, IC18 1998 Feb 09 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 FEATURES GENERAL DESCRIPTION • Eight independent low side drivers The TJA1010 is an octal low side driver for relays in automotive applications. • Small outline/medium power package for surface mounting, SO28 (20 + 4 + 4) • Serial input control by writing to internal shift register • Overvoltage clamping for each driver • Each driver protected against short-circuited load • Undervoltage shutdown • All logic pins CMOS microcontroller compatible • Standby mode for minimum current consumption • Two status outputs indicating short-circuited load and open load respectively at any driver stage • Channel selective diagnostic information available by reading from internal shift register • Serial output allows cascading of several OLSDs • Outputs can be used in parallel • Two-stage thermal protection • Power-on reset. QUICK REFERENCE DATA SYMBOL VDD PARAMETER supply voltage CONDITIONS MIN. TYP. MAX. UNIT operating 5.5 − 25 V load dump − − 50 V 50 60 70 V Vo(clamp) drain-to-source clamp voltage Io = 20 mA Ro(on) on resistance Io = 0.2 A − − 3 Ω Io output current continuous at all outputs; Tamb = 85 °C − − 0.2 A ORDERING INFORMATION TYPE NUMBER TJA1010T 1998 Feb 09 PACKAGE NAME SO28 DESCRIPTION plastic small outline package; 28 leads; body width 7.5 mm 2 VERSION SOT136-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 24 STBY SUPPLY AND REFERENCE 25 0V TEMPERATURE PROTECTION TJA1010 UV power-on 1 master reset serial input 3 8-BIT LATCH parallel outputs data inputs CURRENT LIMITING 12 data outputs 14 15 8-BIT SHIFT REGISTER 17 clock 26 Vref parallel inputs 28 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 Philips Semiconductors VDD Octal Low Side Driver (OLSD) BLOCK DIAGRAM 1998 Feb 09 handbook, full pagewidth OUT7 OUT8 3 latch D serial clock parallel load serial input Q OL clock SC 1 & 2, 13 16, 27 1 & & GND1 to GND4 DELAY & & Tstat SCL 5 SI 6 to 9 20 to 23 11 SIE GND Fig.1 Block diagram. 19 STATOL 18 MBH994 STATSC Preliminary specification SO 4 TJA1010 10 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 PINNING SYMBOL PIN DESCRIPTION OUT1 1 output 1 GND1 2 ground 1 OUT2 3 output 2 SCL 4 serial clock input SI 5 serial input GND 6 ground GND 7 ground GND 8 GND SO handbook, halfpage OUT1 1 28 OUT8 GND1 2 27 GND4 ground OUT2 3 26 OUT7 9 ground SCL 4 25 STBY 10 serial output SI 5 24 VDD GND 6 23 GND SIE 11 serial input enable OUT3 12 output 3 GND2 13 ground 2 OUT4 14 output 4 OUT5 15 output 5 GND3 16 ground 3 SO 10 19 STATOL OUT6 17 output 6 SIE 11 18 STATSC STATSC 18 status output short-circuited load OUT3 12 17 OUT6 STATOL 19 status output open load GND2 13 16 GND3 GND 20 ground OUT4 14 15 OUT5 GND 21 ground GND 22 ground GND 23 ground GND 7 22 GND TJA1010 GND 8 21 GND GND 9 20 GND MBH990 VDD 24 supply voltage STBY 25 standby input OUT7 26 output 7 GND4 27 ground 4 OUT8 28 output 8 1998 Feb 09 Fig.2 Pin configuration. 4 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 An overvoltage clamp circuit at each driver causes the respective DMOS power FET to turn partially on, if its drain-to-source voltage level exceeds the clamp level [Vo(clamp)]. Consequently each driver can withstand voltage peaks caused by turning off inductive loads, such as relays coils without freewheel diodes. It should be noted that if outputs are used in parallel the amount of inductive energy which can be handled will not increase but will remain equal to that of a single output. FUNCTIONAL DESCRIPTION (see Figs 1, 3 and 4) This octal low side driver is intended to drive relays in automotive applications. It is optimized to withstand the wide temperature and supply voltage range that is typical for this application area. It consists of 8 protected outputs, including diagnostic functions, controlled by a serial interface. These outputs can be used in parallel without the need for additional components. Each driver is protected against a short-circuited load by current limiting. In the event of a short-circuited load at a driver stage, the current will be limited and the HIGH level of its drain-to-source voltage will force the comparator output to go HIGH. This in turn will set the STATSC pin to a LOW level. Serial control interface Serial control of the drivers is provided by an 8-bit shift register with parallel outputs and an 8-bit latch which controls the DMOS output stages. Using this configuration the number of pins needed for control of the eight drivers is reduced to three; Serial Input (SI), Serial CLock (SCL) and Serial Input Enable (SIE). When pin SIE is LOW, serial data at pin SI is shifted into the shift register at each HIGH-to-LOW transition at the SCL pin and serial data is shifted out at the Serial Output (SO) pin at a LOW-to-HIGH transition on the SCL pin. The last bit read in before a LOW-to-HIGH transition at the SIE pin is bit D8. A HIGH level at the SI pin causes a driver to switch-on. With a LOW-to-HIGH transition at the SIE pin, parallel output data in the shift register is written to the 8-bit latch, which controls the DMOS outputs. When SIE is HIGH, signals at pins SI, SCL and SO are disabled. For pin SO this results in a HIGH level because pin SO is an open-collector output. A two-stage temperature protection circuit is included to protect the device against overheating caused by high dissipation in the output transistors. When the temperature exceeds the overtemperature threshold level, it will switch-off those outputs with a short-circuit condition for the duration of the overtemperature condition. The status and diagnostic function will not be influenced. If the chip temperature still rises and exceeds the emergency threshold level, the emergency shutdown will become active and shut down all of the outputs until the temperature drops below the overtemperature threshold. The outputs are fully protected against short-circuit to battery conditions for the whole supply voltage range. Diagnostic interface The OLSD detects open loads and short-circuited loads at each driver stage by comparing its output voltages (Vo) to a reference voltage (Vref). To allow distinction between short-circuit and open load conditions, a short-circuit is detected for Vo > Vref in the on-state, while an open load is detected for Vo < Vref in the off-state of a driver stage. In both cases the corresponding status pin is set to a LOW level and the respective bit in the shift register is inverted on a HIGH-to-LOW transition of SIE. To protect the outputs against device threatening dissipation peaks, the overtemperature control is extended with local power dissipation sensors. If one or more outputs dissipate too much power all outputs with a short-circuit condition will be switched off for the duration of the local overtemperature condition. To protect the outputs against high dissipation during load dump, an overvoltage protection is included. This will switch-off those outputs with a short-circuit condition if the supply voltage exceeds the overvoltage threshold VDD(0 V) for the duration of the overvoltage condition. By writing a following byte into the shift register, its actual contents (the control byte eventually modified by errors) can be read out via pin SO. Comparing this byte with the original control byte previously written, faults can be localized and identified (e.g. open load at driver stage number 5). The diagnostic and status information will not change due to the interference of the overvoltage and overtemperature protections. To avoid a false LOW signal at the SC pin due to switching transients at the DMOS outputs, the SC pin is disabled for a sufficient delay time whenever a new input control byte has been written into the 8-bit latch with a LOW-to-HIGH transition of SIE. Protection of DMOS outputs Each driver contains a DMOS power FET. The drivers are protected against overvoltage, short-circuit and overtemperature conditions. 1998 Feb 09 5 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 A power-on reset ensures a defined off state for all drivers when the device is switched on i.e. by switching on the power supply or by activating the device via the STBY pin. Thus the STBY input can also be used as a reset pin. Other features When using several OLSDs, input control and diagnostics can be provided, as described above, without spending further microcontroller pins by cascading, i.e. connecting the SO pin of one OLSD to the SI pin of the following OLSD. A standby input (STBY) pin allows the off state current consumption in the OLSD to be minimized. Thus the OLSD can be connected permanently to a battery. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT continuous 0 25 V transient 0 50 V Vn input voltage at pins SI, SCL and SIE 0 5.5 V VI(STBY) input voltage at pin STBY 0 7 V Vo(STAT) output voltage at pins STATOL and STATSC 0 18 V Vo(SO) output voltage at pin SO 0 18 V Io output current internally limited Io(con) continuous output current Iclamp(rep) repetitive inductive turn-off current per Tj = 135 °C; note 1 output see Fig.5 Eclamp(rep) repetitive inductive turn-off energy per Tj = 95 °C; notes 1 and 2 output − 5 mJ Eclamp(nrep) non-repetitive inductive turn-off energy per output Tj = 95 °C; notes 1 and 3 − 60 mJ Tvj virtual junction temperature −40 +135 °C Tstg storage temperature −55 +150 °C Vesd electrostatic handling human body model − 3 kV machine model − 300 V Tj = 135 °C −0.2 +0.2 A Tj = 95 °C −0.3 +0.3 A A Notes 1. The amount of Eclamp per output can NOT be added if outputs are used in parallel. Thus, if two or more outputs are used in parallel it can handle the Eclamp of one output. 2. Defined for tclamp = 1 ms. 3. Defined for tclamp = 5 ms. 1998 Feb 09 6 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth (j-amb) from junction to ambient in free air note 1 55 K/W Rth (j-sp) from junction to soldering point of ground pins 6 to 9 and 20 to 23 note 2 17 K/W Notes 1. Printed on an FR-4 board with minimum foot print. 2. Power uniformly divided over all outputs. CHARACTERISTICS Tj = −40 to +135 °C; VDD = 11 to 13.5 V; Vbat(max) = VDD + 1.5 V. All voltages are defined with respect to ground. Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100% tested at Tamb = 25 °C; unless otherwise specified. SYMBOL IDD PARAMETER supply current CONDITIONS MIN. TYP. MAX. UNIT Io = 0 mA; VSTBY > 3 V − − 5 mA VSTBY < 1 V; VDD = 13 V; Tj = −40 to +85 °C − − 10 µA 2 − 4.3 V VDD(UV) undervoltage shutdown threshold VDD(0V) overvoltage protection threshold 25 − 33 V Vo(clamp) output clamp voltage Io = 20 mA 50 60 70 V ILO output leakage current (one output) off-state, Vo = 13 V; standby − 10 µA off-state, Vo = 13 V; operational 70 − 210 µA off-state, Vo = 1 V; operational 40 − 180 µA Io(lim) output current limit (one output) on-state 0.3 − 0.55 A Ro output resistance (one output) Io = 0.2 A; VDD = 13 V; Tj = 135 °C − − 3 Ω Io = 0.2 A; VDD = 13 V; Tj = 25°C − − 2.5 Ω Io = 0.1 A; VDD = 5.5 V; see Fig.6 − − 10 Ω Vref open load/short-circuit reference voltage note 1 1 − 1.9 V δIo/δt maximum rise and fall time of output current VDD = 13 V; RL = 100 Ω; note 2 − − 100 mA/µs VIH HIGH-level input voltage at pins SI, SCL, SIE and STBY 3 − − V Vi(hys) input voltage hysteresis at pins SI, SCL and SIE 0.2 − 1.2 V VIL LOW-level input voltage at pins SI, SCL and SIE − − 0.8 V VIL(STBY) LOW-level input voltage at pin STBY − − 1 V 1998 Feb 09 note 2 7 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) SYMBOL TJA1010 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Ii input current at pins SCL and SIE Vi = 3 V 20 − 60 µA ILI input leakage current at pins SI, SIE and SCl off-state; Vi = 3 V; Tj = 85 °C; VSTBY < 1 V − − 5 µA Ri(STBY) input resistance at pin STBY Vi = 1 V; Tj < 85 °C 40 − 150 kΩ Ii(STBY) input current at pin STBY Vi = 3 V 20 − 60 µA VSTAT(L) status LOW voltage ISTAT(L) = 1.6 mA − − 0.4 V VSO(L) serial output LOW voltage ISO = 1.6 mA − − 0.4 V ILO(SO) output leakage current at pin SO and status outputs off-state; Vo = 5 V; VSTBY < 1 V; Tj < 85 °C − − 10 µA fclk clock frequency − − 1 MHz tW(SCL) SCL positive pulse width 500 − − ns td(SIE-SCL) delay time from SIE HIGH to SCL LOW 100 − − ns tsu(SIE-SCL) set-up time from SIE LOW to SCL HIGH 250 − − ns td(SCL-SO) delay time from SCL HIGH to SO valid − − 250 ns tsu(SI-SCL) set-up time from SI to falling edge of SCL 150 − − ns th(SCL-SI) hold time from falling edge of SCL to SI 150 − − ns th(SCL-SIE) hold time from SCL LOW to SIE HIGH 250 − − ns tsu(STBY) STBY set-up time from STBY HIGH to SIE LOW 100 − − µs th(STBY) STBY hold time from SIE HIGH to STBY LOW 10 − − µs td(STAT) delay time for status pin enable 40 100 250 µs Tth(otc) threshold overtemperature control − 170 − °C Tth(ets) threshold emergency temperature shutdown − 190 − °C HIGH-to-LOW transition note 3 Notes 1. Open load is indicated for Vo < Vref in the off-state, short-circuited load is indicated for Vo > Vref in the on-state. 2. Guaranteed by design. 3. Delay caused by load excluded. 1998 Feb 09 8 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 handbook, full pagewidth SIE SCL shift register bit n (1) SI SO previous D8 B n+1 D1 new D2 new D3 new D4 new D5 new D6 new D7 new D8 new D1 old D2 old D3 old D4 old D5 old D6 old D7 old D8 old OUT1 corresponding to D1 old corresponding to D1 new OUT2 corresponding to D8 old corresponding to D8 new MBH992 (1) Inverting only when error (open load/short-circuit). Fig.3 Serial interface timing. 1998 Feb 09 9 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 andbook, full pagewidth 5V STBY th(STBY) tsu(STBY) 0V 70% 5V SIE 16% tw(SCL) td(SIE-SCL) 0V td(SCL-SIE) 70% 5V SCL 16% 70% don't care SI 0V th(SCL-SI) tsu(SI-SCL) 5V valid 16% 0V td(SCL-SO) 70% previous SO 5V valid 16% 0V MBH993 Fig.4 Input and output waveform timing. MGL379 0.16 clamp (A) 0.14 handbook, full pagewidth I 0.12 0.10 0.08 0.06 0.04 0.02 0 0 100 200 300 400 The curve is based on behaviour of relays; Siemens A4001-X40. Fig.5 Maximum current during inductive turn-off (Tamb = 85 °C). 1998 Feb 09 10 500 t (µs) 600 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 MGL380 12 handbook, full pagewidth Ron (Ω) 10 8 6 4 2 0 5 6 7 8 9 10 11 12 13 14 15 VDD (V) Fig.6 Maximum on-resistance as a function of supply voltage. D1 +5 V REGULATOR handbook, full pagewidth Vbat 100 nF C2 100 µF C1 VDD STBY OUT1 SIE OUT2 SCL OUT3 SI +5 V MICROCONTROLLER R1 R2 OUT4 TJA1010 OUT5 OUT6 R3 SO OUT7 STATSC OUT8 OL GND Fig.7 Application example. 1998 Feb 09 11 load load load load load load load load MBH991 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1998 Feb 09 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 12 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1998 Feb 09 13 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Feb 09 14 Philips Semiconductors Preliminary specification Octal Low Side Driver (OLSD) TJA1010 NOTES 1998 Feb 09 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 615102/00/01/pp16 Date of release: 1998 Feb 09 Document order number: 9397 750 01763