INTEGRATED CIRCUITS DATA SHEET TDA8725T Antenna signal processor Product specification File under Integrated Circuits, IC02 Philips Semiconductors 1995 Mar 21 Philips Semiconductors Product specification Antenna signal processor TDA8725T For PIP applications, the antenna input signal is split and fed to the main TV tuner and the PIP tuner. Good signal suppression between the two outputs enables good quality of the main picture when the PIP tuner is in use. FEATURES • 75 Ω antenna input stage • 75 Ω VCR RF input stage • 75 Ω VCR tuner output For VCR applications, the antenna input signal is split and then fed directly to the VCR tuner and the TV tuner after being combined with the VCR - RF signal. Good signal suppression between the two outputs enables good quality pictures when the TV and VCR tuners are both operating. Good signal suppression between the VCR input and the antenna input reduces the amount of unwanted signal on the antenna. • 75 Ω TV tuner output. GENERAL DESCRIPTION The TDA8725T has been designed to split and combine RF signals for Picture-In-Picture (PIP) and VCR applications. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pins 8 and 9) 4.75 5.0 5.25 V IP supply current (pins 8 and 9) − 65 − mA fi input frequency 40 − 860 MHz Gp power gain from antenna to VCR 3.5 5.0 6.5 dB from antenna to TV 4 5.5 7 dB − 0 − dB 6.5 9.0 10 dB at 40 MHz 137 140 − dBµV at 860 MHz 119 124 − dBµV at 40 MHz 121 124 − dBµV at 860 MHz 108 111 − dBµV 0 to 1 GHz 32 37 − dB 1 to 3 GHz 25 30 − dB from VCR F noise figure IP2 antenna linearity 2nd order intercept point IP3 antenna linearity 3rd order intercept point ssup signal suppression VCR input to antenna 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB at the antenna input − 2.5 4 at the outputs − 1.5 3 − −10 − VCR output to TV output TV output to VCR output VSWR Pi(max) 1995 Mar 21 voltage standing wave ratio maximum input power on antenna for 1 dB gain compression 2 dBm Philips Semiconductors Product specification Antenna signal processor TDA8725T ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8725T SO16 DESCRIPTION VERSION plastic small outline package; 16 leads; body width 3.9 mm BLOCK DIAGRAM (1) (2) (1) TV tuner or main tuner. (2) VCR tuner or PIP tuner. Fig.1 Block diagram. 1995 Mar 21 3 SOT109-1 Philips Semiconductors Product specification Antenna signal processor TDA8725T PINNING SYMBOL PIN DESCRIPTION TVOUT 1 output to TV tuner (VCR+TV) and to main tuner (PIP) AAGND1 2 antenna amplifier ground 1 AAGND2 3 antenna amplifier ground 2 AAGND3 4 antenna amplifier ground 3 ANTIN 5 antenna input n.c. 6 not connected AAGND4 7 antenna amplifier ground 4 VP1 8 power supply for the antenna amplifier VP2 9 power supply for the VCR output amplifier n.c. 10 not connected VCROUT 11 output to VCR and PIP tuner VCRGND1 12 VCR amplifier ground 1 VCRGND2 13 VCR amplifier ground 2 VCRIN 14 VCR RF input TVGND1 15 TV amplifier ground 1 TVGND2 16 TV amplifier ground 2 Fig.2 Pin configuration. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP supply voltage −0.3 6 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −10 +80 °C Tj junction temperature − +150 °C Ves electrostatic handling note 1 −2000 +2000 V note 2 −200 +200 V Notes 1. Human Body Model: UZW-BO/FQ-A302 (R = 1500 Ω, C = 100 pF). The IC withstands the ESD test class 2 (2000 V). 2. Machine Model: UZW-BO/FQ-B302 (R = 0 Ω, C = 200 pF). All pins withstand 200 V. THERMAL CHARACTERISTICS SYMBOL Rth j-a 1995 Mar 21 PARAMETER thermal resistance from junction to ambient in free air 4 VALUE UNIT 115 K/W Philips Semiconductors Product specification Antenna signal processor TDA8725T CHARACTERISTICS VP = 5 V; Tamb = 25 °C; measured in circuit of Fig.4; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. VP supply voltage (pins 8 and 9) 4.75 IP supply current (pins 8 and 9) fi input frequency Gp power gain TYP. MAX. UNIT 5.0 5.25 V 55 65 75 mA 40 − 860 MHz 40 to 860 MHz from antenna to VCR 3.5 5.0 6.5 dB from antenna to TV 4 5.5 7 dB from VCR − 0 − dB F noise figure 6.5 9.0 10 dB IP2 antenna linearity 2nd order intercept point at 40 MHz 137 140 − dBµV at 860 MHz 119 124 − dBµV antenna linearity 3rd order intercept point at 40 MHz 121 124 − dBµV at 860 MHz 108 111 − dBµV VCR input to antenna 0 to 1 GHz 32 37 − dB 1 to 3 GHz 25 30 − dB VCR output to TV output 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB IP3 ssup signal suppression 0 to 300 MHz 35 40 − dB 300 to 860 MHz 22 27 − dB at the antenna input − 2.5 4 at the outputs − 1.5 3 − −10 − TV output to VCR output VSWR Pi(max) 1995 Mar 21 voltage standing wave ratio maximum input power on antenna for 1 dB gain compression 5 dBm Philips Semiconductors Product specification Antenna signal processor TDA8725T Fig.3 Reflection coefficient (S11) antenna input. 1995 Mar 21 6 Philips Semiconductors Product specification Antenna signal processor TDA8725T APPLICATION INFORMATION Fig.4 Picture-in-picture (PIP) application. 1995 Mar 21 7 Philips Semiconductors Product specification Antenna signal processor TDA8725T Fig.5 VCR and TV application. 1995 Mar 21 8 Philips Semiconductors Product specification Antenna signal processor TDA8725T PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0098 0.39 0.014 0.0075 0.38 0.050 0.24 0.23 0.041 0.039 0.016 0.028 0.020 inches 0.0098 0.057 0.069 0.0039 0.049 0.16 0.15 0.01 0.01 0.028 0.004 0.012 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1995 Mar 21 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-23 9 o 8 0o Philips Semiconductors Product specification Antenna signal processor TDA8725T Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Plastic small-outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C. Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.) A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Mar 21 10