INTEGRATED CIRCUITS DATA SHEET TDA1552Q 2 x 22 W BTL stereo car radio power amplifier Product specification File under Integrated Circuits, IC01 July 1994 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q GENERAL DESCRIPTION The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for car radio applications. Features • Requires very few external components • Thermally protected • High output power • Reverse polarity safe • Low offset voltage at outputs • Capability to handle high energy on outputs (VP = 0 V) • Fixed gain • Protected against electrostatic discharge • Good ripple rejection • No switch-on/switch-off plop • Mute/stand-by switch • Low thermal resistance • Load dump protection • Flexible leads. • AC and DC short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply voltage range operating VP 6.0 14.4 18.0 V non-operating VP − − 30 V load dump protected VP − − 45 V IORM − − 4 A Total quiescent current Itot − 80 160 mA Stand-by current Isb − 0.1 100 µA Switch-on current Isw − − 60 µA Input impedance |ZI| 50 60 75 kΩ Junction temperature Tj − − 150 °C 20 22 − W RR 48 − − dB DC output offset voltage |∆VO| − − 150 mV Channel separation α 40 − − dB Channel unbalance |∆Gv| − − 1 dB Repetitive peak output current Stereo application Output power RL = 4 Ω; THD = 10% Po Supply voltage ripple rejection RS = 0 Ω f = 100 Hz to 10 kHz PACKAGE OUTLINE 13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23. July 1994 2 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q V P1 handbook, full pagewidth 3 input 1 1 mute switch V P2 10 Cm 4 VA output 1A 2 kΩ 18 kΩ power stage mute switch Cm 6 VA 60 kΩ output 1B 2 kΩ 18 kΩ power stage VP 11 stand-by switch 12 stand-by reference voltage VA mute/stand-by not connected 15 kΩ x1 mute switch TDA1552Q 15 kΩ V ref input 2 13 mute switch Cm 9 VA output 2B 2 kΩ 18 kΩ power stage mute switch Cm 7 VA 60 kΩ 2 kΩ Vref 18 kΩ 2 power stage 5 8 GND1 GND2 ground (signal) power ground (substrate) Fig.1 Block diagram. July 1994 3 MLB952 output 2A Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q PINNING 1 IP1 input 1 8 GND2 power ground 2 (substrate) 2 GND ground (signal) 9 OUT2B output 2B 3 VP1 positive supply voltage 1 10 VP2 positive supply voltage 2 4 OUT1A output 1A 11 M/SS mute/stand-by switch 5 GND1 power ground 1 (substrate) 12 n.c. not connected 6 OUT1B output 1B 13 IP2 input 2 7 OUT2A output 2A FUNCTIONAL DESCRIPTION The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications. The gain of each amplifier is fixed at 26 dB. A special feature of this device is: Mute/stand-by switch • low stand-by current (< 100 µA) • low mute/stand-by switching current (low cost supply switch) • mute facility. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage operating VP − 18 V non-operating VP − 30 V load dump protected during 50 ms; VP − 45 V Non-repetitive peak output current tr ≥ 2.5 ms IOSM − 6 A Repetitive peak output current IORM − 4 A Storage temperature range Tstg −55 +150 °C Junction temperature Tj − 150 °C AC and DC short-circuit-safe voltage VPSC − 18 V − 200 mJ VPR − 6 V Ptot − 60 W Energy handling capability at outputs VP = 0 V Reverse polarity Total power dissipation July 1994 see Fig.2 4 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q Fig.2 Power derating curve. July 1994 5 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Supply Supply voltage range note 1 VP 6.0 14.4 18.0 V Itot − 80 160 mA VO − 6.9 − V |∆VO| − − 150 mV Switch-on voltage level VON 8.5 − − V Mute condition Vmute 3.3 − 6.4 V VO − − 2 mV Total quiescent current DC output voltage note 2 DC output offset voltage Mute/stand-by switch Output signal in mute position VI = 1 V (max); f = 1 kHz DC output offset voltage |∆VO| − − 150 mV Vsb 0 − 2 V VII < 0.5 V Isb − − 100 µA 0.5 V ≤ VII < 2 V Isb − − 500 µA Isw − 25 60 µA IP − 5.5 − mA (between pins 4 to 6 and 7 to 9) Stand-by condition DC current in stand-by condition Switch-on current Supply current short-circuit to GND note 3 July 1994 6 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q AC CHARACTERISTICS VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Po 15 17 − W THD = 10% Po 20 22 − W THD = 0.5% Po − 12 − W THD = 10% Po − 17 - W Total harmonic distortion Po = 1 W THD − 0.1 − % Power bandwidth THD = 0.5% Bw - 20 to − Hz Hz Output power THD = 0.5% Output power at VP = 13.2 V Po = −1 dB w.r.t. 15 W 15000 Low frequency roll-off note 4 −1 dB fL − 25 − fH 20 − − kHz Gv 25 26 27 dB notes 5, 6 RR 42 − − dB ON notes 5, 7 RR 48 − − dB mute notes 5, 6, 7 RR 48 − − dB stand-by notes 5, 6, 7 RR 80 − − dB |Zi| 50 60 75 kΩ High frequency roll-off −1 dB Closed loop voltage gain Supply voltage ripple rejection Input impedance Noise output voltage (RMS value) ON RS = 0 Ω; note 8 Vno(rms) - 70 120 µV ON RS = 10 kΩ; note 8 Vno(rms) − 100 − µV mute notes 8, 9 Vno(rms) − 60 − µA Channel separation α 40 − − dB Channel unbalance |∆Gv| - − 1 dB Notes to the characteristics 1. The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V. 2. At 18 V < VP < 30 V the DC output voltage ≤ VP/2. 3. Conditions: a) V11 = 0 V b) short-circuit to GND c) switch V11 to MUTE or ON condition (rise time ≥ 10 µs). 4. Frequency response externally fixed. 5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V). 6. Frequency f = 100 Hz. 7. Frequency between 1 kHz and 10 kHz. 8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 9. Noise output voltage independent of RS (VI = 0 V). July 1994 7 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q APPLICATION INFORMATION handbook, full pagewidth mute/stand-by switch VP not connected 12 220 nF input 1 11 3 14.4 V 100 nF 10 2200 µF 1 4 R =4Ω L 60 kΩ 6 ground (signal) 2 TDA1552Q reference voltage 220 nF input 2 13 9 R =4Ω L 60 kΩ 7 5 8 MLB951 power ground (substrate) Fig.3 Application circuit diagram. July 1994 8 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 13 e1 Z e bp e2 m w M 0 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT141-6 July 1994 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification 2 x 22 W BTL stereo car radio power amplifier TDA1552Q The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1994 10