DISCRETE SEMICONDUCTORS DATA SHEET M3D252 BGD904; BGD904MI 860 MHz, 20 dB gain power doubler amplifier Product specification Supersedes data of 2000 Jan 10 2001 Nov 01 NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier FEATURES BGD904; BGD904MI PINNING - SOT115J • Excellent linearity DESCRIPTION PIN • Extremely low noise BGD904 • Excellent return loss properties 1 • Silicon nitride passivation input 2, 3 • Rugged construction 5 • Gold metallization ensures excellent reliability. BGD904MI 7, 8 9 output common common +VB +VB common common output input APPLICATIONS • CATV systems operating in the 40 to 900 MHz frequency range. 1 2 3 5 7 8 9 DESCRIPTION Hybrid amplifier modules in a SOT115J package operating with a voltage supply of 24 V (DC). Both modules are electrically identical, only the pinning is different. Side view msa319 Fig.1 Simplified outline. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Gp power gain f = 50 MHz 19.7 f = 900 MHz 20.5 21.5 dB Itot total current consumption (DC) VB = 24 V 405 435 mA 20.3 dB LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER MIN. MAX. UNIT VB supply voltage − 30 V Vi RF input voltage − 70 dBmV Tstg storage temperature −40 +100 °C Tmb operating mounting base temperature −20 +100 °C 2001 Nov 01 2 NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier BGD904; BGD904MI CHARACTERISTICS Bandwidth 40 to 900 MHz; VB = 24 V; Tmb = 35 °C; ZS = ZL = 75 Ω SYMBOL PARAMETER Gp power gain SL slope straight line FL flatness straight line S11 input return losses S22 output return losses CONDITIONS MIN. TYP. MAX. UNIT f = 50 MHz 19.7 20 20.3 dB f = 900 MHz 20.5 21 21.5 dB f = 40 to 900 MHz 0.4 0.9 1.4 dB f = 40 to 900 MHz − ±0.15 ±0.3 dB f = 40 to 80 MHz 21 25 − dB f = 80 to 160 MHz 22 30 − dB f = 160 to 320 MHz 21 29 − dB f = 320 to 550 MHz 18 24 − dB f = 550 to 650 MHz 17 22 − dB f = 650 to 750 MHz 16 21 − dB f = 750 to 900 MHz 16 21 − dB f = 40 to 80 MHz 25 29 − dB f = 80 to 160 MHz 23 28 − dB f = 160 to 320 MHz 20 25 − dB f = 320 to 550 MHz 20 24 − dB f = 550 to 650 MHz 19 24 − dB f = 650 to 750 MHz 18 24 − dB f = 750 to 900 MHz 17 23 − dB S21 phase response f = 50 MHz −45 − +45 deg CTB composite triple beat 49 chs flat; Vo = 47 dBmV; fm = 859.25 MHz − −68 −66.5 dB Xmod cross modulation 2001 Nov 01 77 chs flat; Vo = 44 dBmV; fm = 547.25 MHz − −69.5 −67.5 dB 110 chs flat; Vo = 44 dBmV; fm = 745.25 MHz − −63 −61.5 dB 129 chs flat; Vo = 44 dBmV; fm = 859.25 MHz − −59.5 −57.5 dB 110 chs; fm = 400 MHz; Vo = 49 dBmV at 550 MHz; note 1 − −63.5 −61.5 dB 129 chs; fm = 650 MHz; Vo = 49.5 dBmV at 860 MHz; note 2 − −58.5 −56 dB 49 chs flat; Vo = 47 dBmV; fm = 55.25 MHz − −66 −63 dB 77 chs flat; Vo = 44 dBmV; fm = 55.25 MHz − −68.5 −66 dB 110 chs flat; Vo = 44 dBmV; fm = 55.25 MHz − −65.5 −62.5 dB 129 chs flat; Vo = 44 dBmV; fm = 55.25 MHz − −64 −61 dB 110 chs; fm = 400 MHz; Vo = 49 dBmV at 550 MHz; note 1 − −61.5 −59 dB 129 chs; fm = 860 MHz; Vo = 49.5 dBmV at 860 MHz; note 2 − −60 −57 dB 3 NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier SYMBOL CSO d2 Vo F Itot PARAMETER composite second order distortion second order distortion output voltage noise figure total current consumption (DC) BGD904; BGD904MI CONDITIONS 49 chs flat; Vo = 47 dBmV; m = 860.5 MHz MIN. − TYP. −68 −62 UNIT dB 77 chs flat; Vo = 44 dBmV; fm = 548.5 MHz − −72 −67 dB 110 chs flat; Vo = 44 dBmV; fm = 746.5 MHz − −68 −62 dB 129 chs flat; Vo = 44 dBmV; fm = 860.5 MHz − −64 −58 dB 110 chs; fm = 250 MHz; Vo = 49 dBmV at 550 MHz; note 1 − −67 −62 dB 129 chs; fm = 250 MHz; Vo = 49.5 dBmV at 860 MHz; note 2 − −62 −58 dB note 3 − −82 −75 dB note 4 − −82 −76 dB note 5 − −83 −77 dB dim = −60 dB; note 6 64 65.5 − dBmV dim = −60 dB; note 7 65 67 − dBmV dim = −60 dB; note 8 67 69 − dBmV CTB compression = 1 dB; 129 chs flat; f = 859.25 MHz 48.5 49 − dBmV CSO compression = 1 dB; 129 chs flat; f = 860.5 MHz 50 52 − dBmV f = 50 MHz − 4 5 dB f = 550 MHz − 4.5 5.5 dB f = 750 MHz − 5.1 6.5 dB f = 900 MHz − 6.2 7.5 dB note 9 405 420 435 mA Notes 1. Tilt = 9 dB (50 to 550 MHz); tilt = 3.5 dB at −6 dB offset (550 to 750 MHz). 2. Tilt = 12.5 dB (50 to 860 MHz). 3. fp = 55.25 MHz; Vp = 44 dBmV; fq = 805.25 MHz; Vq = 44 dBmV; measured at fp + fq = 860.5 MHz. 4. fp = 55.25 MHz; Vp = 44 dBmV; fq = 691.25 MHz; Vq = 44 dBmV; measured at fp + fq = 746.5 MHz. 5. fp = 55.25 MHz; Vp = 44 dBmV; fq = 493.25 MHz; Vq = 44 dBmV; measured at fp + fq = 548.5 MHz. 6. Measured according to DIN45004B: fp = 851.25 MHz; Vp = Vo; fq = 858.25 MHz; Vq = Vo −6 dB; fr = 860.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 849.25 MHz. 7. Measured according to DIN45004B: fp = 740.25 MHz; Vp = Vo; fq = 747.25 MHz; Vq = Vo −6 dB; fr = 749.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 738.25 MHz. 8. Measured according to DIN45004B: fp = 540.25 MHz; Vp = Vo; fq = 547.25 MHz; Vq = Vo −6 dB; fr = 549.25 MHz; Vr = Vo −6 dB; measured at fp + fq − fr = 538.25 MHz. 9. The module normally operates at VB = 24 V, but is able to withstand supply transients up to 35 V. 2001 Nov 01 MAX. 4 NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier mda983 −50 BGD904; BGD904MI Vo (dBmV) CTB (dB) (2) (3) (4) (1) −60 (2) (3) (4) mda984 −50 52 Xmod (dB) Vo (dBmV) (1) (2) (3) (4) −60 48 (1) 52 48 (1) −70 44 −70 44 −80 40 −80 40 36 1000 800 f (MHz) −90 −90 200 0 400 600 0 200 400 600 36 800 1000 f (MHz) ZS = ZL = 75 Ω; VB = 24 V; 110 chs; tilt = 9 dB (50 to 550 MHz); tilt = 3.5 dB at −6 dB offset (550 to 750 MHz). ZS = ZL = 75 Ω; VB = 24 V; 110 chs; tilt = 9 dB (50 to 550 MHz); tilt = 3.5 dB at −6 dB offset (550 to 750 MHz). (1) Vo. (2) Typ. +3 σ. (1) Vo. (2) Typ. +3 σ. Fig.2 (3) Typ. (4) Typ. −3 σ. Composite triple beat as a function of frequency under tilted conditions. mda985 −50 CSO (dB) 52 Vo (dBmV) (1) −60 Fig.3 48 (2) (1) (2) (3) −70 44 (3) (4) (4) −80 −90 40 0 200 400 600 36 800 1000 f (MHz) ZS = ZL = 75 Ω; VB = 24 V; 110 chs; tilt = 9 dB (50 to 550 MHz); tilt = 3.5 dB at −6 dB offset (550 to 750 MHz). (1) Vo. (2) Typ. +3 σ. Fig.4 (3) Typ. (4) Typ. −3 σ. Composite second order distortion as a function of frequency under tilted conditions. 2001 Nov 01 5 (3) Typ. (4) Typ. −3 σ. Cross modulation as a function of frequency under tilted conditions. NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier mda931 −50 CTB (dB) BGD904; BGD904MI 52 Vo (dBmV) (1) mda932 −50 Xmod (dB) (1) (2) −60 48 (3) (4) 52 Vo (dBmV) (2) −60 (3) (4) 48 −70 44 −70 44 −80 40 −80 40 36 1000 800 f (MHz) −90 −90 200 0 400 600 0 200 400 ZS = ZL = 75 Ω; VB = 24 V; 129 chs; tilt = 12.5 dB; (50 to 860 MHz). (1) Vo. (3) Typ. (2) Typ. +3 σ. (4) Typ. −3 σ. ZS = ZL = 75 Ω; VB = 24 V; 129 chs; tilt = 12.5 dB; (50 to 860 MHz). (1) Vo. (3) Typ. (2) Typ. +3 σ. (4) Typ. −3 σ. Fig.5 Fig.6 Composite triple beat as a function of frequency under tilted conditions. mda933 −50 CSO (dB) (1) −60 52 Vo (dBmV) 48 (2) −70 44 (3) (4) −80 −90 40 0 200 400 600 36 800 1000 f (MHz) ZS = ZL = 75 Ω; VB = 24 V; 129 chs; tilt = 12.5 dB; (50 to 860 MHz). (1) Vo. (3) Typ. (2) Typ. +3 σ. (4) Typ. −3 σ. Fig.7 Composite second order distortion as a function of frequency under tilted conditions. 2001 Nov 01 6 600 36 800 1000 f (MHz) Cross modulation as a function of frequency under tilted conditions. NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier BGD904; BGD904MI mda937 −20 mda938 −20 CTB (dB) −30 CSO (dB) −40 −40 −50 −60 −60 (2) (1) (2) (3) −70 40 (1) (3) 45 50 Vo (dBmV) −80 40 55 45 50 Vo (dBmV) ZS = ZL = 75 Ω; VB = 24 V; 129 chs; fm = 859.25 MHz. (1) Typ. +3 σ. (2) Typ. (3) Typ. −3 σ. ZS = ZL = 75 Ω; VB = 24 V; 129 chs; fm = 860.5 MHz. (1) Typ. +3 σ. (2) Typ. (3) Typ. −3 σ. Fig.8 Fig.9 Composite triple beat as a function of output voltage. 2001 Nov 01 7 55 Composite second order distortion as a function of output voltage. NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier BGD904; BGD904MI PACKAGE OUTLINE Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J D E Z p A2 1 2 3 5 7 8 9 A L F S W c e b w M e1 d U2 q2 Q B y M B q1 x M B y M B p U1 q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.5 OUTLINE VERSION b c D max. d E max. e e1 F L min. p 4.15 2.04 0.51 0.25 27.2 13.75 2.54 5.08 12.7 8.8 3.85 2.54 0.38 REFERENCES IEC JEDEC JEITA q q1 q2 S U1 U2 W w x 2.4 38.1 25.4 10.2 4.2 44.75 8.2 6-32 0.25 0.7 44.25 7.8 UNC EUROPEAN PROJECTION y Z max. 0.1 3.8 ISSUE DATE 04-02-04 10-06-18 SOT115J 2001 Nov 01 Q max. 8 NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier BGD904; BGD904MI DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Limited warranty and liability ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe 2001 Nov 01 9 NXP Semiconductors Product specification 860 MHz, 20 dB gain power doubler amplifier BGD904; BGD904MI Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products ⎯ Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Terms and conditions of commercial sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 2001 Nov 01 10 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: [email protected] © NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613518/07/pp11 Date of release: 2001 Nov 01 Document order number: 9397 750 08858