PHILIPS SA57003

INTEGRATED CIRCUITS
SA57003
Five-output composite voltage regulator
Product data
Supersedes data of 2001 Aug 01
2003 Oct 13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
GENERAL DESCRIPTION
The SA57003 is a very low noise, low dropout voltage regulator with
three independent preset outputs from 2.0 V to 5.0 V and two
dependent outputs regulated from 2.82 V up to VOUT3. The output
current is the same for all three independent outputs 1, 2, 3 and
each output is capable of supplying 200 mA. The other two
dependent outputs 4, 5 are capable of supplying current up to
185 mA and 195 mA, respectively. Additionally, the SA57003 has an
independent ON/OFF input pin for each output to allow individual
subcircuits to be turned off when not needed, making the device
very useful for applications where power conservation is important.
The independent output voltage regulators VOUT1, VOUT2, and
VOUT3 have a common input voltage pin, VIN. The dependent output
voltage regulators, VOUT4 and VOUT5 have a common input voltage
pin, VOUT3.
The SA57003 regulator is offered in the TSSOP16 package.
FEATURES
APPLICATIONS
• VOUT tolerance ±3% over temperature range –40 °C to +85 °C
• ON/OFF input pin (logic-controlled shut-down) for each output
• Very low dropout voltage (0.15 V typical for Outputs 1, 2, 3 and
• Mobile phones
• Video cameras
• Portable battery-powered telemetry equipment.
0.25 V for Outputs 4, 5)
• No load quiescent current of 170 µA
• Maximum input voltage of 12 V
• Internal current and thermal limit
• Supply voltage rejection: 60 dB (typical) @ f = 1.0 kHz
• Internal trimmed voltage reference
SIMPLIFIED SYSTEM DIAGRAM
ON/OFF4
VOUT1
ON/OFF5
ON/OFF1
1
16
ON/OFF3
2
15
3
14
ON/OFF2
4
VOUT3
VOUT5
13
SA57003
VIN
5
12
6
11
7
10
8
CIN
10 µF
VOUT4
VOUT2
9
CNS1,2,3 (optional)
0.01 µF CERAMIC
COUT1,2,3,4,5
1.0 µF CERAMIC OR TANTALUM
SL01421
Figure 1. Simplified system diagram.
2003 Oct 13
2
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
SA57003DH
NAME
DESCRIPTION
VERSION
TEMPERATURE
RANGE
TSSOP16
plastic thin shrink small outline package; 16 leads
SOP001
–40 to +85 °C
Part number marking
PIN CONFIGURATION
Each device is marked with three or four lines of alphanumeric
codes. The first three letters of the top line designate the product.
The fourth letter, represented by “x”, is a date tracking code. The
remaining lines are for manufacturing codes.
The first three letters, ADM, designate the product. The fourth letter,
represented by ‘x’, is a date tracking code.
A D M C
VOUT1
1
16
BYPASS1
2
15
VOUT3
ON/OFF5
ON/OFF1
3
14
VOUT5
VIN
4
13
NC
ON/OFF3
5
12
VOUT4
BYPASS3
6
11
ON/OFF4
ON/OFF2
7
10
GND
BYPASS2
8
9
SA57003
VOUT2
SL01423
Figure 2. Pin configuration.
SL01422
2003 Oct 13
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Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
PIN DESCRIPTION
PIN
3, 5, 7, 11, 15
SYMBOL
ON/OFFn
DESCRIPTION
TERMINAL EQUIVALENT CIRCUIT
On/Off control pins for the output pins.
Connect to VIN for always-on outputs.
BIAS CIRCUIT
ON/OFFN
R
300 kΩ
R
400 kΩ
SL01424
2, 8, 6
NS1, NS2, NS3
Noise-decrease bypass capacitor pins.
TO VOUT
POWER
TRANSISTOR
DRIVE
CIRCUIT
R
NSn
Cns
R
SL01425
1, 9, 16
VOUT1, VOUT2,
VOUT3
Voltage output.
POWER
TRANSISTOR
VOUT1,2,3
TO
ERROR
AMP
POWER
TRANSISTOR
DRIVE
CIRCUIT
COUT1,2,3
SL01426
12, 14
VOUT4, VOUT5
Voltage output. These two outputs are powered
by the circuit that produced VOUT3, and will be
turned on an off with the VOUT3 output. They
may be independently switched ON or OFF
while VOUT3 is active.
VOUT3
POWER
TRANSISTOR
POWER
TRANSISTOR
DRIVE
CIRCUIT
VOUT 4,5
COUT 4,5
SL01427
4
VIN
Common input supply voltage for all regulators.
10
GND
Common circuit ground pin for all regulators.
13
N/C
No connection.
2003 Oct 13
4
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VIN
Input supply voltage
–0.3
12
V
Toper
Operating ambient temperature range
–20
+75
°C
Tj
Operating junction temperature
Tstg
Storage temperature
IOUT1,2,3
–
t.b.d.
°C
–40
+125
°C
Output currents; Note 1
–
200
mA
PD
Power dissipation
–
400
mW
Rth(j-a)
Thermal resistance from junction to ambient
–
t.b.d.
°C/W
VESD1
ESD damage threshold (Human Body Model); Note 2
–
2000
V
VESD2
ESD damage threshold (Machine Model); Note 3
–
200
V
Tsolder
Soldering temperature; Note 4
–
230
°C
NOTES:
1. Maximum current capability of one circuit (VOUT1,2,3).
2. Performed in accordance with Human Body Model (CZap = 100 pF, RZap = 1500 Ω).
3. Performed in accordance with Machine Model (CZap = 100 pF, RZap = 0 Ω).
4. 60 second maximum exposure for SMD Reflow temperatures above 183 °C.
2003 Oct 13
5
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
ELECTRICAL CHARACTERISTICS
VIN = 4.0 V, CIN = 10 µF, COUT1,2,3 = 4.7 µF with 1.0 Ω series resistor, COUT4,5 = 1.0 µF, CNS1,2,3 = 0.01 µF, Tamb = 25 °C, unless otherwise
noted. See Test Circuit 1 for test configuration for DC parameters.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IINS
Supply current (OFF)
VON/OFF1 = VON/OFF2 = VON/OFF3 = 0 V
–
0
3
µA
IIN1,2,3
Supply current 1,2,3
VON/OFF1 = 3.0 V;
VON/OFF2 = VON/OFF3 = VON/OFF4,5 = 0 V
–
170
350
µA
Iq(standby)
Standby quiescent current
ON/OFF1,2,3,4,5 = 0 V
IOUT1,2,3,4,5 = 0 mA
–
0
3.0
mA
IGND(operating)
Operating ground current 1
ON/OFF1 = 3.0 V, ON/OFF2,3,4,5 = 0 V;
ON/OFF2 = 3.0 V, ON/OFF1,3,4,5 = 0 V;
ON/OFF3 = 3.0 V, ON/OFF1,2,4,5 = 0 V
–
170
350
µA
ILIM
Output current limit (IOUT1,2,3)
200
240
–
mA
ON/OFF
VOFF
ON/OFF LOW threshold voltage
–
–
0.4
V
VON
ON/OFF HIGH threshold voltage
1.6
–
–
V
ION/OFF
Terminal current
VON/OFF – 1.6 V
–
–
10
mA
IOUT1 = 30 mA
2.42
2.50
2.58
V
IOUT1 = 30 mA; VIN = 2.3 V
1.1
1.5
0.2
V
IOUT1 = 0 – 100 mA
–
30
60
mV
VOUT1
VOUT1
Output voltage 1
2
VDMIN1
Dropout voltage
∆VLO1
Load regulation
∆VLI1
Line regulation
∆VO1/∆T
VOUT temperature coefficient
RR1
Ripple rejection
VN1
tDH1
IOUT1 = 30 mA; VIN = 4.0 – 8.0 V
–
10
20
mV
–20 ≤ Tamb ≤ 75 °C; IOUT1 = 30 mA
–
±100
–
µV/°C
f = 120 Hz; IOUT1 = 30 mA;
VRIPPLE = 1.0 VP-P
50
60
–
dB
Output noise voltage
f = 10 Hz – 10 kHz; IOUT1 = 30 mA;
CNS1 = 0.01 µF
–
–
–
µVRMS
Output delay time
IOUT1 = 30 mA; VON/OFF1 = 0 → 4 V
–
0.04
0.8
ms
Output voltage 2
IOUT2 = 30 mA
2.42
2.80
2.88
V
IOUT2 = 30 mA; VIN = 2.3 V
1.1
1.5
0.2
V
IOUT2 = 0 – 100 mA
–
30
60
mV
VOUT2
VOUT2
2
VDMIN2
Dropout voltage
∆VLO2
Load regulation
∆VLI2
Line regulation
∆VO2/∆T
VOUT temperature coefficient
RR2
Ripple rejection
VN2
tDH2
IOUT2 = 30 mA; VIN = 4.0 – 8.0 V
–
10
20
mV
–20 ≤ Tamb ≤ 75 °C; IOUT2 = 30 mA
–
±100
–
µV/°C
f = 120 Hz; IOUT2 = 30 mA;
VRIPPLE = 1.0 VP-P
50
60
–
dB
Output noise voltage
f = 10 Hz – 10 kHz; IOUT2 = 30 mA;
CNS2 = 0.01 µF
–
–
–
µVRMS
Output delay time
IOUT2 = 30 mA; VON/OFF2 = 0 → 4 V
–
0.04
0.8
ms
Output voltage 3
IOUT3 = 80 mA
2.92
3.00
3.08
V
IOUT3 = 80 mA; VIN = 2.3 V
–
–
0.3
V
IOUT3 = 0 – 100 mA
–
–
60
mV
VOUT3
VOUT3
2
VDMIN3
Dropout voltage
∆VLO3
Load regulation
∆VLI3
Line regulation
∆VO3/∆T
VOUT temperature coefficient
RR3
Ripple rejection
VN3
tDH3
2003 Oct 13
IOUT3 = 30 mA; VIN = 4.0 – 8.0 V
–
–
20
mV
–20 ≤ Tamb ≤ 75 °C; IOUT3 = 30 mA
–
±100
–
µV/°C
f = 120 Hz; IOUT3 = 30 mA;
VRIPPLE = 1.0 VP-P
50
60
–
dB
Output noise voltage
f = 10 Hz – 10 kHz; IOUT3 = 30 mA;
CNS3 = 0.01 µF
–
30
60
µVRMS
Output delay time
IOUT3 = 30 mA; VON/OFF3 = 0 → 4 V
–
0.04
0.8
ms
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Philips Semiconductors
Product data
Five-output composite voltage regulator
SYMBOL
PARAMETER
SA57003
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VOUT4
VOUT4
Output voltage 4
IOUT3 = IOUT4 = 20 mA; IOUT5 = 40 mA
2.82
–
VOUT3
V
IO4
Maximum output current
VOUT4 = 2.72 V; IOUT3 = IOUT5 = 0 mA
50
–
185
mA
tDH4
Output delay time
IOUT4 = 20 mA; COUT4 = 1 µF;
VON/OFF4 = 0 → 4.0 V
–
0.02
0.1
ms
IGND4
Ground current
IOUT4 = 20 mA; VOUT3 = 3.0 V
–
0.5
0.8
mA
–
VOUT3
V
VOUT5
VOUT5
Output voltage 4
IOUT3 = IOUT4 = 20 mA; IOUT5 = 40 mA
2.82
IO5
Maximum output current
VOUT5 = 2.72 V; IOUT3 = IOUT4 = 0 mA
80
–
195
mA
tDH5
Output delay time
IOUT5 = 40 mA; COUT4 = 1 µF;
VON/OFF5 = 0 → 4.0 V
–
0.02
0.1
ms
IGND5
Ground current
IOUT5 = 40 mA; VOUT3 = 3.0 V
–
0.5
0.8
mA
NOTES:
1. Individual operating ground currents for regulators 1, 2, and 3 with corresponding ON/OFF pins (ON/OFF1,2,3) connected to 3.0 V and
outputs open (IOUT1,2,3 = 0 mA). Regulators 1, 2, and 3 are the same.
2. Dropout Voltage is a measure of the minimum input/output differential voltage at the specified output current.
VOUT3
VOUT4,5
GROUND CURRENT
R
R
R
IGND4,5
ON/OFF4,5
SL01434
Figure 3. Ground current for VOUT4 and VOUT5.
2003 Oct 13
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Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
TYPICAL PERFORMANCE CURVES
15
Typical for VOUT1,2,3
Tamb = 25 °C
VIN – V OUT, DROPOUT VOLTAGE (mV)
VIN – V OUT, DROPOUT VOLTAGE (mV)
250
200
150
100
50
0
0
25
50
75
100
125
IOUT = 30 mA
Typical for VOUT1,2,3
Tamb = 25 °C
ON/OFF1,2,3 = VIN = VOUT + 1.0 V
10
5.0
VOUT
–5.0
4.0
150
6.0
IOUT, OUTPUT CURRENT (mA)
8.0
10
12
VIN, INPUT VOLTAGE (V)
SL01428
SL01429
Figure 5. Normalized line regulation versus input voltage.
20
+1.0
10
VOUT, OUTPUT VOLTAGE (V)
VOUT1,2,3, OUTPUT VOLTAGE CHANGE (mV)
Figure 4. Dropout voltage versus output current.
VOUT
–10
–20
Typical for VOUT1,2,3
Tamb = 25 °C
VIN = VOUT + 1.0 V
ON/OFF1,2,3 = VIN
COUT = 47 µF
–30
–40
VOUT
–1.0
–2.0
Typical for VOUT1,2,3
VIN = VOUT + 1.0 V
ON/OFF1,2,3 = VIN
–3.0
0
20
40
60
80
100
120
140
0
IOUT, OUTPUT VOLTAGE (mV)
25
50
75
100
125
150
SL01430
SL01431
Figure 6. Normalized load regulation.
Figure 7. Thermal shutdown.
1000
+1.0
100
VOUT
ESR, ESR @ 100 kHz (Ω )
VOUT, OUTPUT VOLTAGE (V)
UNSTABLE REGION
–1.0
–2.0
10
STABLE OPERATING REGION
1.0
UNMEASURABLE REGION
0.01
–3.0
0
50
100
Tamb = 25 °C
0 ≤ VIN ≤ 12 V
COUT = 4.7 µF
0.1
Typical for VOUT1,2,3
VIN = VOUT + 1.0 V
ON/OFF1,2,3 = VIN
150
200
250
0.01
300
IOUT, OUTPUT CURRENT (mA)
0.1
1.0
10
100
IOUT, OUTPUT CURRENT (mA)
SL01432
SL01433
Figure 8. Typical output current limit.
2003 Oct 13
175
Tj, JUNCTION TEMPERATURE (°C)
Figure 9. ESR stability versus output current.
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Philips Semiconductors
Product data
Five-output composite voltage regulator
proportional to that current delivered to the output. This small
proportional current is used to generate a second feedback voltage
fed to the second feedback amplifier to fold back the output current
to a safe level in the event of an output short. Both feedback
amplifiers act on the same control node to control the PNP pass
transistor. Dual path output monitoring in this manner maintains a
constant output voltage while adding the feature enhancement of
output current limiting.
TECHNICAL DESCRIPTION
The SA57003 is a monolithic composite five-output regulator
developed to power the RF sections of mobile telephones. It
contains three independent full-featured voltage regulator circuits.
Each regulator circuit incorporates individual feedback error
amplifiers for output voltage regulation, output On/Off Control, Noise
Bypass Pin, Current Limiting, and Thermal Shutdown. The Noise
Bypass Pins provide the option of externally bypassing an internal
voltage reference node for enhanced noise reduction.
Operating stability of the SA57003 linear regulator is determined by
start-up delay, transient response to loading, and stability of the
feedback loop. The SA57003 has a fast transient loop response. No
built-in delay is incorporated.
The output of one of the three regulator circuits, in addition to being
pinned out, feeds two dependent switched output regulators. Both
switched output regulators incorporate individual feedback error
amplifiers for output voltage regulation but have no thermal
shutdown or current limiting feature.
Capacitors play an important part in compensating the regulator’s
output. A 4.7 µF aluminum electrolytic capacitor is recommended for
most applications. This consideration is made primarily on a basis of
minimal cost with good performance.
The three full-featured regulators have typical dropout voltages of
200 mV at 30 mA of output current. The two switched outputs have
a minimum current capacity of 80 mA each.
A tantalum capacitor could also be used. Tantalum capacitors have
the advantage of being smaller size than electrolytic capacitors of
the same value of capacitance. Tantalum capacitors are also not
prone to dry-out. The electrolyte used in electrolytic capacitors tends
to dry-out with time causing degradation in capacitance value. Avoid
using low ESR film or ceramic capacitors to avoid instability problems.
Each independent regulator in the SA57003 is a series pass
regulator incorporating a bandgap reference, two feedback
amplifiers, thermal shutdown circuit, and output current limiting.
See the device block diagram shown in Figure 10 and the equivalent
circuit in Figure 11. Both feedback amplifiers are referenced to the
same bandgap reference. A PNP transistor is used in the device’s
output and serves as a series pass element. The output PNP pass
transistor incorporates a dual collector. The first feedback amplifier
monitors the first collector’s output voltage through the use of a
voltage divider network fed from the output. The second collector
monitors the output current and produces a small output current
2003 Oct 13
SA57003
Keep in mind that the output capacitor tries to supply any
instantaneous increase in load current. Using higher values of
capacitance will enhance transient load performance as well as
stability. Lowering the ESR of the capacitors will also improve the
transient response to load current changes but at the expense of
stability.
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Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
VIN
4
10 µF
SA57003
ON/OFF1
3
ENABLE
2
VOLTAGE
REFERENCE
NS1
0.01 µF
CURRENT
LIMIT
TEMP
SENSOR
R
VOUT1
1
4.7 µF
R
ON/OFF2
NS2
7
ENABLE
CURRENT
LIMIT
8
0.01 µF
TEMP
SENSOR
R
VOUT2
9
4.7 µF
R
ON/OFF3
NS3
5
ENABLE
CURRENT
LIMIT
6
0.01 µF
TEMP
SENSOR
R
VOUT3
16
4.7 µF
R
VOUT3
ON/OFF4
11
ENABLE
R
VOUT4
12
4.7 µF
R
VOUT3
ON/OFF5 15
ENABLE
R
VOUT5
14
GND
10
R
4.7 µF
SL01435
Figure 10. Simplified block diagram.
2003 Oct 13
10
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
SA57003
1 VOUT1
VIN 4
9 VOUT2
NS2 8
NS1 2
ON/OFF1 3
ON/OFF2
7
VOUT3
16
12
VOUT4
14
VOUT5
NS3 6
ON/OFF3 5
10 GND
11
15
ON/OFF4
ON/OFF5
Figure 11. Equivalent circuit.
2003 Oct 13
11
SL01437
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
APPLICATION INFORMATION
ON/OFF4
VOUT1
ON/OFF5
ON/OFF1
1
16
ON/OFF3
2
15
3
14
ON/OFF2
4
VOUT3
VOUT5
13
SA57003
VIN
5
12
6
11
7
10
8
CIN
10 µF
VOUT4
VOUT2
9
CNS1,2,3 (optional)
0.01 µF CERAMIC
COUT1,2,3,4,5
1.0 µF CERAMIC OR TANTALUM
SL01421
Figure 12. Typical application circuit.
Stability Factors: Capacitance and ESR
Power dissipation calculations
The operating stability of linear regulators is determined by start-up
delay, transient response to load currents, and stability of the
feedback loop. The SA57003 has a fast transient loop response,
with no built-in delay.
A regulator’s maximum power dissipation can be determined by
using the following equation:
PD(max) = VIN(max)IG + [VIN(max) – VOUT(min)] IOUT(max)
where:
Keep in mind that the output capacitor tries to supply any
instantaneous increase in load current from its stored energy. Using
higher values of capacitance will enhance transient load
performance as well as stability. Lowering the ESR of the capacitors
will also improve the transient response to load current changes, but
it will decrease stability.
VIN(max) is the maximum input voltage
IG is the maximum Ground Current at maximum output current
VOUT(min) is the minimum output voltage
IOUT(max) is the maximum output current
(VIN(max)IG) represents heat generated in the device due to internal
circuit biasing, leakage, etc. [VIN(max) – VOUT(min)] is the
input-to-output voltage drop across the device due to the IOUT(max)
current. When multiplied by IOUT(max), this represents heat
generated in the device due to the output load current.
Power dissipation factors
The thermal performance of linear regulators depends on the
following parameters:
Maximum junction temperature (Tj) in °C
Maximum ambient temperature (Tamb) in °C
Power dissipation capability of the package in Watts (PD)
Junction-to-ambient thermal resistance in °C/W
Heat dissipation factors
The SA57003 device should not be operated under conditions that
would cause a junction temperature of 150 °C to be generated
because the thermal shutdown protection circuit will shut down the
device at or near this temperature.
The Maximum Junction Temperature and Maximum Power
Dissipation are both determined by the manufacturer’s process and
device’s design. For the most part the ambient temperature is under
the control of the user. The Maximum Ambient Temperature
depends on the process used by the manufacturer. The package
type and manufacturer’s process determines Junction-to-Ambient
Thermal Resistance.
Heat generated within the device is removed to the surrounding
environment by radiation or conduction along several paths. In
general, radiated heat is dissipated directly into the surrounding
ambient from the chip package and leads. Conducted heat flows
through an intermediate material, such as the leads or thermal
grease, to circuit board traces and heat sinks in direct contact with
the device’s package or leads. The circuit board then radiates this
heat to the ambient. For this reason, adequate airflow over the
device and the circuit board is important.
These parameters are related to each other as shown in the
following equation:
Tj = Tamb + ( PD × Rth(j-a) )
The term ( PD × Rth(j-a) ) represents the temperature rise from the
ambient to the internal junction of the device.
2003 Oct 13
The TSSOP16 package is too small to easily use external heat sinks
to increase the surface area and enhance the dissipation of
12
Philips Semiconductors
Product data
Five-output composite voltage regulator
generated heat. Heat dissipation must depend primarily on radiated
heat into the surrounding environment and the heat flow through the
leads into the printed circuit board. Some improvement can be
realized by allowing additional exposed copper on the circuit board
near the device to serve as heat absorbers and dissipaters for the
device.
SA57003
DEFINITIONS
Line regulation is the change in output voltage caused by a change
in input line voltage. This parameter is measured using pulse
measurement techniques or under conditions of low power
dissipation so as to not significantly upset the thermal dynamics of
the device during test.
The overall thermal resistance from junction to the surrounding
ambient of the package (Rth(j-a)) is made up of three series elements
and can be thought of as the total resistance of a series electrical
circuit. These elements are:
Load regulation is the change in output voltage caused by a
change in output load current for a constant device temperature.
Quiescent current is that current which flows to the ground pin of
the device when the device is operated with no load.
Rth(j-c) = Thermal resistance from Junction-to-Case
Rth(c-s) = Thermal resistance from Case-to-heat Sink
Rth(s-a) = Thermal resistance from heat Sink-to-Ambient
Ground current is that current which flows to the ground pin of the
device when the device is operated with output current flowing due
to an applied load. It is the measurement difference of input current
minus the output current.
Rth(j-a) is based primarily on the package type and the size of the
silicon chip used in the device. The composition of package
materials plays an important part. High heat conductivity materials
produce reduced Junction-to-Case resistances.
Rth(c-s) value is based on the package type, heat sink interface, and
contact area of the device to the heat sink. The use of thermal
grease or an insulator will increase the transfer of heat from the
case to the heat sink.
Dropout voltage is the input/output differential at which the
regulator output no longer maintains regulation against further
reductions in input voltage. Measured when the output drops
100 mV below its nominal value (which is measured at 1.0 V
differential input/output), dropout voltage is affected by junction
temperature, load current and minimum input supply requirements.
Rth(s-a), which is thermal resistance from heat sink to the ambient, is
based on heat sink emissivity and airflow over the heat sink to carry
the heat away. The heat sink to ambient heat flow is dependent on
the ability of the surrounding ambient media to absorb the heat.
Output noise voltage is the integrated output noise voltage
(RMS AC) specified over a frequency range and expressed in
nV/kHz or Vrms. It is measured at the output, with a constant load an
no input ripple.
The total Rth(j-a) thermal resistance is expressed as:
Current limiting is internal device circuitry incorporated to limit the
output current of the device. This feature is incorporated in the
device to protect the device against output over current conditions or
output shorts to ground.
Rth(j-a) = Rth(j-c) + Rth(c-s) + Rth(s-a)
The maximum power that a given package can handle is given by:
PD +
T j(max) * T amb
Thermal shutdown is internal device circuitry incorporated in the
device to shut down the device when the chip temperature reaches
a specified temperature. This feature protects the device from
excessive operating temperatures that would otherwise be
catastrophic to the device. Over heating can be created by
accidental output shorts.
R th(j*a)
Maximum power dissipation is the maximum total dissipation for
which the regulator will operate within specifications.
2003 Oct 13
13
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
TEST CIRCUITS
IO4
ON/OFF4
IO1
A
IO5
ON/OFF5
CVO1
IO1
ON/OFF1
RL1
IO3
1
16
2
15
A
IO3
ON/OFF3
IO2
ON/OFF2
CVO3
3
A
14
4
5
12
6
11
V
CVO5
13
RL5
SA57003
A
V
RL3
IO5
IO2
A
V
CVO4
RL4
7
VIN
10
CIN
IO2
8
CNS1
CNS2
A
9
CVO2
CNS3
V
V
RL2
SL01436
Figure 13. Test circuit 1.
PACKING METHOD
The SA57003 is packed in reels, as shown in Figure 14.
GUARD
BAND
TAPE
REEL
ASSEMBLY
TAPE DETAIL
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 14. Tape and reel packing method
2003 Oct 13
14
Philips Semiconductors
Product data
Five-output composite voltage regulator
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
2003 Oct 13
15
SA57003
SOP001
Philips Semiconductors
Product data
Five-output composite voltage regulator
SA57003
REVISION HISTORY
Rev
Date
Description
_2
20031013
Product data (9397 750 12114). ECN 853-2275 30325 of 09 September 2003.
Modifications:
• Change package version to SOP001 in Ordering information and Package outline sections.
_1
20010801
Product data (9397 750 08711). ECN 853-2275 26807 of 01 August 2001.
Data sheet status
Level
Data sheet status [1]
Product
status [2] [3]
Definitions
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
 Koninklijke Philips Electronics N.V. 2003
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 10-03
For sales offices addresses send e-mail to:
[email protected].
Document order number:
2003 Oct 13
16
9397 750 12114