INTEGRATED CIRCUITS DATA SHEET TJA1040 High speed CAN transceiver Product specification Supersedes data of 2003 Feb 19 2003 Oct 14 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 FEATURES GENERAL DESCRIPTION • Fully compatible with the ISO 11898 standard The TJA1040 is the interface between the Controller Area Network (CAN) protocol controller and the physical bus. It is primarily intended for high speed applications, up to 1 MBaud, in passenger cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. • High speed (up to 1 MBaud) • Very low-current standby mode with remote wake-up capability via the bus • Very low ElectroMagnetic Emission (EME) • Differential receiver with high common-mode range for ElectroMagnetic Immunity (EMI) • Transceiver in unpowered state disengages from the bus (zero load) The TJA1040 is the next step up from the TJA1050 high speed CAN transceiver. Being pin compatible and offering the same excellent EMC performance, the TJA1040 also features: • Input levels compatible with 3.3 V and 5 V devices • An ideal passive behaviour when supply voltage is off • Voltage source for stabilizing the recessive bus level if split termination is used (further improvement of EME) • A very low-current standby mode with remote wake-up capability via the bus. • At least 110 nodes can be connected This makes the TJA1040 an excellent choice in nodes which can be in power-down or standby mode in partially powered networks. • Transmit Data (TXD) dominant time-out function • Bus pins protected against transients in automotive environments • Bus pins and pin SPLIT short-circuit proof to battery and ground • Thermally protected. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage ICC supply current standby mode 5 15 µA VCANH DC voltage on pin CANH 0 < VCC < 5.25 V; no time limit −27 +40 V VCANL DC voltage on pin CANL 0 < VCC < 5.25 V; no time limit −27 +40 V VSPLIT DC voltage on pin SPLIT 0 < VCC < 5.25 V; no time limit −27 +40 V Vesd electrostatic discharge voltage Human Body Model (HBM) −6 +6 kV operating range pins CANH, CANL and SPLIT all other pins tPD(TXD-RXD) propagation delay TXD to RXD Tvj virtual junction temperature VSTB = 0 V 4.75 5.25 V −4 +4 kV 40 255 ns −40 +150 °C ORDERING INFORMATION TYPE NUMBER PACKAGE NAME TJA1040T SO8 TJA1040U − 2003 Oct 14 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die; die dimensions 1840 × 1440 × 380 µm 2 VERSION SOT96-1 − Philips Semiconductors Product specification High speed CAN transceiver TJA1040 BLOCK DIAGRAM VCC handbook, full pagewidth 3 TXD TIME-OUT & SLOPE 1 TEMPERATURE PROTECTION V SPLIT VCC 5 7 6 STB RXD GND 8 WAKE-UP MODE CONTROL 4 SPLIT CANH CANL DRIVER WAKE-UP FILTER MUX TJA1040 2 MGU161 Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION TXD 1 transmit data input GND 2 ground supply TXD 1 VCC 3 supply voltage GND 2 RXD 4 receive data output; reads out data from the bus lines SPLIT 5 common-mode stabilization output CANL 6 LOW-level CAN bus line CANH 7 HIGH-level CAN bus line STB 8 standby mode control input 2003 Oct 14 handbook, halfpage 8 STB 7 CANH VCC 3 6 CANL RXD 4 5 SPLIT TJA1040T MGU160 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 to the centre tap of the split termination (see Fig.4). In case of a recessive bus voltage <0.5VCC due to the presence of an unsupplied transceiver in the network with a significant leakage current from the bus lines to ground, the split circuit will stabilize this recessive voltage to 0.5VCC. So a start of transmission does not cause a step in the common-mode signal which would lead to poor ElectroMagnetic Emission (EME) behaviour. FUNCTIONAL DESCRIPTION Operating modes The TJA1040 provides two modes of operation which are selectable via pin STB. See Table 1 for a description of the modes of operation. Table 1 Operating modes MODE PIN STB PIN RXD LOW Wake-up HIGH normal LOW bus dominant standby HIGH wake-up request no wake-up detected request detected In the standby mode the bus lines are monitored via a low-power differential comparator. Once the low-power differential comparator has detected a dominant bus level for more than tBUS, pin RXD will become LOW. bus recessive NORMAL MODE Over-temperature detection In this mode the transceiver is able to transmit and receive data via the bus lines CANH and CANL. See Fig.1 for the block diagram. The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD via the multiplexer (MUX). The slope of the output signals on the bus lines is fixed and optimized in a way that lowest ElectroMagnetic Emission (EME) is guaranteed. The output drivers are protected against over-temperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature Tj(sd), the output drivers will be disabled until the virtual junction temperature becomes lower than Tj(sd) and TXD becomes recessive again. By including the TXD condition, the occurrence of output driver oscillation due to temperature drifts is avoided. STANDBY MODE A ‘TXD dominant time-out’ timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. TXD dominant time-out function In this mode the transmitter and receiver are switched off, and the low-power differential receiver will monitor the bus lines. A HIGH level on pin STB activates this low-power receiver and the wake-up filter, and after tBUS the state of the CAN bus is reflected on pin RXD. If the duration of the LOW level on pin TXD exceeds the internal timer value (tdom), the transmitter is disabled, driving the bus lines into a recessive state. The timer is reset by a positive edge on pin TXD. The TXD dominant time-out time tdom defines the minimum possible bit rate of 40 kBaud. The supply current on VCC is reduced to a minimum in such a way that ElectroMagnetic Immunity (EMI) is guaranteed and a wake-up event on the bus lines will be recognized. In this mode the bus lines are terminated to ground to reduce the supply current (ICC) to a minimum. A diode is added in series with the high-side driver of RXD to prevent a reverse current from RXD to VCC in the unpowered state. In normal mode this diode is bypassed. This diode is not bypassed in standby mode to reduce current consumption. Fail-safe features Pin TXD provides a pull-up towards VCC in order to force a recessive level in case pin TXD is unsupplied. Pin STB provides a pull-up towards VCC in order to force the transceiver into standby mode in case pin STB is unsupplied. Split circuit Pin SPLIT provides a DC stabilized voltage of 0.5VCC. It is turned on only in normal mode. In standby mode pin SPLIT is floating. The VSPLIT circuit can be used to stabilize the recessive common-mode voltage by connecting pin SPLIT 2003 Oct 14 In the event that the VCC is lost, pins TXD, STB and RXD will become floating to prevent reverse supplying conditions via these pins. 4 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC PARAMETER supply voltage CONDITIONS MIN. MAX. UNIT no time limit −0.3 +6 V operating range 4.75 5.25 V VTXD DC voltage on pin TXD −0.3 VCC + 0.3 V VRXD DC voltage on pin RXD −0.3 VCC + 0.3 V VSTB DC voltage on pins STB −0.3 VCC + 0.3 V VCANH DC voltage on pin CANH 0 < VCC < 5.25 V; no time limit −27 +40 V VCANL DC voltage on pin CANL 0 < VCC < 5.25 V; no time limit −27 +40 V VSPLIT DC voltage on pin SPLIT 0 < VCC < 5.25 V; no time limit −27 +40 V Vtrt transient voltages on pins CANH, CANL and SPLIT according to ISO 7637; see Fig.5 −200 +200 V Vesd electrostatic discharge voltage Human Body Model (HBM); note 1 pins CANH and CANL and SPLIT −6 +6 kV all other pins −4 +4 kV Tvj virtual junction temperature Tstg storage temperature Machine Model (MM); note 2 −200 +200 V note 3 −40 +150 °C −55 +150 °C Notes 1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor. 2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor. 3. Junction temperature in accordance with IEC 60747-1. An alternative definition of Tvj is: Tvj = Tamb + P × Rth(vj-amb), where Rth(vj-amb) is a fixed value to be used for the calculating of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). THERMAL CHARACTERISTICS In accordance with IEC 60747-1. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(vj-a) thermal resistance from virtual junction to ambient in SO8 package in free air 145 K/W Rth(vj-s) thermal resistance from virtual junction to substrate of bare die in free air 50 K/W QUALITY SPECIFICATION Quality specification in accordance with “AEC-Q100”. 2003 Oct 14 5 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 CHARACTERISTICS VCC = 4.75 to 5.25 V, Tvj = −40 to +150 °C and RL = 60 Ω unless specified otherwise; all voltages are defined with respect to ground; positive currents flow into the IC; note 1. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply (pin VCC) ICC supply current 5 10 15 µA recessive; VTXD = VCC 2.5 5 10 mA dominant; VTXD = 0 V 30 50 70 mA standby mode normal mode Transmit data input (pin TXD) VIH HIGH-level input voltage 2 − VCC + 0.3 V VIL LOW-level input voltage −0.3 − +0.8 V IIH HIGH-level input current VTXD = VCC −5 0 +5 µA IIL LOW-level input current normal mode; VTXD = 0 V −100 −200 −300 µA Ci input capacitance not tested − 5 10 pF Standby mode control input (pin STB) VIH HIGH-level input voltage 2 − VCC + 0.3 V VIL LOW-level input voltage −0.3 − +0.8 V IIH HIGH-level input current VSTB = VCC − 0 − µA IIL LOW-level input current VSTB = 0 V −1 −4 −10 µA Receive data output (pin RXD) VOH HIGH-level output voltage standby mode; IRXD = −100 µA VCC − 1.1 VCC − 0.7 VCC − 0.4 V IOH HIGH-level output current normal mode; VRXD = VCC − 0.4 V −0.1 −0.4 −1 mA IOL LOW-level output current VRXD = 0.4 V 2 6 12 mA Common-mode stabilization output (pin SPLIT) VO output voltage normal mode; −500 µA < IO < +500 µA 0.3VCC 0.5VCC 0.7VCC V IL leakage current standby mode; −22 V < VSPLIT < +35 V − 0 5 µA pin CANH 3 3.6 4.25 V pin CANL 0.5 1.4 1.75 V −100 0 +150 mV VTXD = 0 V; dominant; 45 Ω < RL < 65 Ω 1.5 − 3.0 V VTXD = VCC; recessive; no load −50 − +50 mV Bus lines (pins CANH and CANL) VO(dom) dominant output voltage VO(dom)(m) matching of dominant output voltage (VCC - VCANH - VCANL) VO(dif)(bus) differential bus output voltage (VCANH − VCANL) 2003 Oct 14 VTXD = 0 V 6 Philips Semiconductors Product specification High speed CAN transceiver SYMBOL PARAMETER VO(reces) recessive output voltage IO(sc) short-circuit output current TJA1040 CONDITIONS MIN. normal mode; VTXD = VCC; 2 no load standby mode; no load TYP. MAX. UNIT 0.5VCC 3 V −0.1 0 +0.1 V −40 −70 −95 mA VTXD = 0 V pin CANH; VCANH = 0 V pin CANL; VCANL = 40 V 40 70 100 mA − +2.5 mA normal mode (see Fig.6) 0.5 0.7 0.9 V standby mode 0.4 0.7 1.15 V IO(reces) recessive output current −27 V < VCAN < +32 V Vdif(th) differential receiver threshold voltage −12 V < VCANL < +12 V; −12 V < VCANH < +12 V −2.5 Vhys(dif) differential receiver hysteresis voltage normal mode; −12 V < VCANL < +12 V; −12 V < VCANH < +12 V 50 70 100 mV ILI input leakage current VCC = 0 V; VCANH = VCANL = 5 V −5 0 +5 µA Ri(cm) common-mode input resistance standby or normal mode 15 25 35 kΩ Ri(cm)(m) common-mode input resistance matching VCANH = VCANL −3 0 +3 % Ri(dif) differential input resistance standby or normal mode 25 50 75 kΩ Ci(cm) common-mode input capacitance VTXD = VCC; not tested − − 20 pF Ci(dif) differential input capacitance VTXD = VCC; not tested − − 10 pF normal mode 25 70 110 ns Timing characteristics; see Fig.8 td(TXD-BUSon) delay TXD to bus active td(TXD-BUSoff) delay TXD to bus inactive 10 50 95 ns td(BUSon-RXD) delay bus active to RXD 15 65 115 ns td(BUSoff-RXD) delay bus inactive to RXD 35 100 160 ns tPD(TXD-RXD) propagation delay TXD to RXD VSTB = 0 V 40 − 255 ns tdom(TXD) TXD dominant time-out VTXD = 0 V 300 600 1000 µs tBUS dominant time for wake-up via bus standby mode 0.75 1.75 5 µs td(stb-norm) delay standby mode to normal mode normal mode 5 7.5 10 µs 155 165 180 °C Thermal shutdown Tj(sd) shutdown junction temperature Note 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 °C ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for cased products; unless specified otherwise. For bare dies, all parameters are only guaranteed with the backside of the die connected to ground. 2003 Oct 14 7 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 APPLICATION AND TEST INFORMATION handbook, full pagewidth 5V BAT VCC CANH 3 7 8 STB Port x VCC TJA1040 SPLIT MICROCONTROLLER 5 4 CANL 6 2 1 RXD TXD RXD TXD MGU164 More application information is available in a separate application note. Fig.3 Typical application for 5 V microcontroller. VCC handbook, full pagewidth TJA1040 CANH 60 Ω R VSPLIT = 0.5VCC SPLIT in normal mode; otherwise floating 60 Ω R CANL MGU162 GND Fig.4 Stabilization circuitry and application. 2003 Oct 14 8 Philips Semiconductors Product specification High speed CAN transceiver handbook, full pagewidth TJA1040 +5 V 47 µF 100 nF VCC TXD 3 1 7 TJA1040 500 kHz RXD CANL 1 nF 1 nF TRANSIENT GENERATOR SPLIT 5 4 2 15 pF 6 CANH 8 GND STB MGW336 The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7. Fig.5 Test circuit for automotive transients. handbook, full pagewidth MGS378 VRXD HIGH LOW hysteresis 0.5 0.9 Fig.6 Hysteresis of the receiver. 2003 Oct 14 9 Vi(dif)(bus) (V) Philips Semiconductors Product specification High speed CAN transceiver handbook, full pagewidth TJA1040 +5 V 47 µF 100 nF VCC TXD 3 1 7 SPLIT RXD CANH RL 60 Ω TJA1040 5 6 CANL CL 100 pF 4 2 15 pF 8 GND STB MGW335 Fig.7 Test circuit for timing characteristics. handbook, full pagewidth HIGH TXD LOW CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus) (1) 0.5 V recessive (BUS off) HIGH RXD 0.7VCC 0.3VCC LOW t d(TXD-BUSon) t d(TXD-BUSoff) t d(BUSon-RXD) t d(BUSoff-RXD) t PD(TXD-RXD) t PD(TXD-RXD) (1) Vi(dif)(bus) = VCANH − VCANL. Fig.8 Timing diagram. 2003 Oct 14 10 MGS377 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 BONDING PAD LOCATIONS COORDINATES(1) SYMBOL PAD x y 119.5 114.5 TXD 1 GND 2 648.5 85 VCC 3 1214.25 114.5 RXD 4 1635.25 114.5 SPLIT 5 1516.5 1275 CANL 6 990.5 1273.75 CANH 7 530.25 1273.75 STB 8 113.75 1246 7 6 5 test pad 1 TJA1040U test pad 2 x 0 1 0 2 3 4 y Note MBL584 The backside of the bare die must be connected to ground. 1. All x/y coordinates represent the position of the centre of each pad (in µm) with respect to the left hand bottom corner of the top aluminium layer (see Fig.9). 2003 Oct 14 8 handbook, halfpage Fig.9 Bonding pad locations. 11 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 inches 0.010 0.057 0.069 0.004 0.049 0.05 0.244 0.039 0.028 0.041 0.228 0.016 0.024 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2003 Oct 14 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 12 o 8 0o Philips Semiconductors Product specification High speed CAN transceiver TJA1040 To overcome these problems the double-wave soldering method was specifically developed. SOLDERING Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. • below 220 °C (SnPb process) or below 245 °C (Pb-free process) A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. – for all BGA and SSOP-T packages – for packages with a thickness ≥ 2.5 mm Manual soldering – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. 2003 Oct 14 13 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable(4) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(5), SO, SOJ suitable REFLOW(2) suitable suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable PMFP(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. REVISION HISTORY REV 6 DATE 20031014 CPCN 200307014 DESCRIPTION Product specification (9397 750 11837) Modification: • Change ‘Vth(dif) = 0.5 V’ in standby mode into ‘Vdif(th) = 0.4 V’ • Add Chapter REVISION HISTORY 5 20030219 2003 Oct 14 − Product specification (9397 750 10887) 14 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 14 15 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2003 Oct 14 16 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R16/06/pp17 Date of release: 2003 Oct 14 Document order number: 9397 750 11837