INTEGRATED CIRCUITS DATA SHEET 74AVCH16245 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state Product Specification File under Integrated Circuits, IC24 2000 Mar 07 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 FEATURES DESCRIPTION • Wide supply voltage range from 1.2 to 3.6 V The 74AVCH16245 is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The device features two output enable inputs (nOE) for easy cascading and two send/receive inputs (nDIR) for direction control. Inputs nOE control the outputs so that the buses are effectively isolated. This device can be used as two 8-bit transceivers or one 16-bit transceiver. • Complies with JEDEC standard no. 8-1A/5/7 • CMOS low power consumption • Input/output tolerant up to 3.6 V • Dynamic Controlled Output (DCO) circuit dynamically changes output impedance, resulting in noise reduction without speed degradation • Low inductance multiple VCC and GND pins to minimize noise and ground bounce The 74AVCH16245 is designed to have an extremely fast propagation delay and a minimum amount of power consumption. • Supports Live Insertion • All inputs have bus-hold. To ensure the high-impedance output state during power-up or power-down, pins nOE should be tied to VCC through a pull-up resistor (Live Insertion). A Dynamic Controlled Output (DCO) circuitry is implemented to support termination line drive during transient (see Figs 1 and 2). The 74AVCH16245 has active bus-hold circuitry to hold unused or floating data inputs at a valid logic level. This feature eliminates the need for external pull-up or pull-down resistors. MNA507 MNA506 300 0 handbook, halfpage handbook, halfpage I OL (mA) I OH (mA) 3.3 V 1.8 V −100 200 2.5 V 2.5 V −200 100 1.8 V 3.3 V −300 Fig.1 0 0 1 2 3 VOH (V) 0 4 Output voltage as a function of the HIGH-level output current. 2000 Mar 07 Fig.2 2 1 2 3 VOL (V) Output voltage as a function of the LOW-level output current. 4 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 2.0 ns. SYMBOL tPHL/tPLH PARAMETER CONDITIONS propagation delay nAn to nBn; nBn to nAn CI input capacitance CPD power dissipation capacitance per buffer TYP. UNIT VCC = 1.2 V 5.4 ns VCC = 1.5 V 3.1 ns VCC = 1.8 V 2.3 ns VCC = 2.5 V 1.6 ns VCC = 3.3 V 1.4 ns 5.0 pF outputs enabled 42 pF outputs disabled 2 pF notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; ∑ (CL × VCC2 × fo) = sum of outputs. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUTS nOE INPUTS/OUTPUTS nDIR nBn L L A=B inputs L H inputs B=A H X Z Z Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high impedance OFF-state. 2000 Mar 07 nAn 3 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 ORDERING AND PACKAGE INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE −40 to +85 °C 48 TSSOP plastic SOT362-1 74AVC16245DGG PINNING PIN SYMBOL DESCRIPTION 1 1DIR direction control 2, 3, 5, 6, 8, 9, 11 and 12 1B0 to 1B7 data inputs/outputs 4, 10, 15, 21, 28, 34, 39 and 45 GND ground (0 V) 7, 18, 31 and 42 VCC DC supply voltage 13, 14, 16, 17, 19, 20, 22 and 23 2B0 to 2B7 data inputs/outputs 24 2DIR direction control 25 2OE output enable input (active LOW) 26, 27, 29, 30, 32, 33, 35 and 36 2A7 to 2A0 data inputs/outputs 37, 38, 40, 41, 43, 44, 46 and 47 1A7 to 1A0 data inputs/outputs 48 1OE output enable input (active LOW) 2000 Mar 07 4 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 handbook, halfpage 1DIR 1 48 1OE 1B0 2 47 1A0 1B1 3 46 1A1 GND 4 45 GND 1B2 5 44 1A2 1B3 6 43 1A3 VCC 7 42 VCC 1B4 8 41 1A4 1B5 9 40 1A5 48 1OE 1 1DIR 25 2OE 24 2DIR 1A0 47 G3 3EN1[BA] 3EN2[AB] G6 6EN1[BA] 6EN2[AB] 1A1 1B6 11 38 1A6 1B7 12 37 1A7 1A3 36 2A0 1A4 16245 2B0 13 2B1 14 35 2A1 GND 15 34 GND 2B2 16 33 2A2 2B3 17 32 2A3 1A2 1A5 1A6 1A7 2A0 2A1 2A2 2B4 19 30 2A4 2B5 20 29 2A5 2A4 GND 21 28 GND 2A5 2A3 2A6 2B6 22 27 2A6 2B7 23 26 2A7 2DIR 24 25 2OE 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 13 4 1B1 1B2 1B3 1B4 1B5 1B6 1B7 2B0 5 31 VCC VCC 18 1B0 2 39 GND GND 10 2 1 2A7 35 14 33 16 32 17 30 19 29 20 27 22 26 23 2B1 2B2 2B3 2B4 2B5 2B6 2B7 MNA003 MNA508 Fig.3 Pin configuration. 2000 Mar 07 Fig.4 IEEE/IEC logic symbol. 5 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state handbook, full pagewidth 1 1DIR 24 1OE 47 46 44 2B4 29 2B5 27 2B6 26 1B7 20 2A6 11 1A7 19 2A5 9 1A6 17 2A4 8 1A5 1B6 37 2B3 30 16 2A3 6 1A4 1B5 38 2B2 32 14 2A2 5 1A3 1B4 40 2B1 33 13 2A1 3 1A2 1B3 41 2B0 35 25 2A0 2 1A1 1B2 43 2OE 36 1B1 2DIR 48 1A0 1B0 74AVCH16245 22 2A7 2B7 12 23 MNA509 Fig.5 Logic symbol. 2000 Mar 07 6 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER DC supply voltage CONDITIONS according to JEDEC Low Voltage Standards DC input voltage VO DC output voltage MAX. UNIT 1.4 1.6 V 1.65 1.95 V 2.3 2.7 V 3.0 3.6 V 1.2 3.6 V 0 3.6 V output 3-state 0 3.6 V output HIGH or LOW state 0 VCC V −40 +85 °C for low-voltage applications VI MIN. Tamb operating ambient temperature in free air tr, tf input rise and fall ratios VCC = 1.4 to 1.6 V 0 40 ns/V VCC = 1.65 to 2.3 V 0 30 ns/V VCC = 2.3 to 3.0 V 0 20 ns/V VCC = 3.0 to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC DC supply voltage CONDITIONS MIN. MAX. UNIT −0.5 +4.6 V IIK DC input diode current VI < 0 − −50 mA VI DC input voltage for inputs; note 1 −0.5 +4.6 V IOK DC output clamping diode current VO < 0 − −50 mA VO DC output voltage IO DC output sink current ICC, IGND DC VCC or GND current Tstg storage temperature Ptot power dissipation per package output HIGH or LOW state; note 1 −0.5 VCC + 0.5 V output 3-state; note 1 −0.5 +4.6 V VO = 0 to VCC − 50 mA − ±100 mA −65 +150 °C − 500 mW for temperature range: −40 to +85 °C; note 2 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 60 °C the value of PD derates linearly with 5.5 mW/K. 2000 Mar 07 7 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = −40 to +85 °C TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH VOL HIGH-level input voltage LOW-level output voltage TYP.(1) MIN. UNIT MAX. VCC − − V 1.4 to 1.6 0.65 × VCC 0.9 − V 1.65 to 1.95 0.65 × VCC 0.9 − V 2.3 to 2.7 1.7 1.2 − V 1.2 3.0 to 3.6 2.0 1.5 − V 1.2 − − GND V 1.4 to 1.6 − 0.9 0.35 × VCC V 1.65 to 1.95 − 0.9 0.35 × VCC V 2.3 to 2.7 − 1.2 0.7 V 3.0 to 3.6 − 1.5 0.8 V IO = −100 µA 1.65 to 3.6 VCC − 0.20 VCC − V IO = −3 mA 1.4 VCC − 0.35 VCC − 0.21 − V IO = −4 mA 1.65 VCC − 0.45 VCC − 0.25 − V IO = −8 mA 2.3 VCC − 0.55 VCC − 0.37 − V IO = −12 mA 3.0 VCC − 0.70 VCC − 0.47 − V LOW-level input voltage HIGH-level output voltage VCC (V) VI = VIH or VIL VI = VIH or VIL IO = 100 µA 1.65 to 3.6 − GND 0.20 V IO = 3 mA 1.4 − 0.22 0.35 V IO = 4 mA 1.65 − 0.24 0.45 V IO = 8 mA 2.3 − 0.38 0.55 V IO = 12 mA 3.0 − 0.53 0.70 V II input leakage current VI = VCC or GND 1.4 to 3.6 − 0.1 2.5 µA Ioff power-off leakage current VI or VO = 3.6 V 0 − 0.1 ±10 µA IIHZ/IILZ input current for common I/O pins VI = VCC or GND 1.4 to 3.6 − 0.1 12.5 µA IOZ 3-state output OFF-state current VI = VIH or VIL; VO = VCC or GND 1.4 to 2.7 − 0.1 5 µA 3.0 to 3.6 − 0.1 10 µA ICC quiescent supply current VI = VCC or GND; IO = 0 1.4 to 2.7 − 0.1 20 µA 3.0 to 3.6 − 0.2 40 µA bus-hold LOW sustaining current VI = 0.35 × VCC 1.65 25 − − µA VI = 0.7 V 2.3 45 − − µA VI = 0.8 V 3.0 75 − − µA VI = 0.65 × VCC 1.65 −25 − − µA 2.3 −45 − − µA 3.0 −75 − − µA IBHL IBHH 2000 Mar 07 bus-hold HIGH sustaining current 8 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state Tamb = −40 to +85 °C TEST CONDITIONS SYMBOL PARAMETER OTHER IBHLO IBHHO bus-hold LOW overdrive current bus-hold HIGH overdrive current VCC (V) TYP.(1) MIN. UNIT MAX. 1.95 200 − − µA 2.7 300 − − µA 3.6 450 − − µA 1.95 −200 − − µA 2.7 −300 − − µA 3.6 −450 − − µA Note 1. All typical values are measured at Tamb = 25 °C. 2000 Mar 07 74AVCH16245 9 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 AC CHARACTERISTICS GND = 0 V; tr = tf ≤ 2.0 ns. Tamb = −40 to +85 °C TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH tPZH/tPZL tPHZ/tPLZ propagation delay; nAn to nBn; nBn to nAn 3-state output enable time; nOE to nAn; nOE to nBn see Figs 6 and 8 see Figs 7 and 8 3-state output disable time; nOE to nAn; nOE to nBn see Figs 7 and 8 VCC (V) MIN. TYP.(1) 1.2 − 5.4 − ns 1.40 to 1.60 − 3.1 − ns 1.65 to 1.95 1.4 2.3 3.3 ns 2.3 to 2.7 0.5 1.6 2.2 ns 3.0 to 3.6 0.7 1.4 2.0 ns 1.2 − 7.4 − ns 1.40 to 1.60 − 6.4 − ns 1.65 to 1.95 1.4 4.4 7.0 ns 2.3 to 2.7 1.0 2.8 4.3 ns 3.0 to 3.6 0.7 2.3 3.7 ns 1.2 − 7.3 − ns 1.40 to 1.60 − 5.7 − ns 1.65 to 1.95 2.2 4.2 7.0 ns 2.3 to 2.7 1.1 2.3 5.4 ns 3.0 to 3.6 1.2 2.5 3.9 ns Note 1. All typical values are measured at Tamb = 25 °C and at VCC respectively 1.2, 1.5, 1.8, 2.5 and 3.3 V. AC WAVEFORMS handbook, halfpage VI nAn, nBn VM input GND t PHL t PLH VOH nBn, nAn VM output VOL VCC VM VCC 0.5 × VCC VCC 3.0 to 3.6 V MNA511 VI ≤2.3 to 2.7 V 0.5 × VCC VOL and VOH are typical output voltage drop that occur with the output load. Fig.6 The input (nAn, nBn) to output (nBn, nAn) propagation delay. 2000 Mar 07 10 UNIT MAX. Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 VI handbook, full pagewidth nOE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs enabled outputs disabled MNA478 VM VCC VX ≤2.3 to 2.7 V 0.5 × VCC 0.5 × VCC 3.0 to 3.6 V VY VI VOL + 0.15 V VOH − 0.15 V VCC VOL + 0.3 V VOH − 0.3 V VCC VOL and VOH are typical output voltage drop that occur with the output load. Fig.7 The 3-state enable and disable times. S1 handbook, full pagewidth VCC VI PULSE GENERATOR 2 × VCC open GND R load VO D.U.T. CL RT R load MNA505 VCC (V) TEST S1 VI Rload CL 1.2 VCC 2000 Ω 15 pF 1.4 to 1.6 VCC 2000 Ω 15 pF tPLH/tPHL open 1.65 to 1.95 VCC 1000 Ω 30 pF tPLZ/tPZL 2 × VCC 2.3 to 2.7 VCC 500 Ω 30 pF tPHZ/tPZH GND 3.0 to 3.6 VCC 500 Ω 30 pF Fig.8 Load circuitry for switching times. 2000 Mar 07 11 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 PACKAGE OUTLINE TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.8 0.4 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 2000 Mar 07 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-10 99-12-27 MO-153 12 o Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state SOLDERING 74AVCH16245 If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2000 Mar 07 13 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 74AVCH16245 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Mar 07 14 Philips Semiconductors Product Specification 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state NOTES 2000 Mar 07 15 74AVCH16245 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com SCA 69 © Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 245004/01/pp16 Date of release: 2000 Mar 07 Document order number: 9397 750 06761