SA56202 One-chip motor driver Rev. 01 — 19 July 2004 Preliminary data sheet 1. General description The SA56202 is a one-chip motor driver IC that is capable to drive all motors of CD or DVD systems: spindle, sled and loading motors and actuators on the optical pick-up unit. The driver intended for the 3-phase, brushless, Hall-commutated spindle motor uses True-Silent PWM. This proprietary technology ensures that all 3-phase motor currents are sinusoidal resulting in an optimally silent driver. Internal regeneration of the back-EMF of the spindle motor enables the driver to operate in current-steering mode without using external power-dissipating sense resistors. The driver intended for the 2-phase sled stepper motor operates in current-steering PWM mode. In addition the IC contains four full-bridge linear channels that can be used to drive a loading motor and 3D actuators (focus, tracking and tilt). The SA56202 is available in an exposed die pad HTSSOP56 package. 2. Features ■ True-Silent PWM spindle motor driver ■ Low heat generation due to power-efficient direct full-bridge switching of spindle motor driver ■ Controlled spindle motor current during acceleration and brake ■ Reverse torque brake function (full bridge) ■ Adjustable spindle motor current limiter ■ Internal regeneration for EMF of spindle motor ■ Current-steering PWM controlled stepper motor driver for sled ■ Four class-AB linear channels for loading motor and 3D actuators (focus, tracking and tilt) ■ Low on-resistance D-MOSFET output power stages ■ Built-in thermal shutdown, thermal warning and temperature diode ■ Interfaces to 3 V and 5 V logic ■ Package with low thermal resistance to heatsink (reflowable die pad). 3. Applications ■ ■ ■ ■ DVD+RW, DVD-RW, DVD-ROM and DVD-RAM Combi CD-ROM and CD-RW Other compact disk media. SA56202 Philips Semiconductors One-chip motor driver 4. Ordering information Table 1: Ordering information Type number Package Name SA56202TW Description Version HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad 9397 750 12772 Preliminary data sheet SOT793-1 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 2 of 24 SA56202 Philips Semiconductors One-chip motor driver 5. Block diagram HU+ HU− HV+ HV− HW+ HW− HBIAS RREF REMF RLIM VSS1(SPN) U VDD1(SPN) V VSS2(SPN) W VDD2(SPN) FG VSSD VINSPN VINREF VDDA 1 REVERSE DETECTION 2 3 HALL AMP 4 56 OSCILLATOR 55 THERMAL SHUTDOWN FG 54 5 53 52 51 50 49 6 7 8 9 10 48 HALL BIAS VINREF LEVEL SHIFT VINREF LEVEL SHIFT 47 CURRENT REFERENCE 11 46 45 44 12 43 42 13 14 SPINDLE LOGIC VINREF LEVEL SHIFT VINREF LEVEL SHIFT 41 15 40 16 17 18 39 38 FG 19 37 20 21 ADC 36 SLED LOGIC VINREF 22 35 34 33 CP1 CP2 CP3 23 32 CHARGE PUMP 24 25 31 47 kΩ CTL1 CTL2 TEMP 26 27 MUTE/ STANDBY FUNCTIONS 28 SA56202 30 COSC DIODE VSS(DIO) VINLD VINFCS VINTRK VINTLT VDD(LD) LDO+ LDO− FCSO+ FCSO− VSS(LIN) VDD(ACT) TRKO+ TRKO− TLTO+ TLTO− RSLD1 SLDO1+ SLDO1− RSLD2 SLDO2+ SLDO2− VDD(SLD) VSSA VINSLD2 VINREF 47 kΩ 29 VINSLD1 VINREF 001aaa429 Fig 1. Block diagram. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 3 of 24 SA56202 Philips Semiconductors One-chip motor driver 6. Pinning information 6.1 Pinning HU+ 1 56 COSC HU− 2 55 DIODE HV+ 54 VSS(DIO) 3 HV− 4 53 VINLD HW+ 5 52 VINFCS HW− 6 51 VINTRK HBIAS 7 50 VINTLT RREF 8 49 VDD(LD) REMF 9 48 LDO+ RLIM 10 47 LDO− VSS1(SPN) 11 46 FCSO+ U 12 45 FCSO− VDD1(SPN) 13 V 14 VSS2(SPN) 15 SA56202TW 44 VSS(LIN) 43 VDD(ACT) 42 TRKO+ W 16 41 TRKO− VDD2(SPN) 17 40 TLTO+ FG 18 39 TLTO− VSSD 19 38 RSLD1 VINSPN 20 37 SLDO1+ VINREF 21 36 SLDO1− VDDA 22 35 RSLD2 CP1 23 34 SLDO2+ CP2 24 33 SLDO2− CP3 25 32 VDD(SLD) CTL1 26 31 VSSA CTL2 27 30 VINSLD2 TEMP 28 29 VINSLD1 001aaa458 Fig 2. Pin configuration. 6.2 Pin description Table 2: Pin description Symbol Pin Description HU+ 1 Hall input U positive HU− 2 Hall input U negative HV+ 3 Hall input V positive HV− 4 Hall input V negative HW+ 5 Hall input W positive HW− 6 Hall input W negative HBIAS 7 Hall element bias RREF 8 external resistor for current reference 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 4 of 24 SA56202 Philips Semiconductors One-chip motor driver Table 2: Pin description …continued Symbol Pin Description REMF 9 external resistor for EMF regeneration RLIM 10 external resistor for current limit VSS1(SPN) 11 spindle driver ground 1 U 12 spindle driver output U VDD1(SPN) 13 spindle driver supply voltage 1 V 14 spindle driver output V VSS2(SPN) 15 spindle driver ground 2 W 16 spindle driver output W VDD2(SPN) 17 spindle driver supply voltage 2 FG 18 frequency generator output VSSD 19 digital ground VINSPN 20 spindle driver input voltage for spindle motor current VINREF 21 reference input voltage for all motor drivers VDDA 22 analog supply voltage CP1 23 charge pump capacitor connection 1 CP2 24 charge pump capacitor connection 2 CP3 25 charge pump capacitor connection 3 CTL1 26 driver logic control input 1 CTL2 27 driver logic control input 2 TEMP 28 thermal warning VINSLD1 29 sled driver 1 input voltage for sled motor current VINSLD2 30 sled driver 2 input voltage for sled motor current VSSA 31 analog ground VDD(SLD) 32 sled driver supply voltage SLD2O− 33 sled driver output 2 negative SLDO2+ 34 sled driver output 2 positive RSLD2 35 external sense resistor for sled driver 2 current sense SLDO1− 36 sled driver output 1 negative SLDO1+ 37 sled driver output 1 positive RSLD1 38 external sense resistor for sled driver 1 current sense TLTO− 39 tilting driver output negative TLTO+ 40 tilting driver output positive TRKO− 41 tracking driver output negative TRKO+ 42 tracking driver output positive VDD(ACT) 43 actuator drivers supply voltage VSS(LIN) 44 linear drivers ground FCSO− 45 focus driver output negative FCSO+ 46 focus driver output positive LDO− 47 loading driver output negative LDO+ 48 loading driver output positive VDD(LD) 49 loading driver supply voltage 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 5 of 24 SA56202 Philips Semiconductors One-chip motor driver Table 2: Pin description …continued Symbol Pin Description VINTLT 50 tilting driver input for tilt actuator voltage VINTRK 51 tracking driver input for tracking actuator voltage VINFCS 52 focus driver input for focus actuator voltage VINLD 53 loading driver input for loading motor voltage VSS(DIO) 54 temperature diode ground DIODE 55 diode for temperature readout COSC 56 external capacitor for internal oscillator 7. Functional description 7.1 Spindle motor control The control input voltage on pin VINSPN is converted into a digital value by the ADC where the voltage on pin VINREF is the midpoint reference. The transconductance gain from input voltage VVINSPN to output motor current IMOT is: I MOT I LIM g m(SPN ) = ------------------------------------------------ = --------------------V VINSPN – V VINREF V VINREF where ILIM can be programmed by means of external resistor RLIM; see Section 7.4. The motor current is described by Figure 3. ILIM IMOT forward torque 0 VVINREF 2VVINREF reverse torque brake −ILIM VVINSPN 001aaa431 Fig 3. Spindle motor current as a function of control input voltage on pin VINSPN. For VINSPN voltages larger than VVINREF the motor will accelerate with forward torque control. For VINSPN voltages smaller than VVINREF the motor will brake with reverse torque control. Because the U, V and W half-bridges of the spindle motor driver use a direct PWM full-bridge switching scheme, the motor current can also be controlled and limited during brake. Note that because of this active brake mechanism energy of the motor can be recuperated back to the supply. Especially at large speeds, this can result in currents delivered back to the supply. If the supply and/or other circuits than the motor 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 6 of 24 SA56202 Philips Semiconductors One-chip motor driver driver do not use this recuperated current, than the supply voltage can possibly rise to unacceptable values. In that case it is recommended to lower the spindle current during brake by means of the VINSPN setting. Upon detection of reverse detection all U, V and W driver outputs are connected to VDD(SPN). This short brake prevents the motor of spinning backwards. 7.2 Internal regeneration of back-EMF spindle motor The spindle motor driver uses the information from the Hall sensors to internally regenerate the back-EMF of the motor. See Figure 4. ANALOG DOMAIN VINSPN torque control signal RLIM maximum motor current REMF motor k-factor DIGITAL DOMAIN VRI = Rm × Im A VMOT = VRI + VEMF PWM D U V W spindle motor VEMF = ω × k A ω SPEED D Hall U Hall V Hall W A D 001aaa438 Fig 4. Regeneration of back-EMF voltage spindle motor. Rotational speed ω is derived from the Hall event frequency. Multiplying ω with the k-factor of the motor gives the back-EMF voltage VEMF. This VEMF is added to the current-limit scaled spindle input voltage VVINSPN. This sum VMOT steers the PWM outputs U, V and W. The result is that the input voltage VVINSPN sets the current through the motor. This explains how the SA56202 spindle motor driver exhibits a current control transfer function without using external sense resistors. The simplified motor schematic in Figure 5 shows the series resistance and back-EMF voltage of the motor. VM1 VRM VEMF 2 VEMF 2 VRM VM2 001aaa450 Fig 5. Simplified spindle motor schematic. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 7 of 24 SA56202 Philips Semiconductors One-chip motor driver Figure 6 depicts the motor voltages VM1 and VM2 during accelerating and braking. The back-EMF voltage is part of these motor voltages. VM1 VDD(SPN) VEMF 2 VRM VM2 VDD(SPN) 2 0 k ωmax ω VEMF 2 ω VRM 0 VM1 VM2 0 accelerating braking 001aaa432 Fig 6. Motor voltages when accelerating and braking with constant motor current. 7.3 Sine generation using True-Silent signals For the phase relation between the Hall inputs and the spindle outputs in forward rotation, see Figure 7. These are the signal shapes in sine mode using our True-Silent PWM technology. The particular shape of the 120° symmetrical U, V and W steering voltages are because of improved drive strength and improved power efficiency. The drive strength is improved because with this signal shape a 15 % larger sine can be fit within the supply rails compared to direct-written sine signals. Also the power efficiency is improved because this signal shape has 33 % less switching losses compared to a direct-written sine. The result is that the motor currents (and motor torques) are pure sine waves generated in such a way that the motor is driven optimally silent, optimally power efficient and with maximum driving strength. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 8 of 24 SA56202 Philips Semiconductors One-chip motor driver HALL U HALL W HALL V U(V) U U(I) V(V) V V(I) W(V) W W(I) 001aaa433 Fig 7. Phase relation between Hall input signals and spindle motor driver output voltages U(V), V(V), W(V) and motor currents U(I), V(I), W(I) in forward rotation mode. 7.4 Programming RLIM If the supply is connected between the terminals of a non-running spindle motor, then usually a current will flow that is too large. The motor current can be limited to a value ILIM. This ILIM can be programmed by means of RLIM. In order to calculate the required RLIM first a typical maximum motor current IMAX needs to be determined: V DD ( SPN ) I MAX = ------------------------------------------R motor + R switches 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 9 of 24 SA56202 Philips Semiconductors One-chip motor driver ILIM can be chosen to be a fraction of this maximum current IMAX. By making the ratio between RLIM (connected to pin 10) and RREF (connected to pin 8) this same fraction, ILIM R LIM is programmed as expressed in the following formula: I LIM = ------------- × I MAX R REF I LIM So by choosing ILIM, RLIM needs to be: R LIM = ------------ × R REF I MAX Figure 8 shows the limit current as a function of RLIM with RREF = 47 kΩ. 001aaa434 100 ILIM (% of IMAX) 80 60 40 20 0 0 10 20 30 40 50 R LIM (kΩ) Fig 8. Limit current ILIM as a function of external resistor RLIM. During accelerating and braking the motor current will not exceed ILIM. ILIM also sets the transconductance gain ILIM/VVINREF of the spindle driver. 7.5 Programming REMF The back-EMF voltage is internally regenerated. The ratio between REMF and RREF is used to scale the internal EMF regeneration. The value of external resistor REMF depends on the type of motor (k-factor and number of pole pairs NPP) and the motor supply voltage VDD(SPN). The following formula should be used to determine the REMF resistor: 3 R EMF k × 2.6 × 10 × R REF = -------------------------------------------------with k in units Nm/A. N PP × V DD ( SPN ) 7.6 FG generator The raw zero-crossings of the Hall sensors are first filtered and debounced before being passed to the FG generator. The FG generator toggles its output at every filtered Hall zero-crossing. For three Hall sensors this means that the motor frequency is linked to the FG FG frequency by: f motor = ------------------3 × N PP 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 10 of 24 SA56202 Philips Semiconductors One-chip motor driver where NPP indicates the number of pole pairs of the motor. FG has an open-drain output for easy interfacing to 3 V and 5 V logic. 7.7 Sled motor driver Two current-steering PWM channels are available to drive a stepper motor. Per channel an external sense resistor Rsense is used that is connected to ground. A peak-current control loop is implemented that modulates the duty cycle of the PWM signal. See Figure 9. 47 kΩ Rext VINSLD 47 kΩ + Σ R Q S − VVINREF input amplifier VVINREF LOGIC DRIVE M DRIVER CLOCK 70 kHz IO A Rsense 001aaa435 Fig 9. Peak-current control architecture of stepper motor driver. The clock generator has a nominal frequency of fosc/256 = 70 kHz. See Figure 10 for the transfer function from input voltage VVINSLD to output current at a typical Rsense of 0.5 Ω. Input-to-output transconductance gain can be scaled down by connecting an external resistor Rext in series with the input VINSLD. IOUT (A) 1A dead zone VVINSLD − VVINREF (V) −30 mV +1 A/V 30 mV +1 A/V −1 A 001aaa436 Fig 10. Transfer function of stepper motor driver. Both limit current and transconductance gain are related to Rsense in the following way: Io 1 Transconductance gain, ------- = -----------------------2 × R sense V in 1V Limit current, I LIM = -----------------------2 × R sense 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 11 of 24 SA56202 Philips Semiconductors One-chip motor driver 7.8 Loading motor driver One of the linear channels is available to drive a DC loading motor. Pin VDD(LD) is used to set the supply voltage for the loading motor driver. Figure 11 depicts the voltage-steering bridge topology of the SA56202. 188 kΩ 47 kΩ LDO+ 47 kΩ VINLD 188 kΩ R VDD(LD) 188 kΩ R 47 kΩ VINREF LDO− 47 kΩ 188 kΩ 001aaa437 Fig 11. Voltage-steering bridge topology of linear driver. 7.9 Actuator motor drivers Three linear channels are available to drive 3D actuators: focus, tracking and tilt. A pin VDD(ACT) is used to set the supply voltage for these actuator drivers. The voltage-steering bridge topology is the same as depicted in Figure 11. The mismatch of the voltage gain of these 3 linear channels is guaranteed to be less than 5 %. 7.10 Charge pump The on-board charge pump generates a regulated voltage of typically 18.2 V by using the VDD(SPN) supply voltage. This boosted voltage is used to turn on the upper n-type DMOS transistors of the output stages of the spindle driver, sled driver, loading driver and actuator drivers. Recommended values for the pump-and-hold capacitor are 10 nF and 22 nF respectively (see also application diagram Figure 13). The charge pump should not be loaded with other components or circuitry than these capacitors. 7.11 Thermal protection If the junction temperature of the SA56202 exceeds 150 °C, then a thermal warning signal is given at pin TEMP. TEMP has an active-LOW open-drain output for easy interfacing to 3 V and 5 V logic. The temperature hysteresis for the thermal warning is 10 °C. If the junction temperature of the IC rises to 160 °C, then a thermal shutdown is activated that sets all power outputs in 3-state. The temperature hysteresis for the thermal shutdown is 30 °C. As soon as the thermal shutdown deactivates at 130 °C, all motor drivers continue normal operation. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 12 of 24 SA56202 Philips Semiconductors One-chip motor driver 7.12 Oscillator The RC oscillator uses two external components (RREF and COSC) to fix its frequency at 18 MHz. RREF is used to generate a reference current. This reference current is used to charge and discharge COSC. The nominal oscillation frequency fosc is 18 MHz with RREF = 47 kΩ (2 % tolerance) and COSC = 70 pF (5 % tolerance). These values are fixed. The oscillator can be overruled by applying an 18 MHz clock to pin COSC. The reference current derived from RREF is also used for RLIM and REMF. RREF should always be connected. 7.13 Muting functions Pins CTL1 and CTL2 are used to mute certain parts of the IC. See Table 3. In this table off means 3-state. Table 3: Muting functions CTL1 CTL2 Loading motor Sled motor Others Spindle mode L L off off off off L H on on off FG and Hall bias on H L off on on block commutation H H off on on True-Silent commutation 8. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Voltages VDD(SPN) spindle driver supply voltage −0.5 +16 V VDD(SLD) sled driver supply voltage −0.5 +16 V VDD(LD) loading driver supply voltage −0.5 +16 V VDD(ACT) actuator drivers supply voltage −0.5 +16 V VDDA system supply voltage −0.5 +6.5 V IDD(SPN) current on pins 12, 14 and 16 - 2.1 A IDD(SLD) current on pins 33, 34, 35, 36, 37 and 38 - 1.2 A IDD(ACT) current on pins 39, 40, 41, 42, 45, 46, 47 and 48 - 2.0 A IHALL current on pins 1, 2, 3, 4, 5 and 6 −1 +1 mA IHBIAS current on pin 7 −1 +100 mA IRPROG current on pins 8, 9 and 10 −1 +1 mA IOD current on pins 18 and 28 −1 +10 mA IDIG current on pins 26 and 27 −1 +1 mA ICPUMP current on pins 23, 24 and 25 −20 +20 mA Currents 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 13 of 24 SA56202 Philips Semiconductors One-chip motor driver Table 4: Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter ISTEER Conditions Min Max Unit current on pins 20, 21, 29, 30, 50, 51, 52 and 28 −1 +1 mA IDIODE current on pins 54 and 55 −1 +1 mA IOSC current on pin 56 −20 +20 mA Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C Tj junction temperature −40 +160 °C General Electrostatic discharge voltage Vesd(HBM) human body model [1] pins 1 to 6 and 8 to 56 pin 7 Vesd(MM) [2] machine model - 1500 V - 1000 V - 150 V [1] Class 1, equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] Class 1, equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor. 9. Thermal characteristics Table 5: Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient multilayer PCB, no airflow 33 K/W 001aaa428 4 PD (W) 3 2 1 0 0 50 100 150 Tamb (°C) Fig 12. Maximum dissipation as a function of ambient temperature. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 14 of 24 SA56202 Philips Semiconductors One-chip motor driver 10. Characteristics Table 6: Characteristics Tamb = 25 °C; VDDA = 5 V; VDD(SPN) = 12 V; VDD(SLD) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Spindle motor driver VDDA system supply voltage 4.5 5.0 5.5 V VDD(SPN) motor supply voltage 4.5 12 14 V VIO input offset voltage Hall amplifier −3.5 - +3.5 mV Vi input voltage range Hall amplifier 0 - VDDA V Vi(dif)(p-p) Hall amplifier differential input voltage (peak-to-peak value) 25 - - mV VHBIAS voltage on pin HBIAS IHBIAS = 32 mA - 0.6 0.9 V fosc oscillator frequency RREF = 47 kΩ; COSC = 70 pF - 18 - MHz fPWM PWM frequency RREF = 47 kΩ; COSC = 70 pF - 70 - kHz Rds(on) D-MOSFET on-resistance (high or low) - 0.35 0.50 Ω VVINREF reference voltage on pin VINREF 1.2 1.65 2.5 V VVINSPN torque control voltage on pin VINSPN 0 - VDDA V Stepper motor driver VDDA supply voltage 4.5 5.0 5.5 V VDD(SLD) motor supply voltage 4.5 12 14 V IDD(SLD) motor current limit Rsense = 0.5 Ω 0.85 1.0 1.15 A fPWM PWM frequency RREF = 47 kΩ; COSC = 70 pF - 70 - kHz Vi(trip) input dead-zone trip level 15 30 45 mV gm transconductance gain 0.85 1.0 1.15 A/V Rds(on) D-MOSFET on-resistance (high or low) - 1.0 1.4 Ω 4.5 12 14 V Rsense = 0.5 Ω Loading motor driver VDD(LD) motor supply voltage IDD(LD) current limit (high or low) 0.9 1.2 2.0 A VOO output offset voltage −100 0 +100 mV Gv voltage gain 16.8 17.6 18.4 dB Rds(on) D-MOSFET on-resistance (high or low) - 0.6 0.9 Ω Actuator driver (focus, tracking and tilt) VDD(ACT) supply voltage 4.5 5 14 V IDD(ACT) current limit (high or low) 0.9 1.2 2.0 A VOO output offset voltage −55 0 +55 mV Gv voltage gain 16.8 17.6 18.4 dB Gv(m) gain mismatch between 3 channels - - 5 % 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 15 of 24 SA56202 Philips Semiconductors One-chip motor driver Table 6: Characteristics …continued Tamb = 25 °C; VDDA = 5 V; VDD(SPN) = 12 V; VDD(SLD) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; unless otherwise specified. Symbol Parameter Rds(on) Conditions Min Typ Max Unit D-MOSFET on-resistance (high or low) - 0.6 0.9 Ω VCP3 charge pump output voltage - 18.2 - V VIH HIGH-level input voltage digital on pins 26 and 27 2.0 - - V VIL LOW-level input voltage digital on pins 26 and 27 - - 0.8 V VOL LOW-level output voltage digital on pins 18 and 28 IOL = 2 mA - - 0.5 V General IDDA(q) VDDA quiescent current CTL1 = H; CTL2 = H - 14 20 mA IDD(SPN)(q) VDD(SPN) quiescent current CTL1 = H; CTL2 = H - 9 15 mA IDD(SLD)(q) VDD(SLD) quiescent current CTL1 = H; CTL2 = H - 0 1 mA IDD(ACT)(q) VDD(ACT) quiescent current CTL1 = H; CTL2 = H - 16 25 mA ISTB(tot) total standby current CTL1 = L; CTL2 = L - 4.5 8 mA TTEMP thermal warning temperature - 150 - °C Thys(TEMP) thermal warning hysteresis - 10 - °C TSD thermal shutdown temperature - 160 - °C Thys(SD) thermal shutdown hysteresis - 30 - °C 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 16 of 24 SA56202 Philips Semiconductors One-chip motor driver 11. Application information 5V 150 Ω 1 HALL U REVERSE DETECTION 2 3 HALL V HALL AMP 4 56 OSCILLATOR 54 5 0V 53 52 51 50 49 6 HALL W 7 RREF 47 kΩ 9 10 RLIM 0V VINREF LEVEL SHIFT VINREF LEVEL SHIFT 12 V 46 43 3.3 V SPINDLE LOGIC VINREF LEVEL SHIFT 0V spindle input VINREF LEVEL SHIFT 1.65 V 5V 38 22 nF 25 M ADC VINREF 36 35 SLED LOGIC 26 47 kΩ 3.3 V 27 28 0.5 Ω 34 33 32 CHARGE PUMP 31 47 kΩ MUTE/ SELECT 0V sled motor 37 23 24 0.5 Ω FG 22 10 nF tilt actuator 39 19 21 tracking actuator 40 17 20 5V 41 15 18 0V 42 13 16 12 V 47 kΩ focus actuator 45 44 14 0V tray motor M 12 spindle motor tray motor in focus in tracking in tilt in 12 V 47 CURRENT REFERENCE 11 0V 48 HALL BIAS 8 REMF 0V 55 THERMAL SHUTDOWN FG 70 pF MUTE/ STANDBY FUNCTIONS SA56202 30 12 V 0V sled in2 VINREF 47 kΩ 29 sled in1 VINREF 001aaa430 For REMF and RLIM see Section 7. Fig 13. Application diagram. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 17 of 24 SA56202 Philips Semiconductors One-chip motor driver 12. Package outline HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad D SOT793-1 A E X c y exposed die pad v M A HE Dh Z 56 29 (A 3) A A2 Eh θ A1 pin 1 index Lp L detail X 1 28 w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) Dh E (2) Eh e HE L Lp v w y Z (1) θ mm 1.2 0.15 0.05 1.05 0.80 0.25 0.27 0.17 0.20 0.09 14.1 13.9 4.3 4.1 6.2 6.0 4.3 4.1 0.5 8.3 7.9 1 0.8 0.4 0.2 0.08 0.1 0.4 0.1 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT793-1 143E36T MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 03-03-04 Fig 14. Package outline. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 18 of 24 SA56202 Philips Semiconductors One-chip motor driver 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 19 of 24 SA56202 Philips Semiconductors One-chip motor driver – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 13.5 Package related soldering information Table 7: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 12772 Preliminary data sheet not suitable © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 20 of 24 SA56202 Philips Semiconductors One-chip motor driver [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 21 of 24 SA56202 Philips Semiconductors One-chip motor driver 14. Revision history Table 8: Revision history Document ID Release date Data sheet status Change notice Order number Supersedes SA56202_1 20040719 Preliminary data sheet - 9397 750 12772 - 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 22 of 24 SA56202 Philips Semiconductors One-chip motor driver 15. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 16. Definitions 17. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 18. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 12772 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 19 July 2004 23 of 24 SA56202 Philips Semiconductors One-chip motor driver 19. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Spindle motor control . . . . . . . . . . . . . . . . . . . . 6 Internal regeneration of back-EMF spindle motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Sine generation using 3-phase PWM signals . . 8 Programming RLIM . . . . . . . . . . . . . . . . . . . . . . 9 Programming REMF . . . . . . . . . . . . . . . . . . . . . 10 FG generator . . . . . . . . . . . . . . . . . . . . . . . . . 10 Sled motor driver . . . . . . . . . . . . . . . . . . . . . . 11 Loading motor driver. . . . . . . . . . . . . . . . . . . . 12 Actuator motor drivers . . . . . . . . . . . . . . . . . . 12 Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal protection . . . . . . . . . . . . . . . . . . . . . 12 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Muting functions . . . . . . . . . . . . . . . . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal characteristics. . . . . . . . . . . . . . . . . . 14 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application information. . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20 Package related soldering information . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Contact information . . . . . . . . . . . . . . . . . . . . 23 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 19 July 2004 Document order number: 9397 750 12772 Published in The Netherlands