INTEGRATED CIRCUITS DATA SHEET SAA6581T RDS/RBDS demodulator Product specification File under Integrated Circuits, IC01 2001 May 07 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T FEATURES APPLICATIONS • Integrated switched capacitor filter • Demodulates European Radio Data System (RDS) or the USA Radio Broadcast Data System (RBDS) signals The RDS/RBDS system offers a large range of applications from the many functions that can be implemented. For car radios the most important are: • Oscillator frequencies: 4.332 or 8.664 MHz • Program Service (PS) name • Traffic Program (TP) identification • Integrated ARI clamping • Traffic Announcement (TA) signal • CMOS device • Alternative Frequency (AF) list • Single supply voltage: 5 V • Program Identification (PI) • Extended temperature range: −40 to +85 °C • Enhanced Other Networks (EON) information. • Low number of external components. GENERAL DESCRIPTION The RDS/RBDS demodulator is a CMOS device with integrated filtering and demodulating of RDS/RBDS signals coming from a multiplexed input data stream. Data signal RDDA and clock signal RDCL are provided as outputs for further processing by a suitable microcomputer, for example CCR921 and CCR922. The SAA6581T replaces SAA6579 in function and pin-compatibility. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VDDA analog supply voltage VDDD digital supply voltage 4.0 5.0 5.5 V IDD(tot) total supply current − 6.0 − mA Vi(MPX) RDS input sensitivity at pin MPX 1 − − mV fi(xtal) crystal input frequency − 4.332 − MHz − 8.664 − MHz 4.0 5.0 5.5 V ORDERING INFORMATION TYPE NUMBER SAA6581T 2001 May 07 PACKAGE NAME SO16 DESCRIPTION plastic small outline package; 16 leads; body width 7.5 mm 2 VERSION SOT162-1 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T BLOCK DIAGRAM 560 pF handbook, full pagewidth +5 V C6 SCOUT 8 CIN VDDD 7 12 C7 100 nF 10 SYNC multiplex input C1 MPX 4 330 pF 16 RDCL 57 kHz 8th ORDER BANDPASS FILTER CLOCKED COMPARATOR RDS/RBDS DEMODULATOR SIGNAL QUALITY DETECTOR SAA6581T +5 V C2 100 nF VDDA 5 POWER SUPPLY AND RESET 6 VSSA TEST CONTROL 3 Vref 15 TCON 1 QUAL OSCILLATOR AND CLOCK 9 MODE C3 2.2 µF 13 14 OSCI OSCO C4 47 pF Fig.1 Block diagram. 2001 May 07 2 RDDA 3 Q1 C5 56 pF 11 VSSD MHB899 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T PINNING SYMBOL PIN DESCRIPTION QUAL 1 signal quality indication output RDDA 2 RDS data output Vref 3 reference voltage output (1/2VDDA) handbook, halfpage QUAL 1 16 RDCL RDDA 2 15 TCON Vref 3 14 OSCO MPX 4 multiplex signal input VDDA 5 analog supply voltage (5 V) VSSA 6 analog ground (0 V) CIN 7 comparator input SCOUT 8 switched capacitor filter output VDDA 5 12 VDDD MODE 9 oscillator frequency select input VSSA 6 11 VSSD SYNC 10 ARI clamping control input CIN 7 10 SYNC VSSD 11 digital ground (0 V) SCOUT 8 9 MODE VDDD 12 digital supply voltage (5 V) OSCI 13 oscillator input OSCO 14 oscillator output TCON 15 test control input RDCL 16 RDS clock output MPX 4 13 OSCI SAA6581T MHB900 Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION Demodulator functions include: RDS/RBDS signal demodulation • 57 kHz carrier regeneration from the two sidebands (Costas loop) BANDPASS FILTER • Symbol integration over one RDS clock period The bandpass filter has a centre frequency of 57 kHz. It selects the RDS/RBDS sub-band from the multiplex signal MPX and suppresses the audio signal components. The filter block contains an analog anti-aliasing filter at the input followed by an 8th order switched capacitor bandpass filter and a reconstruction filter at the output. • Bi-phase symbol decoding • Differential decoding • Synchronization of RDS/RBDS output data. The RDS/RBDS demodulator recovers and regenerates the continuously transmitted RDS/RBDS data stream in the MPX signal and provides clock RDCL for the output signals and data output RDDA for further processing by an RDS/RBDS decoder, for example CCR921 or CCR922. CLOCKED COMPARATOR The comparator digitizes the output signal from the 57 kHz bandpass filter for further processing by the digital RDS/RBDS demodulator. To attain high sensitivity and to avoid phase distortion, the comparator input stage has automatic offset compensation. ARI CLAMP The demodulator checks the input signal for presence of RDS only, or RDS plus ARI transmissions. After a fixed test period, if the SYNC input is set HIGH the demodulator locks in the ‘verified’ condition (see Table 1). If SYNC is set LOW, the ARI clamping is reset (disabled). After SYNC returns to HIGH, the demodulator resumes checking the input signal. DEMODULATOR The demodulator provides all functions of the SAA6579 and improves performance under weak signal conditions. 2001 May 07 4 Philips Semiconductors Product specification RDS/RBDS demodulator Table 1 SAA6581T Table 2 Control pin SYNC Control pins TCON and MODE SYNC ARI CLAMPING TCON MODE LOW internal ARI clamping disabled HIGH LOW 4.332 MHz HIGH ARI clamping allowed to be logged HIGH HIGH 8.664 MHz SIGNAL QUALITY DETECTION OSCILLATOR FREQUENCY The clock generator generates the internal 4.332 MHz system clock and timing signal derivatives. Output QUAL indicates the safety of the regenerated RDS data (HIGH = ‘good’ data; LOW = ‘unsafe’ data). Power supply and internal reset Oscillator and system clock generator The demodulator has separate power supply inputs for the digital and analog parts of the device. For the analog functions an additional reference voltage (1⁄2VDDA) is internally generated and available via the output pin Vref. The demodulator requires a defined reset condition. The demodulator generates automatically a reset signal after the power supply VDDA is switched on, or at a voltage-drop. For good performance of the bandpass and demodulator stages, the demodulator requires a crystal oscillator with a frequency of 4.332 or 8.664 MHz. The demodulator can operate with either frequency (see Table 2), so that a radio set with a microcontroller can run, in this case, with one crystal only. The demodulator oscillator can drive the microcontroller, or vice versa. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS VDD supply voltage Vn voltage at pins 1 to 4, 7 to 10, and 13 to 16 with respect to pins 6 and 11 Ii input current at pins 1 to 5, 7 to 11 and pins 6 and 11 are 13 to 16 connected to ground Ilu(prot) latch-up protection current in pulsed mode MIN. MAX. UNIT 0 6.5 −0.5 VDD + 0.5 ≤ 6.5 V −10 +10 mA Tamb = −40 to +85 °C with voltage limiting −2 to +10 V −100 +100 mA Tamb = 25 °C with voltage limiting −2 to +12 V −200 +200 mA Tamb = −40 to +85 °C without voltage limiting −10 +10 mA pins 5 and 12 are connected to VDD V Tamb ambient temperature −40 +85 °C Tstg storage temperature −65 +150 °C Ves electrostatic handling voltage note 1 −4000 +4000 V note 2 −500 +500 V Notes 1. Human body model (equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor). 2. Machine model (equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor and 0.75 µH inductance). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) 2001 May 07 PARAMETER CONDITIONS thermal resistance from junction to ambient in free air 5 VALUE UNIT 104 K/W Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T CHARACTERISTICS: DIGITAL PART VDDA = VDDD = 5 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDD digital supply voltage 4.0 5.0 5.5 V IDDD digital supply current − 1.5 − mA Ptot total power dissipation − 30 − mW VIL LOW-level input voltage at pins TCON, OSCI, SYNC and MODE − − 0.3VDDD V VIH HIGH-level input voltage at pins TCON, OSCI, SYNC and MODE 0.7VDDD − − V Ii(pu) input pull-up current at pins TCON and MODE VIH = 3.5 V −10 −20 − µA VOL LOW-level output voltage at pins QUAL, RDDA and RDCL IOL = 2 mA − − 0.4 V VOH HIGH-level output voltage at pins QUAL, RDDA and RDCL IOH = −0.02 mA 4.0 − − V TCON = HIGH; MODE = LOW − 4.332 − MHz TCON = HIGH; MODE = HIGH − 8.664 − MHz − − 30 × 10−6 − − 30 × 10−6 Inputs Outputs Crystal parameters fi(xtal) crystal input frequency ∆fosc adjustment tolerance of oscillator frequency ∆fosc(T) temperature drift of oscillator frequency CL load capacitance − 30 − pF Rxtal crystal resonance resistance − − 120 Ω 2001 May 07 Tamb = −40 to +85 °C 6 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T CHARACTERISTICS: ANALOG PART VDDA = VDDD = 5 V; Tamb = 25 °C; measurements taken in Fig.1; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDA analog supply voltage 4.0 5.0 5.5 V VDDA − VDDD difference between analog and digital supply voltages − 0 0.5 V IDD(tot) total supply current − 6.0 − mA Vref reference voltage 2.25 2.5 2.75 V Zo(Vref) output impedance at pin Vref − 25 − kΩ 1 − − mV VDDA = 5 V MPX input (signal before the capacitor on pin MPX) Vi(MPX)(rms) RDS amplitude (RMS value) Vi(max)(p-p) maximum input signal capability (peak-to-peak value) Ri(MPX) input resistance ∆f = ±1.2 kHz RDS-signal; ∆f = ±3.2 kHz ARI-signal f = 57 ±2 kHz 200 − − mV f < 50 kHz 1.4 − − V f < 15 kHz 2.8 − − V f > 70 kHz 3.5 − − V f = 0 to 100 kHz 40 − − kΩ Tamb = −40 to +85 °C 56.5 57.0 57.5 kHz 2.5 3.0 3.5 kHz 17 20 23 dB 57 kHz bandpass filter fc centre frequency B−3dB −3 dB bandwidth GSCOUT-MPX signal gain αsb stop band attenuation Ro(SCOUT) output resistance at pin SCOUT f = 57 kHz ∆f = ±7 kHz 31 − − dB f < 45 kHz 40 − − dB f < 20 kHz 50 − − dB f > 70 kHz 40 − − dB f = 57 kHz − 30 60 Ω f = 57 kHz − 1 10 mV 70 110 150 kΩ Comparator input (pin CIN) Vi(min)(rms) minimum input level (RMS value) Ri input resistance 2001 May 07 7 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T TIMING DATA tCLKH handbook, full pagewidth RDCL td(clk) TCLK td(clk) RDDA MHB901 Tbit(slipped) Fig.3 RDS timing diagram including a phase change. Table 3 RDS timing (see Fig.3) SYMBOL PARAMETER TYP. UNIT td(clk) clock-data delay 4 µs TCLK clock period 842 µs tCLKH clock HIGH time 421 µs Tbit(slipped) slipped data bit period 1263 µs 2001 May 07 8 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 8 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 2001 May 07 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 9 o 8 0o Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Wave soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. 2001 May 07 10 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 May 07 11 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 May 07 12 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T NOTES 2001 May 07 13 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T NOTES 2001 May 07 14 Philips Semiconductors Product specification RDS/RBDS demodulator SAA6581T NOTES 2001 May 07 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753503/01/pp16 Date of release: 2001 May 07 Document order number: 9397 750 08148