TI TUSB2551PWR

TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
FEATURES
1
12
4
11
5
10
6
9
7
8
VCC(5.0)
VPU(3.3)
Vreg(3.3)
D+
D–
OE
SUSPEND
RGT PACKAGE
(BOTTOM VIEW)
APPLICATIONS
•
•
•
3
Cellular Phones
Personal Digital Assistants (PDAs)
Handheld Computers
VM
4
VP
3
RCV
2
SPEED
1
NC
•
13
SUSPEND
•
14
2
5
6
7
8
GND
(Exposed die pad)
16
15
14
9
OE
10
D–
11
D+
12
Vreg(3.3)
13
VPU(3.3)
•
1
VCC(5.0)
•
SPEED
RCV
VP
VM
SOFTCON
GND
GND
•
VCC(I/O)
VCC(I/O)
•
PW PACKAGE
(TOP VIEW)
SOFTCON
•
Complies With Universal Serial Bus
Specification Rev. 2.0 (USB 2.0)
Transmits and Receives Serial Data at Both
Full-Speed (12-Mbit/s) and Low-Speed
(1.5-Mbit/s) Data Rates
Integrated Bypassable 5-V to 3.3-V Voltage
Regulator for Powering Via USB VBUS
Low-Power Operation, Ideal for Portable
Equipment
Meets the IEC-61000-4-2 Contact (±9KV) and
Air-gap (±9KV) ESD Ratings
Separate I/O Supply With Operation Down to
1.65 V
Very-Low Power Consumption to Meet USB
Suspend Current Requirements
No Power-Supply Sequencing Requirements
NC
•
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
The TUSB2551 is a single-chip transceiver that complies with the physical-layer specifications of universal serial
bus (USB) 2.0. The device supports both full-speed (12-Mbit/s) and low-speed (1.5-Mbit/s) operation. The
TUSB2551 delivers superior edge rate control, producing crisper eye diagrams, which ease the task of passing
USB compliance testing.
A dual supply-voltage operation allows the TUSB2551 to reference the system interface I/O signals to a supply
voltage down to 1.6 V, while independently powered by the USB VCC(5.0). This allows the system interface to
operate at its core voltage without the addition of buffering logic, and also reduce system operating current.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RGT
Reel of 2000
TUSB2551RGTR
ZWT
TSSOP – PW
Reel of 3000
TUSB2551PWR
TU2551
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
BLOCK DIAGRAM
To Internal
Circuitry
LDO
Regulator
VCC(I/O)
VCC(5.0)
Vreg(3.3)
VPU(3.3)
SOFTCON
D+
SPEED
OE
D–
Level
Translator
RCV
VP
VM
SUSPEND
GND
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
TERMINAL FUNCTIONS
TERMINAL
RGT
NO.
PW
NO.
I/O
VCC(I/O)
15
1
I
System interface supply voltage. Used to provide reference supply voltage for system I/O
interface signaling.
SPEED
1
2
I
Speed. Edge-rate control: A logic HIGH operates at edge rates for full-speed operation. A
logic LOW operates at edge rates for low-speed operation.
RCV
2
3
O
Receive data. Output for USB differential data.
VP
3
4
I/O
If OE = 1, VP = Receiver output (+)
If OE = 0, VP = Driver input (+)
VM
4
5
I/O
If OE = 1, VM = Receiver output (–)
If OE = 0, VM = Driver input (–)
SOFTCON
5
6
I
GND
6
7
SUSPEND
7
8
NAME
DESCRIPTION
Soft connect. Controls state of VPU(3.3). Refer to VPU(3.3) pin description for details.
Ground reference
I
Suspend. Active high. Turns off internal circuits to reduce supply current.
NC
8, 16
No internal connection
OE
9
9
I
D–, D+
10, 11
10, 11
I/O
Differential data lines conforming to the USB standard
Vreg(3.3)
12
12
O
3.3-V reference supply. Requires a minimum 0.1-µF decoupling capacitor for stability. A
1-µF capacitor is recommended.
VPU(3.3)
13
13
O
Pullup supply voltage. Used to connect 1.5-kΩ pullup speed detect resistor. If SOFTCON =
1, VPU(3.3) is high impedance. If SOFTCON = 0, VPU(3.3) = 3.3 V.
VCC(5.0)
14
14
I
USB bus supply voltage. Used to power USB transceiver and internal circuitry.
Output enable. Active low. Enables the transceiver to transmit data onto the bus. When
inactive, the transceiver is in the receive mode.
FUNCTIONAL DESCRIPTION
FUNCTION SELECTION
(1)
SUSPEND
OE
D+, D–
RCV
VP, VM
0
0
Driving
Active
Active
Normal transmit mode
FUNCTION
0
1
Receiving
Active
Active
Normal receive mode
1
0
Hi-Z
0
Not active
1
1
Hi-Z
0
Active
Low power state
Receiving during suspend (low power state) (1)
During suspend, VP and VM are active in order to detect out-of-band signaling conditions.
TRUTH TABLE DURING NORMAL MODE
OE = 0
INPUT
OUTPUT
RESULT
VP
VM
D+
D–
RCV
0
0
0
0
X (1)
SE0
0
1
0
1
0
Logic 0
1
0
1
0
1
Logic 1
1
(1)
1
1
1
X
Undefined
D+
D–
VP
VM
RCV
0
0
0
0
X (1)
SE0
0
1
0
1
0
Logic 0
1
0
1
0
1
Logic 1
1
(1)
OE = 1
Input
1
(1)
Output
1
1
X
RESULT
Undefined
X = Undefined
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
3
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
Power-Supply Configurations
The TUSB2551 can be used with different power-supply configurations, which can be dynamically changed. An
overview is given in Table 1.
• Normal mode – Both VCC(I/O) and VCC(5.0) or VCC(5.0) and Vreg(3.3) are connected. For 5-V operation, VCC(5.0) is
connected to a 5-V source (4 V to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB
connections. For 3.3-V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3-V source (3 V to 3.6 V).
VCC(I/O) is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of
the external circuit.
• Disable mode – VCC(I/O) is not connected; VCC(5.0) or VCC(5.0) and Vreg(3.3) are connected. In this mode, the
internal circuits of the TUSB2551 ensure that the D+ and D– pins are in 3-state, and the power consumption
drops to the low-power (suspended) state level. Some hysteresis is built into the detection of VCC(I/O) lost.
• Sharing mode – VCC(I/O) is connected; VCC(5.0) and Vreg(3.3) are not connected. In this mode, the D+ and D–
pins are made 3-state, and the TUSB2551 allows external signals of up to 3.6 V to share the D+ and D–
lines. The internal circuits of the TUSB2551 ensure that virtually no current (maximum 10 mA) is drawn via
the D+ and D– lines. The power consumption through VCC(I/O) drops to the low-power (suspended) state level.
Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is
built into the detection of Vreg(3.3) lost.
Table 1. Power-Supply Configuration Overview
Configuration Mode
VBUS/VTRM
VIF
Notes
Normal
Connected
Connected
Normal supply configuration and operation.
Disconnect
(D+/D– sharing)
Open
Connected
VP/VM are HIGH outputs, RCV is LOW.
With OE# = 0 and SUSPEND = 1, data lines may be
driven with
external devices up to 3.6 V.
With D+, D– floating, ICC(I/O) draws less than 1 µA.
Disconnect
Ground
Connected
VP/VM are HIGH outputs, RCV is LOW.
With D+, D– floating, ICC(I/O)F draws less than 1 µA.
Disable Mode
Connected
Open
Prohibited
Connected
Ground
Logic controlled inputs pins are Hi-Z
Prohibited condition
Table 2. Pin States in Disable or Sharing Mode
PINS
DISABLE-MODE STATE
SHARING-MODE STATE
VCC(5.0)/Vreg(3.3)
5-V input/3.3-V output, 3.3-V input/3.3-V input
Not present
VCC(I/O)
Not present
1.65-V to 3.6-V input
VPU(3.3)
High impedance (off)
High impedance (off)
D+, D–
High impedance
High impedance
VP, VM
Invalid (1)
H
RCV
Invalid (1)
L
Inputs (SPEED, SUSPEND, OE, SOFTCON)
High impedance
High impedance
(1)
4
High impedance or driven LOW
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
Power-Supply Input Options
The TUSB2551 has two power-supply input options.
• Internal regulator – VCC(5.0) is connected to 4 V to 5.5 V. The internal regulator is used to supply the internal
circuitry with 3.3 V (nominal). Vreg(3.3) becomes a 3.3-V output reference.
• Regulator bypass – VCC(5.0) and Vreg(3.3) are connected to the same supply. The internal regulator is bypassed,
and the internal circuitry is supplied directly from the Vreg(3.3) power supply. The voltage range is
3 V to 3.6 V to comply with the USB specification.
The supply-voltage range for each input option is specified in Table 3.
Table 3. Power-Supply Input Options
INPUT OPTION
VCC(5.0)
Vreg(3.3)
VCC(I/O)
Internal regualtor
Supply input for internal regulator
(4 V to 5.5 V)
Voltage-reference output
(3.3 V, 300 µA)
Supply input for digital I/O pins
(1.4 V to 3.6 V)
Regulator bypass
Connected to Vreg(3.3) with
maximum voltage drop of 0.3 V
(2.7 V to 3.6 V)
Supply input
(3 V to 3.6 V)
Supply input for digital I/O pins
(1.4 V to 3.6 V)
Electrostatic Discharge (ESD)
PIN NAME
ESD
IEC61000-4-2, Air-Gap Discharge
D+, D–, VCC(5.0)
All other pins
IEC61000-4-2, Contact Discharge
TYP
±9
±9
Human-Body Model
±15
Human-Body Model
±2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
UNIT
kV
kV
5
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC(5.0)
Supply voltage range
–0.5
6
V
VCC(I/O)
I/O supply voltage range
–0.5
4.6
V
Vreg(3.3)
Regulated voltage range
–0.5
4.6
VI
DC input voltage range
–0.5
VCC(I/O) + 0.5
mA
IO(D+, D-)
Output Current (D+, D-)
±50
mA
IO
Output Current (all others)
±15
mA
II
Input Current
±50
mA
Tstg
Storage temperature range
150
°C
(1)
–65
UNIT
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
UNIT
VCC(5.0)
Supply voltage, internal regulator option
PARAMETER
5-V operation
TEST CONDITIONS
4
5
5.25
V
Vreg(3.3)
Supply voltage, regulator bypass option
3.3-V operation
3
3.3
3.6
V
VCC(I/O)
I/O supply voltage
3.6
V
1.65
VIL
Low-level input voltage
(1)
VCC(I/O) –0.3
0.15 VCC(I/O)
V
VIH
High-level input voltage (1)
0.85 VCC(I/O)
VCC(I/O) + 0.3
V
D+, D–
Input voltage on analog I/O pins
0
3.6
V
Tc
Junction temperature range
–40
85
°C
(1)
6
Specification applies to the following pins: SUSPEND, SPEED, RCV, SOFTCON, VP, VM, OE
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
DC ELECTRICAL CHARACTERISTICS SYSTEM AND USB INTERFACE (1)
VCC(I/O) = 3.6 V, VCC(5.0) = 5 V (unless otherwise noted), TA = 25 C. Bold indicates specifications over temperature, –40°C to
85°C
PARAMETER
VOH
High-level output
voltage (2)
VOL
Low-level output
voltage (2)
IIL
Input leakage current
ICC(I/O)
ICC(5.0)
TEST CONDITIONS
MIN
IOH = 20 µA
TYP
MAX
0.9 VCC(I/O)
V
IOL = 20 µA
(2)
–5
0.1
V
1.5
5
µA
SPEED
SUSPEND
OE
1
0
1
1
5
1
0
0
1
5
0
0
1
1
5
0
0
0
1
5
0
1
0
VCC(I/O) supply current
VCC(5.0) supply current
VOLTAGE
VCC(5.0) =
5.25 V,
VCC(I/O) =
3.6 V
LOAD
µA
1
5
1
2
mA
260
280
µA
1
0
0
f = 6 MHz,
CL = 50 pF
0
0
0
f = 750 kHz,
CL = 600 pF
1
0
1
800
1100
1
0
0
3000
5000
0
0
1
230
350
0
0
0
400
700
0
1
0
130
200
1
0
0
f = 6 MHz,
CL = 50 pF
6
10
0
0
0
f = 750 kHz,
CL = 600 pF
4..3
5
VCC(5.0) =
5.25 V,
VCC(I/O) =
3.6 V
UNIT
µA
mA
IPU(3.3)LEAK
VPU(3.3) leakage current SOFTCON = 1, VPU(3.3) = 0 V
–5
5
µA
ICC(I/O)LEAK
VCC(I/O) leakage current VCC(I/O) = 3.6 V, VCC(5.0) = 0 V
–5
5
µA
VPU(3.3)
Pullup output voltage
Ireg(3.3) = 200 µA, VCC(5.0) = 4 V to 5.25 V
3.6
V
RSW
VPU(3.3) switch
resistance
Ireg(3.3) = 10 mA, VCC(5.0) = 4 V to 5.25 V
10
10 pulses
±9
10 pulses
±9
3
3.3
Ω
ESD PROTECTION
IEC-61000-4- Air-Gap Discharge
2
(D+, D–,
Contact Discharge
VCC(5.0) only)
(1)
(2)
kV
Specification for packaged product only
Specification applies to the following pins: RCV, VP, VM, OE.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
7
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
DC ELECTRICAL CHARACTERISTICS TRANSCEIVER (1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LEAKAGE CURRENT
ILO
Hi-Z state data line leakage (suspend mode)
0 V < VIN < 3.3 V, SUSPEND = 1
–10
10
µA
INPUT LEVELS
VDI
Differential input sensitivity
|(D+) – (D–)|
0.2
VCM
Differential common mode range
Includes VDI range
0.8
2.5
V
VSE
Single-ended receiver threshold
0.8
2
V
Receiver hysteresis
V
200
mV
OUTPUT LEVELS
VOL
Static output low
RL = 1.5 kΩ to 3.6 V
VOH
Static output high
RL = 15 kΩ to GND
2.8
0.3
V
3.6
V
CAPACITANCE
CIN
Transceiver capacitance
Pin to GND
ZDRV
Driver output resistance
Steady-state drive
(1)
8
10
1
6
pF
11
Ω
Specification for packaged product only
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
AC ELECTRICAL CHARACTERISTICS (1)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
DRIVER CHARACTERISTICS (LOW SPEED)
TR
Transition rise time
CL = 200 pF, See Figure 2
CL = 600 pF
75
300
ns
TF
Transition fall time
CL = 200 pF, See Figure 2
CL = 600 pF
75
300
ns
LRFM
Rise/fall time matching
TR, TF
VCRS
Output signal crossover voltage
80
125
%
1.3
2
V
DRIVER CHARACTERISTICS (FULL SPEED)
TR
Transition rise time
CL = 50 pF, See Figure 2
4
20
ns
TF
Transition fall time
CL = 50 pF, Figure 2
4
20
ns
FRFM
Rise/fall time matching
(TR, TF)
90
111.1
%
VCRS
Output signal crossover voltage
1.3
2
V
15
ns
TRANSCEIVER TIMING (FULL SPEED)
tPVZ
OE to receiver 3-state delay
See Figure 1
tPZD
Receiver 3-state to transmit delay
See Figure 1
tPDZ
OE to driver 3-state delay
See Figure 1
tPZV
Driver 3-state to receive delay
See Figure 1
tPLH
tPHL
VP, VM to D+, D– propagation delay
See Figure 4
17
ns
tPLH
tPHL
D+, D– to RCV propagation delay
See Figure 3
17
ns
tPLH
tPHL
D+, D– to VP, VM propagation delay
See Figure 3
10
ns
(1)
15
ns
15
15
ns
ns
Specification for packaged product only
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
9
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
TIMING DIAGRAMS
RECEIVE
TRANSMIT
OE
tPVZ
t PZV
VP/VM
tPZD
tPDZ
D+/D–
Figure 1. Enable and Disable Times
FALL TIME
RISE TIME
Differential
Data Lines
90%
90%
10%
10%
tR
tF
Figure 2. Rise and Fall Times
D+
VCRS
D–
Differential
Data Lines
VCRS
tPHL
tPLH
VOH
VOL
VSS
Figure 3. Receiver Propagation Delay
VOH
VOL
D+
tPLH
tPHL
VCRS
D–
Differential
Data Lines
VCRS
Figure 4. Driver Propagation Delay
10
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
TUSB2551
ADVANCED UNIVERSAL SERIAL BUS TRANSCEIVER
www.ti.com
SCES667 – FEBRUARY 2008
TEST CIRCUITS
D.U.T.
25 pF
Figure 5. Load for VP, VM, RCV
VTRM
15k
D. U. T.
20
15k
CL
Figure 6. Load for D+, D–
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TUSB2551
11
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TUSB2551PW
NRND
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Samples Not Available
TUSB2551PWG4
NRND
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Samples Not Available
TUSB2551PWR
NRND
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Samples Not Available
TUSB2551PWRG4
NRND
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Samples Not Available
TUSB2551RGTR
NRND
QFN
RGT
16
3000
TBD
Call TI
Call TI
Samples Not Available
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TUSB2551PWR
Package Package Pins
Type Drawing
TSSOP
PW
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TUSB2551PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated