MICROSEMI UMX9989AP

UMX9989AP™
DUAL ULTRA LOW MAGNETIC MOMENT
FAST DIODES FOR MRI APPLICATIONS
RoHS compliant
KEY FEATURES
DESCRIPTION
The UMX9989AP is the first MRI switching diode module, designed to optimize
performance and reduce assembly labor, cost, and polarity errors.
There are two principle applications for which the UMX9989AP modules are
intended:
1) MRI receiver protection from high RF energy fields, including long RF pulses
and RF spike pulses present in most MRI machines. The UMX9989AP acts as a
passive protector (limiter) for the MRI receiver’s LNA. The diode assembly
exhibits extremely low insertion loss, both in the “on” state (high power present)
and the “off” state (receiver power present) so the Receiver’s Noise Figure is not
increased by the protector circuit.
2) Passive switching of surface coil detuning and blocking circuits. In this case, the
flow of loop current during transmitter pulse turns on the diodes, without a switch
driver.
 Ultra low magnetic construction
If the UMX9989AP is combined with a PIN diode (UM7201SM) the combination
can be used to implement a semi-active detune or block circuit design. The
UMX9989AP’s turn on the PIN diode (used for higher power switching) during
the sinc(x) sidelobes, before the main pulse of the transmitter waveform, sinc(x) =
[sin (x)]/x, occurs. The mechanical drawing shows the structure of the diode pair.
Manufacture of dual anti-parallel pairs of UMX9989’s ensures that the matched
pair of diodes can be inserted in a coil with the correct diode polarities and with the
minimum parasitic inductance and capacitance, thermal impedance and labor for
the coil manufacturer.
 Low capacitance at 0 V bias
 RoHS compliant
 Matched pairs available
 Surface mount package.
 Metallurgical bond
 Planar passivated chip
 Non cavity design
 Thermally matched configuration
 Low conductance at 0 V bias
 Compatible with automatic
insertion equipment
APPLICATIONS/BENEFITS
 MR passive receiver protection
IMPORTANT:
 MR passive blocking circuits
For the most current data, consult our website: www.MICROSEMI.com
 MR passive detuning circuits
 MR passive disable circuits
ABSOLUTE MAXIMUM RATINGS AT 25º C
(UNLESS OTHERWISE SPECIFIED)
Rating
Symbol
Value
Unit
IFSM
2
A
T stg
-65 to +150
ºC
Operating Temperature
T op
-65 to +150
ºC
Copyright  2007
Rev: 2009-01-19
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
UMX9989AP™
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine wave
Storage Temperature
Page 1
UMX9989AP™
DUAL ULTRA LOW MAGNETIC MOMENT
FAST DIODES FOR MRI APPLICATIONS
RoHS compliant
ELECTRICAL PARAMETERS @ 25C (unless otherwise specified)
Parameter
Symbol
Forward Voltage (Note 1)
VF
Capacitance
CT
Conductance
Parallel Resistance
G
RP
Conditions
Min
IF = 10 µA
IF = 1 A
VR = 0V, F = 1 MHZ
VR = 0 V, F = 64 MHz
VR = 0 V, F = 64 MHz
VR = 0 V, F = 64 MHz
Typ.
Max
±0.38
±1.2
±0.4
±1.4
4
4
12
8
8
80
Units
V
V
pF
pF
uS
kOhms
Note: 1 Short duration test pulse used to minimize self – heating effect
.
ELECTRICAL
Copyright  2007
Rev: 2009-01-19
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 2
UMX9989AP™
DUAL ULTRA LOW MAGNETIC MOMENT
FAST DIODES FOR MRI APPLICATIONS
RoHS compliant
STYLE “UM9989AP” OUTLINE
STYLE “UM9989AP” FOOTPRINT
Copyright  2007
Rev: 2009-01-19
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 3
MECHANICAL
NOTES:
1. These dimensions will match the terminals and provide for additional solder fillets at the outboard ends at
least as wide as the terminals themselves, assuming accuracy of device placement within .005 inches
2. If the mounting method chosen requires use of an adhesive separate from the solder compound, a round (or
square) spot of cement as shown should be centrally located.
3. Dimensions shown are in inches.