D a t a S he et , R e v . 1 . 3 , F e b . 2 00 7 B G A 6 15 L7 Silicon Germanium GPS Low Noise Amplifier S m a l l S i g n a l D i s c r et e s Edition 2007-02-12 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA615L7 BGA615L7 Revision History: 2007-02-12, Rev.1.3 Previous Version: BGA615L7 V1.2 Page Subjects (major changes since last revision) 4 Added moisture sensitivity level 5 Added thermal resistance 6 Adjusted power gain settling times Adjusted inband and out of band compression points 12 Updated recommended land pattern (added solder mask defined layout) 13 Added reel diameter and pcs / reel information Data Sheet 3 Rev.1.3, 2007-02-12 BGA615L7 Silicon Germanium GPS Low Noise Amplifier 1 Silicon Germanium GPS Low Noise Amplifier Features • High gain: 18 dB • Low Noise Figure: 0.9 dB • Power off function • Operating frequency 1575 MHz • Supply voltage: 2.4 V to 3.2 V • Tiny TSLP-7-1 leadless package • B7HF Silicon Germanium technology • RF output internally matched to 50 Ω • Low external component count • 1 kV HBM ESD protection (including AI-pin) • Moisture sensitivity level: MSL 1 6 5 4 7 1 2 3 TSLP-7-1 Application • 1575 MHz GPS VCC PON BIAS BIAS AI AO ESD VSS GND Figure 1 Blockdiagram 2 Description The BGA615L7 is a front-end low noise amplifier for Global Positioning System (GPS) applications. The LNA provides 18 dB gain, 0.9 dB noise figure and high linearity performance, allowing it to be used as a first-stage LNA. Current consumption is as low as 5.6 mA. The BGA615L7 is based upon Infineon Technologies‘ B7HF Silicon Germanium technology. It operates over a 2.4 V to 3.2 V supply range. Type Package Marking Chip BGA615L7 TSLP-7-1 BS T0595 Data Sheet 4 Rev.1.3, 2007-02-12 BGA615L7 Description Pin Definition and Function Table 1 Pin Definition and Function Pin No. Symbol Function 1 AI LNA input 2 BIAS DC bias 3 GND RF ground 4 PON Power on control 5 VCC Supply control 6 AO LNA output 7 VSS DC ground Maximum Ratings Table 2 Maximum Ratings 1) Parameter Symbol Value Unit Voltage at pin VCC VCC VAI VBIAS VAO VPON VSS ICC PIN Ptot TJ TA TSTG VESD -0.3 ... 3.6 V -0.3 ... 0.9 V -0.3 ... 0.9 V -0.3 ... VCC+ 0.3 V -0.3 ... VCC+ 0.3 V -0.3 ... 0.3 V 10 mA 10 dBm Voltage at pin AI Voltage at pin BIAS Voltage at pin AO Voltage at pin PON Voltage at pin VSS Current into pin VCC RF input power Total power dissipation Junction temperature Ambient temperature range Storage temperature range ESD capability all pins (HBM: JESD22A-114) 36 mW 150 °C -30 ... 85 °C -65 ... 150 °C 1000 V 1) All voltages refer to GND-Node. Thermal resistance Table 3 Parameter Thermal resistance Value Unit RthJS 240 Junction - soldering point1) 1) For calculation of RthJA please refer to Application Note Thermal Resistance K/W Data Sheet Symbol 5 Rev.1.3, 2007-02-12 BGA615L7 Electrical Characteristics 3 Electrical Characteristics Table 4 Electrical Characteristics1): TA = 25 °C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1575 MHz Parameter Symbol Supply voltage VCC ICC Values Unit Note / Test Condition Min. Typ. Max. 2.4 2.8 3.2 V - 5.6 - mA ON-mode - 0.2 3 µA OFF-mode 1.5 - 3.2 V ON-mode 0 - 0.5 V OFF-mode - 1.5 3 µA ON-mode - 0 1 µA OFF-mode - 18 - dB High-gain Mode - 0.9 - dB ZS = 50 Ω - 13 - dB - >15 - dB - 35 - dB - 20 - µs OFF- to ON-mode - 50 - µs ON- to OFF-mode Inband input 3rd order intercept IIP3 point - -1 - dBm f1 = 1575 MHz f2 = f1 +/-1 MHz Inband input 1 dB compression IP1dB point - -14 - dBm Supply current Gain switch control voltage Gain switch control current Vpon Ipon 2 Insertion power gain |S21| Noise figure2) NF RLin RLout 1/|S12|2 tS Input return loss Output return loss Reverse isolation 3) Power gain settling time Out of band input 1 dB compression point IP1dB,900M - -9 - dBm f = 806 MHz ... 928 MHz Out of band input 1 dB compression point IP1dB,1650M - -12 - dBm f = 1612 MHz ... 1710 MHz Out of band input 1 dB compression point IP1dB,1900M - -6 - dBm f = 1710 MHz ...1785 MHz f =1850 MHz ...1909 MHz Stability k - > 1.5 - f = 20 MHz ... 10 GHz 1) Measured on BGA615L7 application board including PCB losses (unless noted otherwise) 2) PCB losses subtracted 3) To within 1 dB of the final gain OFF- to ON-mode; to within 3 dB of the final gain ON- to OFF-mode Data Sheet 6 Rev.1.3, 2007-02-12 BGA615L7 Measured Parameters 4 Measured Parameters Typical Measurement Results ON Mode; TA = 25 °C Noise Figure1) NF = f( f ) VCC = 2.8 V 20 1.5 19 1.4 18 1.3 17 1.2 16 NF [dB] |S21|2 [dB] Gain |S21|2 = f( f ) VCC = 2.8 V −30°C 15 14 25°C 13 85°C 1.1 1 0.9 0.8 12 0.7 11 0.6 10 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 0.5 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 Frequency [GHz] Reverse Isolation 1/|S12|2 = f( f ) VCC = 2.8 V Matching |S11|, |S22| = f( f ) VCC = 2.8 V −30 0 −32 −5 −34 |S |, |S | [dB] −36 22 −38 −40 11 1/|S12|2 [dB] S22 −10 −42 −44 S11 −15 −20 −25 −30 −46 −35 −48 −40 −50 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 Frequency [GHz] −45 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 Frequency [GHz] 2 Frequency [GHz] 1) PCB losses subtraced Data Sheet 7 Rev.1.3, 2007-02-12 BGA615L7 Measured Parameters Typical Measurement Results ON Mode vs. Temperature Noise Figure1) NF = f(TA) VCC = 2.8 V 20 1.5 19.5 1.4 19 1.3 18.5 1.2 18 1.1 NF [dB] |S21|2 [dB] Power Gain |S21|2 = f(TA) VCC = 2.8 V 17.5 1 17 0.9 16.5 0.8 16 0.7 15.5 0.6 15 −40 −20 0 20 40 60 80 0.5 −40 100 −20 0 20 40 60 80 100 TA [°C] T [°C] A Supply current ICC = f(TA) VCC = 2.8 V Third Order Input Intercept Point IIP3 = f(TA) VCC = 2.8 V 5 6.5 6.3 2.5 6.1 0 IIP3 [dBm] ICC [mA] 5.9 5.7 5.5 5.3 −2.5 −5 5.1 4.9 −7.5 4.7 4.5 −40 −20 0 20 40 60 80 −10 −40 100 −20 0 20 40 60 80 100 T [°C] T [°C] A A 1) PCB losses subtracted Data Sheet 8 Rev.1.3, 2007-02-12 BGA615L7 Measured Parameters Typical Measurement Results ON Mode vs. Supply Voltage Noise Figure1) NF = f(VCC) TA = 25 °C 20 1.5 19.5 1.4 19 1.3 18.5 1.2 18 1.1 NF [dB] |S21|2 [dB] Power Gain |S21| = f(VCC) TA = 25 °C 17.5 17 1 0.9 16.5 0.8 16 0.7 15.5 0.6 15 2.2 2.4 2.6 2.8 V CC 3 3.2 0.5 2.2 3.4 2.4 2.6 [V] 2.8 V CC Supply current ICC = f(VCC) TA = 25 °C 3 3.2 3.4 [V] Third Order Input Intercept Point IIP3 = f(VCC) TA = 25 °C 6.5 5 6.3 2.5 6.1 0 IIP3 [dBm] ICC [mA] 5.9 5.7 5.5 5.3 −2.5 −5 5.1 4.9 −7.5 4.7 4.5 2.2 2.4 2.6 2.8 V CC 3 3.2 −10 2.2 3.4 [V] 2.4 2.6 2.8 V CC 3 3.2 3.4 [V] 1) PCB losses subtracted Data Sheet 9 Rev.1.3, 2007-02-12 BGA615L7 Application Information 5 Application Information PCB Configuration C2 RFin N1 BGA615L7 AI, 1 AO, 6 RFout L2 VCC, 5 BIAS, 2 VCC C4 GND, 3 L1 PON, 4 C5 PON VSS, 7 C3 C1 Figure 2 Schematic of BGA615L7 Table 5 Bill of Materials Name Value Package Manufacturer Function C1 10 nF 0402 Various LF trap C2 5 pF 0402 Various DC block C3 10 pF 0402 Various Control voltage filtering optional C4 100 pF 0402 Various Supply filtering optional C5 2.2 nF 0402 Various Supply filtering L1 3.3 nH 0402 Various LF trap & input matching L2 100 nH 0402 Various Biasing N1 BGA615L7 PG-TSLP-7-1 Infineon SiGe LNA Data Sheet 10 Rev.1.3, 2007-02-12 BGA615L7 Application Information Application Board Figure 3 Photograph of Application Board Figure 4 Top View of Application Board Figure 5 Detailed View of Application Board Please note that RF-ground is connected via pin 3 only. In order to achieve the same performance as given in this data sheet, it is necessary to provide good RF-grounding on this pin. Furthermore, the LF trap consisting of inductor L1 and capacitor C1 should be placed as close as possible to pin 3. Data Sheet 11 Rev.1.3, 2007-02-12 BGA615L7 Application Information Copper Prepreg FR4 0.100 mm 0.035 mm Prepreg FR4 Copper 0.460 mm FR4 0.100 mm Prepreg FR4 0.100 mm 0.017 mm Prepreg FR4 Copper Cross-Section View of Application Board SMD 1.4 0.25 Solder mask 0.2 0.2 R0.1 Recommended Land Pattern Table 6 Application Notes 0.3 0.3 Stencil apertures Figure 7 0.25 1.9 0.3 Copper Solder mask 0.2 0.2 0.2 0.25 0.3 Copper 0.2 0.25 1.9 1.9 0.2 0.25 0.2 0.2 0.3 0.2 0.2 1.9 0.3 1.4 0.25 0.2 1.4 0.2 NSMD 1.4 0.2 Figure 6 0.017 mm 0.100 mm 0.25 0.25 R0.1 Stencil apertures No. Description AN091 The BGA615L7 Silicon-Germanium Low Noise Amplifier in GPS Applications AN093 The BGA615L7 Silicon-Germanium Low Noise Amplifier with 0201 chip components AN094 The BGA615L7 Silicon-Germanium Low Noise Amplifier for Low-Current GPS Applications A list of all application notes is available at http://goto.infineon.com/smallsignaldiscretes-appnotes. Data Sheet 12 Rev.1.3, 2007-02-12 BGA615L7 Package Information Package Information Top view Bottom view 0.4 +0.1 1.3 ±0.05 0.05 MAX. 1 ±0.05 4 1.7 ±0.05 7 2 1.2 ±0.035 1) 7 3 3 Pin 1 marking 2 ±0.05 5 4 1 6 6 x 0.2 ±0.035 1) 6 5 1.1 ±0.035 1) 6 2 1 6 x 0.2 ±0.035 1) 1) Dimension applies to plated terminal Figure 8 Package Dimensions 0.5 8 2.18 4 Pin 1 marking 1.45 Reel diameter = 180 mm 7500 pcs / reel Figure 9 Tape & Reel Dimensions BS BGA615 Type code 0525 2005, CW 25 Date code (YYWW) Pin 1 marking Laser marking Figure 10 Data Sheet Marking Layout 13 Rev.1.3, 2007-02-12