INTEGRATED CIRCUITS DATA SHEET TZA1027 Analog current buffer for CD-R and CD-RW systems Preliminary specification File under Integrated Circuits, IC01 1999 Sep 17 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 FEATURES • Eight amplifiers for servo and power calibration functions • Gain selector for CD-R and CD-RW discs • Separate data amplifier for read speed up to thirty times nominal data speed. GENERAL DESCRIPTION The TZA1027 is an analog current buffer IC for CD-R and CD-RW systems with a 3-spot push-pull tracking system. The IC interfaces directly to the photo diodes and TZA1020. A HF current amplifier is implemented to detect the actual HF data signal. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 4.5 5.0 5.5 V 0 − 3400 µA VDD supply voltage Ii(cd) central diode input current Ii(sd) satellite diode input current WRON = 1 0 − 520 µA BCAHF bandwidth Ci = 5 pF 72 − − MHz td(f) flatness delay Ci = 5 pF; f = 0.1 to 32 MHz − 30 200 ps GSS servo satellite detector gain HG = 1 − 32 − HG = 0 − 8 − Tamb ambient temperature 0 − 70 WRON = 1 °C ORDERING INFORMATION TYPE NUMBER TZA1027HL 1999 Sep 17 PACKAGE NAME DESCRIPTION VERSION LQFP32 plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm SOT401-1 2 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 BLOCK DIAGRAM handbook, full pagewidth TZA1027 A1 A2 B1 B2 C1 C2 C3 C4 7 23 2 28 6 24 3 27 29 1 22 8 25 5 26 4 + n.c. PDWN WRON HG 19 9, 10, 11, 12, 17, 20, 32 18 21 31 30 A2LF B1LF B2LF C1LF C2LF C3LF C4LF CAHF HFGND GAIN SELECTOR 16 15 13 14 VDDA VDDD AGND DGND Fig.1 Block diagram. 1999 Sep 17 A1LF 3 MGR881 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems PINNING SYMBOL PIN DESCRIPTION C1 1 central photo diode current input A2 2 satellite diode current input B2 3 satellite diode current input C4 4 central photo diode current input C3 5 central photo diode current input B1 6 satellite diode current input A1 7 satellite diode current input C2 8 central photo diode current input n.c. 9 not connected n.c. 10 not connected n.c. 11 not connected n.c. 12 not connected AGND 13 analog ground DGND 14 digital ground VDDD 15 digital power supply VDDA 16 analog power supply n.c. 17 not connected HFGND 18 ground connection of CAHF output stage CAHF 19 central aperture high-frequency output n.c. 20 not connected PDWN 21 digital input power-down C2LF 22 C2 central detector signal output A1LF 23 A1 satellite detector signal output B1LF 24 B1 satellite detector signal output C3LF 25 C3 central detector signal output C4LF 26 C4 central detector signal output B2LF 27 B2 satellite detector signal output A2LF 28 A2 satellite detector signal output C1LF 29 C1 central detector signal output HG 30 digital input high gain selection WRON 31 digital input write on gain selection n.c. 32 not connected 1999 Sep 17 4 TZA1027 Philips Semiconductors Preliminary specification 25 C3LF TZA1027 26 C4LF 27 B2LF 28 A2LF 29 C1LF 30 HG 32 n.c. handbook, full pagewidth 31 WRON Analog current buffer for CD-R and CD-RW systems C1 1 24 B1LF A2 2 23 A1LF B2 3 22 C2LF C4 4 21 PDWN TZA1027HL 18 HFGND C2 8 17 n.c. n.c. Fig.2 Pin configuration. 1999 Sep 17 5 VDDA 16 7 VDDD 15 A1 DGND 14 19 CAHF AGND 13 6 n.c. 12 B1 n.c. 11 20 n.c. n.c. 10 5 9 C3 MGR882 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 FUNCTIONAL DESCRIPTION All detector signals are applied to wide-band amplifiers for servo and laser power calibration functions of the TZA1020. Signals from the central detector are added and amplified to suitable levels for the decoder circuit. Current gain can be selected for CD-R and CD-RW discs. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETERS MIN. MAX. UNIT VDD supply voltage 0 5.5 V Tstg storage temperature −6.5 +150 °C Tamb ambient temperature 0 70 °C Ves electrostatic handling: Machine model −100 +100 V Human body model −500 +500 V THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth(j-a) CONDITION thermal resistance from junction to ambient in free air VALUE UNIT 95 K/W LOGIC FUNCTIONS PDWN WRON HG 1 X; note 1 X; note 1 0 0 0 CD-R read 0 0 1 CD-RW read 0 1 0 CD-R write 0 1 1 CD-RW write Note 1. X = don’t care. 1999 Sep 17 6 MODE power-down Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 CHARACTERISTICS VDDA = VDDD = 5 V; Tamb = 25 °C; Ii(cd) = 25 µA with x = 1LF to 4LF; Ii(sd) = 4 µA with y = A or B and z = 1LF or 2LF; PDWN = 0; WRON = 0; HG = 0 and Ccd = Csd = 5 pF; the given maximum and minimum values are 4σ values; unless otherwise specified. Signals available on the IC pins are upper case. Signals not visible on the IC pins are lower case. SYMBOL PARAMETERS CONDITIONS MIN. TYP. MAX. UNIT Supplies VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V ∆VDD difference between VDDA and VDDD −0.3 − +0.3 V IDDA analog supply current − 0.1 − mA − 13 − mA − 0 − mA − 14 − mA 1.0 − 75 µA IDDD digital supply current PDWN = 1 PDWN = 1 Detector inputs INPUT CURRENT RANGE Ii(cd) central diode input current Ii(sd) satellite diode input current 0 − 3400 µA 0.6 − 9 µA 0 − 520 µA 2.5 2.9 3.3 V WRON = 1 2.6 3.0 3.4 V 1.6 1.9 2.2 V WRON = 1 1.7 2.0 2.3 V − 420 − Ω − 220 − Ω − 620 − Ω − 370 − Ω −0.93 −1 −1.07 HG = 1 −2.8 −3 −3.2 WRON = 1 −0.94 −1 −1.06 WRON = 1; HG = 1 −0.93 −1 −1.07 3σ − − 3 33 44 − MHz HG = 1; Ii(cd) = 6 µA 18 22 − MHz WRON = 1; Ii(cd) = 1000 µA 150 230 − MHz WRON = 1; HG = 1; Ii(cd) = 250 µA 100 130 − MHz WRON = 1 WRON = 1 INPUT VOLTAGE LEVEL Vi(cd) Vi(sd) central diode input voltage level satellite diode input voltage level INPUT RESISTANCE Ri(cd) central diode input resistance WRON = 1; Ii(cd) = 1 mA Ri(sd) satellite diode input resistance WRON = 1; Ii(cd) = 200 µA Transfer functions SERVO OUTPUTS CD Gcd servo central detector gain Gmm gain mismatch Bcd bandwidth 1999 Sep 17 7 % Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems SYMBOL PARAMETERS CONDITIONS TZA1027 MIN. tr rise time WRON = 1; 30 µA < Ii(cd) < 520 µA − td delay time WRON = 1; 30 µA < Ii(cd) < 520 µA TYP. MAX. UNIT 2 − ns − 2.5 − ns HG = 1 −2.85 −3.05 −3.25 WRON = 0; HG = 0 −0.96 −1.02 −1.08 WRON = 1; HG = 0 −0.88 −0.95 −1.02 WRON = 1; HG = 1 −0.88 −0.95 −1.02 HG = 1; Ii(cd) = 1 µA SERVO OUTPUTS SD GSS BS servo satellite detector gain bandwidth 24 − − MHz WRON = X; note 1; HG = X; note 1 46 − − MHz tr rise time WRON = 1; 4 µA < Ii(cd) < 65 µA − 3.6 − ns td delay time WRON = 1; 4 µA < Ii(cd) < 65 µA − 4.5 − ns 7.5 8.1 8.7 DATA OUTPUT; PIN CAHF GSS servo satellite detector gain BCAHF bandwidth td(f) flatness delay HG = 1 29 32 35 WRON = 1; HG = X; note 1 − 0 − 80 − − MHz HG = 1; Ii(cd) = 6 µA HG = 1; Ii(cd) = 6 µA In noise current HG = 1; Ii(cd) = 6 µA 72 − − MHz − 30 200 ps − 170 − ps − 1.4 − µA − 2 − µA Output pins Vo(cd) central diode output voltage −0.2 − VDDD − 1 V Vo(sd) satellite diode output voltage −0.2 − VDDD − 1 V Vo(CAHF) data output voltage 1 − VDDD + 0.2 V Ro(cd) central diode output resistance − 1 − MΩ Ro(sd) satellite diode output resistance − 5 − MΩ RCAHF data output resistance − 40 − kΩ V Digital control signals INPUT VOLTAGE LEVELS; PINS PDWN, WRON AND HG VIL LOW-level input voltage −0.2 − +1.2 VIH HIGH-level input voltage 1.8 − VDDD + 0.2 V input leakage current −1 − +1 µA delay time − 0.3 − µs INPUT CURRENT ILI DELAY TIME td Note 1. X = don’t care. 1999 Sep 17 8 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 TEST AND APPLICATION INFORMATION handbook, full pagewidth 100 nF I i(sd)(AC) 470 kΩ 50 Ω A1 7 23 A1LF A2 2 28 A2LF B1 6 24 B1LF B2 3 27 B2LF C1 1 29 C1LF 22 C2LF 25 C3LF 26 C4LF 3.9 pF 100 nF 3.3 kΩ 470 kΩ 3.3 kΩ 470 kΩ 4.7 kΩ 100 nF 50 Ω 4.7 kΩ 3.9 pF 100 nF 3.3 kΩ 470 kΩ 100 nF 50 Ω 4.7 kΩ 3.9 pF 100 nF 50 Ω 100 nF I i(cd)(AC) 3.3 kΩ 470 kΩ 50 Ω 3.3 kΩ 470 kΩ C2 3.3 kΩ 470 kΩ 4.7 kΩ 100 nF 50 Ω C3 3.3 kΩ +5 V 8 5 4.7 kΩ 3.9 pF 100 nF 470 kΩ 100 nF 50 Ω 3.9 pF 100 nF Vbias(cd) 4.7 kΩ 3.9 pF 100 nF 100 nF 50 Ω C4 4 4.7 kΩ 3.9 pF + 100 nF 50 Ω 19 CAHF 1 kΩ PDWN 21 WRON 31 GAIN SELECTOR 18 HFGND HG 30 16 15 13 14 VDDA VDDD AGND DGND +5 V Fig.3 Test diagram. 1999 Sep 17 4.7 kΩ 100 nF 50 Ω 3.9 pF 100 nF Vbias(sd) 100 nF 50 Ω TZA1027 3.3 kΩ 9 MGR883 +5 V Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems handbook, full pagewidth +12 V TZA1027 TZA1027 A1 7 23 A1LF SA1 A2 2 28 A2LF SA2 B1 6 24 B1LF SB1 B2 3 27 B2LF SB2 C1 1 29 C1LF C1 C2 8 22 C2LF C2 C3 5 25 C3LF C3 C4 4 26 C4LF C4 19 CAHF 4 8 5 9 TZA1020 + 3 6 7 SAA7392 PDWN 21 WRON 31 HG 30 18 GAIN SELECTOR SAA7399 10 to block decoder/ encoder HFGND 16 15 13 14 VDDA VDDD AGND DGND +5 V MGR884 Fig.4 Application diagram. 1999 Sep 17 10 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 PACKAGE OUTLINE SOT401-1 LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm c y X A 17 24 ZE 16 25 e A A2 E HE (A 3) A1 w M pin 1 index θ bp 32 Lp 9 L 1 8 detail X ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.60 0.15 0.05 1.5 1.3 0.25 0.27 0.17 0.18 0.12 5.1 4.9 5.1 4.9 0.5 7.15 6.85 7.15 6.85 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) θ 0.95 0.55 7 0o 0.95 0.55 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-04 SOT401-1 1999 Sep 17 EUROPEAN PROJECTION 11 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. The footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 1999 Sep 17 12 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems TZA1027 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable suitable(2) suitable suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Sep 17 13 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems NOTES 1999 Sep 17 14 TZA1027 Philips Semiconductors Preliminary specification Analog current buffer for CD-R and CD-RW systems NOTES 1999 Sep 17 15 TZA1027 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545002/01/pp16 Date of release: 1999 Sep 17 Document order number: 9397 750 04724