BTA312B series CT and ET 12 A Three-quadrant triacs high commutation high temperature Rev. 01 — 11 April 2007 Product data sheet 1. Product profile 1.1 General description Passivated, new generation, high commutation, high temperature triacs in a SOT404 plastic single-ended surface-mountable package 1.2 Features n High operating junction temperature n Very high commutation performance maximized at each gate sensitivity n High immunity to dV/dt 1.3 Applications n High temperature, high power motor control - e.g. vacuum cleaners n Refrigeration and air conditioning compressors n Heating and cooking appliances n Non-linear rectifier-fed motor loads n Electronic thermostats for heating and cooling loads n Solid state relays 1.4 Quick reference data n VDRM ≤ 600 V (BTA312B-600CT) n VDRM ≤ 800 V (BTA312B-800ET) n ITSM ≤ 95 A (t = 20 ms) n IGT ≤ 35 mA (BTA312B-600CT) n IGT ≤ 10 mA (BTA312B-800ET) n IT(RMS) ≤ 12 A 2. Pinning information Table 1. Pinning Pin Description 1 main terminal 1 (T1) 2 main terminal 2 (T2) 3 gate (G) mb mounting base; main terminal 2 (T2) Simplified outline mb Symbol T2 T1 G sym051 2 1 3 SOT404 (D2PAK) BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 3. Ordering information Table 2. Ordering information Type number Package Name BTA312B-600CT D2PAK BTA312B-800ET Description Version plastic single-ended surface-mounted package (D2PAK); 3-leads (one lead SOT404 cropped) 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDRM Parameter repetitive peak off-state voltage Conditions Min Max Unit - 600 V BTA312B-800ET - 800 V - 12 A t = 20 ms - 95 A t = 16.7 ms - 105 A t = 10 ms - 45 A2s ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs BTA312B-600CT IT(RMS) RMS on-state current full sine wave; Tmb ≤ 126 °C; see Figure 4 and 5 ITSM non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to surge; see Figure 2 and 3 [1] I2t I2t dIT/dt rate of rise of on-state current IGM peak gate current - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature −40 +150 °C Tj junction temperature - 150 °C [1] for fusing over any 20 ms period Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 2 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 003aab690 16 Ptot (W) conduction angle (degrees) form factor a α = 180° 30 60 90 120 180 4 2.8 2.2 1.9 1.57 120° 12 90° α 60° 30° 8 4 0 0 3 6 9 12 IT(RMS) (A) α = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values 003aab680 100 ITSM (A) 80 60 40 ITSM IT t 20 1/f Tj(init) = 25 °C max 0 1 102 10 103 number of cycles (n) f = 50 Hz Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 3 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 003aab691 103 ITSM (A) (1) 102 ITSM IT t tp Tj(init) = 25 °C max 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit Fig 3. Non-repetitive peak on-state current as a function of pulse duration; maximum values 003aab687 50 IT(RMS) (A) 003aab688 15 IT(RMS) (A) 40 10 30 20 5 10 0 10-2 10-1 1 10 surge duration (s) 0 -50 0 50 100 150 Tmb (°C) f = 50 Hz Tmb = 126 °C Fig 4. RMS on-state current as a function of surge duration; maximum values Fig 5. RMS on-state current as a function of mounting base temperature; maximum values BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 4 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Rth(j-mb) thermal resistance from junction to half cycle; see Figure 6 mounting base full cycle; see Figure 6 thermal resistance from junction to mounted on printed ambient circuit board; minimum footprint Rth(j-a) Min Typ Max Unit - - 2.0 K/W - - 1.5 K/W - 55 - K/W 003aab775 10 Zth(j-mb) (K/W) 1 (1) 10−1 (2) P 10−2 tp 10−3 10−5 10−4 10−3 10−2 10−1 1 t 10 tp (s) (1) Unidirectional (half cycle) (2) Bidirectional (full cycle) Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 5 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 6. Static characteristics Table 5. Static characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter IGT IL gate trigger current Conditions BTA312B-600CT BTA312B-800ET Unit Min Typ Max Min Typ Max T2+ G+ 2 - 35 - - 10 mA T2+ G− 2 - 35 - - 10 mA T2− G− 2 - 35 - - 10 mA T2+ G+ - - 50 - - 25 mA T2+ G− - - 60 - - 30 mA T2− G− - - 50 - - 25 mA VD = 12 V; IT = 0.1 A; see Figure 8 latching current VD = 12 V; IGT = 0.1 A; see Figure 10 IH holding current VD = 12 V; IGT = 0.1 A; see Figure 11 - - 35 - - 15 mA VT on-state voltage IT = 15 A; see Figure 9 - 1.3 1.6 - 1.3 1.6 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; see Figure 7 - 0.8 1.5 - 0.7 1.5 V VD = 400 V; IT = 0.1 A; Tj = 150 °C 0.25 - - 0.25 - - V ID off-state current VD = VDRM(max); Tj = 150 °C - 0.4 2 - 0.4 2 mA BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 6 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 7. Dynamic characteristics Table 6. Dynamic characteristics Symbol Parameter dVD/dt rate of rise of off-state voltage dIcom/dt rate of change of commutating current Conditions BTA312B-600CT Unit Min Typ Max Min Typ Max VDM = 0.67 × VDRM(max); Tj = 150 °C; exponential waveform; gate open circuit 300 - - 30 - - V/µs VDM = 400 V; Tj = 150 °C; IT(RMS) = 12 A; without snubber; gate open circuit 8 - - 2 - - A/ms VDM = 400 V; Tj = 150 °C; IT(RMS) = 12 A; dV/dt = 10 V/µs; gate open circuit 13 - - 3.5 - - A/ms VDM = 400 V; Tj = 150 °C; IT(RMS) = 12 A; dV/dt = 1 V/µs; gate open circuit 20 - - 5 - - A/ms - 2 - - 2 - µs gate-controlled ITM = 20 A; VD = VDRM(max); IG = 0.1 A; turn-on time dIG/dt = 5 A/µs tgt BTA312B-800ET 001aag168 1.6 001aag165 3 VGT IGT VGT(25°C) IGT(25°C) 1.2 2 (1) (2) (3) 0.8 0.4 −50 1 0 50 100 Tj (°C) 150 0 −50 0 50 100 Tj (°C) 150 (1) T2− G− (2) T2+ G− (3) T2+ G+ Fig 7. Normalized gate trigger voltage as a function of junction temperature Fig 8. Normalized gate trigger current as a function of junction temperature BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 7 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 003aab678 40 001aag166 3 IT (A) IL IL(25°C) 30 2 20 1 (1) 10 (2) (3) 0 0 0.5 1 1.5 2 VT (V) 0 −50 2.5 0 50 100 150 Tj (°C) Vo = 1.127 V Rs = 0.027 Ω (1) Tj = 150 °C; typical values (2) Tj = 150 °C; maximum values (3) Tj = 25 °C; maximum values Fig 9. On-state current as a function of on-state voltage Fig 10. Normalized latching current as a function of junction temperature 001aag167 3 IH IH(25°C) 2 1 0 −50 0 50 100 Tj (°C) 150 Fig 11. Normalized holding current as a function of junction temperature BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 8 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 8. Package outline SOT404 Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped) A A1 E mounting base D1 D HD 2 Lp 1 3 c b e e Q 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D max. D1 E e Lp HD Q mm 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 11 1.60 1.20 10.30 9.70 2.54 2.90 2.10 15.80 14.80 2.60 2.20 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-02-11 06-03-16 SOT404 Fig 12. Package outline SOT404 (D2PAK) BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 9 of 12 NXP Semiconductors BTA312B series CT and ET 12 A Three-quadrant triacs high commutation high temperature 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BTA312B_SER_CT_ET_1 20070411 Product data sheet - - BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 10 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] BTA312B_SER_CT_ET_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 11 April 2007 11 of 12 BTA312B series CT and ET NXP Semiconductors 12 A Three-quadrant triacs high commutation high temperature 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 11 April 2007 Document identifier: BTA312B_SER_CT_ET_1