INTEGRATED CIRCUITS DATA SHEET SAA9740H Advanced Auto Control Function (A2CF) Product specification Supersedes data of 1996 Jan 30 File under Integrated Circuits, IC02 1996 Oct 10 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H FEATURES Auto Exposure features • One chip full digital Auto Focus (AF), Auto Exposure (AE) and Auto White Balance (AWB) • 5 windows accumulation • Possible to use NTSC and PAL CCD with horizontal resolution of 510, 670, 720 or 768 pixels • Possible to control size and place of the centre windows by the light condition with microprocessor. • Calculation of white-clip by centre window • No manual adjustment Auto White Balance features • One microprocessor system commonly used with CAMera Digital Signal Processor (CAMDSP) SAA9750H • Mono colour detection • 8-bit parallel microprocessor interface • Accumulation of UV data in the corresponding UV quadrant • LQFP64 package (0.5 mm pitch) • Green and Magenta elimination gate • Single 3 V power supply. • Luminance gate for detecting white • UV limiter Auto Focus features • White-clip detection/counter. • Video AF system • Two windows system (a small centre and large window) GENERAL DESCRIPTION • The window size and place are microprocessor controlled The Advanced Auto Control Function (A2CF) is to be used for a colour CCD camera system. This IC can realize AWB, AF and AE with a microprocessor. This device consists of an input data selector, a parallel 8-bit microprocessor interface, a data accumulator, a window generator, a command decoder and AWB, AF, AE for each processing block. • Including 5th order IIR digital high-pass filter • Line peak accumulation in the large window • High-pass filter’s output accumulation in one field. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VDD digital supply voltage (pins 6, 18 and 47) 2.7 3.0 3.3 V VIL LOW level digital input voltage 0 − 0.3VDD V VIH HIGH level digital input voltage 0.7VDD − VDD V VOL LOW level digital output voltage − − 0.5 V VOH HIGH level digital output voltage VDD − 0.5 − − V Tamb operating ambient temperature −20 +70 °C − ORDERING INFORMATION TYPE NUMBER SAA9740H 1996 Oct 10 PACKAGE NAME LQFP64 DESCRIPTION plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm 2 VERSION SOT314-2 6, 18, 47 34 33 35 8 37 SAA9740H CDS7 to CDS0 57 to 50 8 H/V COUNTER 32 enable signals 18-BIT ADDER AUTO FOCUS 36 WINDOW GENERATOR 31 30 61 to 64, 1 Y7 to Y3 5 29 PEAK HOLD AUTO EXPOSURE REGISTER MICROPROCESSOR INTERFACE 3 16 to 9 UV7 to UV0 8 CLK1 AMSAL WDMNT WDINT ASTB WRB RDB RSTB 20 to 27 AUTO WHITE BALANCE 48 60 28 LWDB WHITE CLIP 8 CLK1 CLOCK GENERATOR 40 CLK2OUT 39, 38, 45 to 41 1/2 CLK1 7, 19 46, 49, 59 VSS1 to VSS5 58 SCAN_T 17 IO7 to IO0 7 TSTOUT7 to TSTOUT1 MHA286 2 3 4 5 TSTIN1 TSTIN2 TSTIN3 TST1 Philips Semiconductors VD UV_SEL HSYNC HD Advanced Auto Control Function (A2CF) BLOCK DIAGRAM 1996 Oct 10 +3 V VDD1 to VDD3 handbook, full pagewidth WCLIP Product specification SAA9740H Fig.1 Block diagram. Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H PINNING SYMBOL PIN TYPE DESCRIPTION Y3 1 input Y input from SAA9750H (CAMDSP) (LSB) TSTIN1 2 input input pin for test TSTIN2 3 input input pin for test TSTIN3 4 input input pin for test TST1 5 input input pin for test VDD1 6 − digital supply voltage VSS1 7 − ground UV_SEL 8 input UV select input from SAA9750H (CAMDSP) UV0 9 input UV input from SAA9750H (CAMDSP) (LSB) UV1 10 input UV input from SAA9750H (CAMDSP) UV2 11 input UV input from SAA9750H (CAMDSP) UV3 12 input UV input from SAA9750H (CAMDSP) UV4 13 input UV input from SAA9750H (CAMDSP) UV5 14 input UV input from SAA9750H (CAMDSP) UV6 15 input UV input from SAA9750H (CAMDSP) UV7 16 input UV input from SAA9750H (CAMDSP) (MSB) WCLIP 17 input white-clip input from SAA9750H (CAMDSP) VDD2 18 − digital supply voltage VSS2 19 − ground IO7 20 bidirectional microprocessor interface (MSB) IO6 21 bidirectional microprocessor interface IO5 22 bidirectional microprocessor interface IO4 23 bidirectional microprocessor interface IO3 24 bidirectional microprocessor interface IO2 25 bidirectional microprocessor interface IO1 26 bidirectional microprocessor interface IO0 27 bidirectional microprocessor interface (LSB) RSTB 28 input system reset RDB 29 input read control from microprocessor WRB 30 input write control from microprocessor ASTB 31 input address set from microprocessor WDINT 32 output window interrupt VD 33 input V-drive signal input HD 34 input H-drive signal input HSYNC 35 input HSYNC input WDMNT 36 output window monitor for test (open-drain) LWDB 37 output large window for test (open-drain) TSTOUT6 38 output output pin for test TSTOUT7 39 output output pin for test CLK2OUT 40 output output pin of internal clock (open-drain) 1996 Oct 10 4 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SYMBOL PIN TYPE SAA9740H DESCRIPTION TSTOUT1 41 output output pin for test TSTOUT2 42 output output pin for test TSTOUT3 43 output output pin for test TSTOUT4 44 output output pin for test TSTOUT5 45 output output pin for test VSS3 46 − ground VDD3 47 − digital supply voltage CLK1 48 input clock VSS4 49 − ground CDS0 50 input CDS input from ADC (LSB) CDS1 51 input CDS input from ADC CDS2 52 input CDS input from ADC CDS3 53 input CDS input from ADC CDS4 54 input CDS input from ADC CDS5 55 input CDS input from ADC CDS6 56 input CDS input from ADC CDS7 57 input CDS input from ADC (MSB) SCAN_T 58 input test control for scan test VSS5 59 − ground AMSAL 60 input for testing Y7 61 input Y input from SAA9750H (CAMDSP) (MSB) Y6 62 input Y input from SAA9750H (CAMDSP) Y5 63 input Y input from SAA9750H (CAMDSP) Y4 64 input Y input from SAA9750H (CAMDSP) 1996 Oct 10 5 Philips Semiconductors Product specification 49 VSS4 50 CDS0 51 CDS1 52 CDS2 53 CDS3 54 CDS4 SAA9740H 55 CDS5 56 CDS6 57 CDS7 58 SCAN_T 59 VSS5 61 Y7 62 Y6 63 Y5 64 Y4 handbook, full pagewidth 60 AMSAL Advanced Auto Control Function (A2CF) Y3 1 48 CLK1 TSTIN1 2 47 VDD3 TSTIN2 3 46 VSS3 TSTIN3 4 45 TSTOUT5 TST1 5 44 TSTOUT4 VDD1 6 43 TSTOUT3 VSS1 7 42 TSTOUT2 UV_SEL 8 41 TSTOUT1 SAA9740H 33 VD WCLIP 17 Fig.2 Pin configuration. 1996 Oct 10 6 WDINT 32 UV7 16 ASTB 31 34 HD WRB 30 UV6 15 RDB 29 35 HSYNC RSTB 28 UV5 14 IO0 27 36 WDMNT IO1 26 UV4 13 IO2 25 37 LWDB IO3 24 UV3 12 IO4 23 38 TSTOUT6 IO5 22 UV2 11 IO6 21 39 TSTOUT7 IO7 20 UV1 10 VSS2 19 40 CLK2OUT VDD2 18 9 UV0 MHA285 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H This maximum focus value is accumulated in the AF window (see Fig.3) by the 18-bit adder. The values in the large window are stored in REG2 (see Table 7) and those in the small window are stored in REG3 (see Table 7). Which data is used is dependent on the software (see Tables 6 and 7). Besides this accumulation, line peak accumulation is also done. This data is the maximum value in one field and is stored in REG0 (see Table 7). FUNCTIONAL DESCRIPTION The Advanced Auto Control Function (A2CF) will be used for colour CCD camera systems. The input signals are CDS (AF data) from 8-bit ADC, Y (for AE, 5-bit) and UV (for AWB, 8-bit) data as the output of SAA9750H (CAMDSP) and they are fed into the A2CF. After being processed in the A2CF, corresponding data are led into the microprocessor. AE system Together with the zoom encoder and focus sensor output the microprocessor does the following control with the data of A2CF: handbook, halfpage active video • Control focus motor • Control iris, AGC (via DAC) and high speed shutter 1 • Send the control data to SAA9750H (CAMDSP) via serial bus. 2 CLK1 is depending on the CCD type. To cope with the different CCD clocks, some reference data have to be set by the microprocessor. 3 4 5 MHA288 AF system Fig.4 AE window. handbook, halfpage active video 5-bit Y signals Y7 to Y3 which come from SAA9750H are fed into A2CF for AE processing. This signal is internally extended to 6 bits by adding a ‘0’ as new MSB. Next they go through an LPF and they are down sampled in the same way as AF processing. In order to prevent overflow of the 18-bit adder block, 2 modes exist (see Table 4). The first is H decimation is on or off. If H decimation is on, then the data for AE processing is available in every other line. The second mode is that the data for AE processing is shifted to 1⁄2 or not. If the data is shifted to 1⁄2, it is done before down sampling and before the data going to the 18-bit adder becomes 1⁄2. Both these modes are controlled by the microprocessor. In AE mode there are 5 windows as shown in Fig.4. These windows are controlled by the microprocessor. The accumulation data in window 1 to window 5 is respectively stored in REG1 to REG5 (see Table 7). The white-clip count data in the centre window is stored to the lower 5 bits of REG0 (see Table 7). The upper 3 bits of REG0 is the overflow information in the 18-bit adder (see Table 7). large window centre window MHA287 Fig.3 AF window. Digital CDS signals CDS7 to CDS0 which come after AGC, gamma processing and ADC are fed into A2CF. This 8-bit data is shifted to the most suitable 6-bit data for AF processing by microprocessor. For example, when the MSB of them is ‘1’ then the 6-bit data is shifted by the microprocessor to CDS7 to CDS2 (not CDS6 to CDS1 or CDS5 to CDS0; see Table 4). After AF shifting the signals go through an LPF and they are down sampled. The down sampling is done by CLK2 (CLK1/2). In order to detect the high frequency component for AF processing, one HPF is added. This output is the focus value. Next peak hold block is for acquiring maximum focus value of every line in one field. 1996 Oct 10 7 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H mode (see Table 4) is for detecting whether the picture is mono colour or not. If the AWB (B − Y) or AWB (R − Y) or AWB (∆) (see Table 4) mode is active and white-clip or AWB limited (as mentioned above), then the counts of them are stored in the lower 5 bits of REG0 (see Table 7). In the AWB Y mode the lower 4 bits of REG0 are contrast peak data in one field and the 4th bit is the overflow information of the AF (see Table 7). AWB system 8-bit UV signals UV[7] to UV[0] which come from the SAA9750H (CAMDSP) are fed into the A2CF for AWB processing. First the 8-bit data is limited to 6-bits because the necessary data for AWB processing is around the white colour signal. Then these signals go through an LPF and they are down sampled. They are separated to U and V signals by using UV_SEL coming from SAA9750H (CAMDSP). As shown in Table 1, in the large window these signals are compared with the threshold that is set by the microprocessor. If the conditions shown in Fig.8 are valid, the data is available for AWB processing. If the conditions aren’t valid, the data is ignored. The available data in the first to the 4th quadrant are stored in respectively REG1 to REG4 (see Table 7). The AWB (∆) Microprocessor interface 8-bit data bus and 3 control ports are prepared (WRB, RDB and ASTB) for microprocessor interface in A2CF for quick data access instead of serial bus. A2CF has 11 read commands and 13 write commands. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage −0.5 +5.0 V Ptot total power dissipation − 83 mW VI input voltage −0.5 VDD + 0.5 V VO output voltage −0.5 VDD + 0.5 V Tstg storage temperature −65 +150 °C Tamb operating ambient temperature −20 +70 °C Ves electrostatic handling; note 1 −2000 +2000 V LTCH latch-up protection 100 − mA Note 1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. 1996 Oct 10 8 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H DC CHARACTERISTICS Tamb = −20 to +70 °C; VDD = 2.7 to 3.3 V; unless otherwise specified. SYMBOL IDD PARAMETER supply current CONDITIONS MIN. − note 1 TYP. 12 MAX. 25 UNIT mA Input pins (TSTIN1 to TSTIN3, TST1, UV_SEL, UV0 to UV7, Y3 to Y7, WCLIP, RSTB, RDB, WRB, ASTB, VD, HD, HSYNC, CLK1, CDS0 to CDS7, SCAN_T and AMSAL) VIH HIGH level input voltage 0.7VDD − − V VIL LOW level input voltage − − 0.3VDD V IIH HIGH level input current VIH = VDD − − 1 µA IIL LOW level input current VIL = VSS − − −1 µA Output pins (WDINT and TSTOUT1 to TSTOUT7; push pull output) VOH VOL HIGH level output voltage LOW level output voltage IOH = −20 µA VDD − 0.1 − − V IOH = −4 mA VDD − 0.5 − − V IOL = +20 µA − − 0.1 V IOL = +4 mA − − 0.5 V − − 0.1 V Output pins (WDMNT, LWDB and CLK2OUT; open-drain) VOL LOW level output voltage IOZ 3-state leakage current IOL = +20 µA IOL = +4 mA − − 0.5 V VO = VDD − − 5 µA Bidirectional pins (IO0 to IO7) VOH VOL HIGH level output voltage LOW level output voltage IOH = −20 µA VDD − 0.1 − − V IOH = −8 mA VDD − 0.5 − − V IOL = +20 µA − − 0.1 V IOL = +8 mA − − 0.5 V VIH HIGH level input voltage 0.7VDD − − V VIL LOW level input voltage − − 0.3VDD V IIH HIGH level input current VIH = VDD − − 1 µA IIL LOW level input current VIL = VSS − − −1 µA IOZ 3-state leakage current VO = VDD or VSS − − ±5 µA Note 1. 510H PAL; VDD = 3 V; all modes active. 1996 Oct 10 9 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H AC CHARACTERISTICS Microprocessor interface Tamb = −20 to +70 °C; VDD = 2.7 to 3.3 V; VIL = 0 V; VIH = VDD; Vref = 0.5VDD; input tr and tf = 30 ns; see Fig.5; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT tsuAD address setup time 0.4 − − µs thAD address hold time 0.4 − − µs tAR ASTB to RDB time 0.5 − − µs tW R RDB width 1.0 − − µs tRRD RDB to read data RL = 1 kΩ − − 0.8 µs thRRD RDB to read data hold time RL = 1 kΩ − − 0.1 µs tAW ASTB to WRB time 0.5 − − µs tW W WRB width 1.0 − − µs tsuW WRB setup time 0.4 − − µs thW WRB hold time 0.4 − − µs handbook, full pagewidth 90% IO7 to IO0 90% address read data write data 10% 10% tsuAD tRRD thAD VIH VIL thRRD VIH 90% 50% ASTB 10% tr tf VIL tAR tW R VIH RDB 50% 50% VIL tsuW tAW thW tW W VIH WRB 50% 50% MHA292 Fig.5 Microprocessor interface timing. 1996 Oct 10 10 VIL Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H Data input/output timing (CLK1) Tamb = −20 to +70 °C; VDD = 2.7 to 3.3 V; VIL = 0 V; VIH = VDD; Vref = 0.5VDD; tr and tf = 6 ns; output load capacitance = 20 pF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT tsuDI data input setup time note 1 5 − − ns thDI data input hold time note 1 8 − − ns tdDO data output delay time notes 2 and 3 − − 60 ns thDO data output hold time notes 2 and 3 − − 60 ns tW CLK1 width of CLK1 − 50 − % Notes 1. Data inputs: UV0 to UV7, Y3 to Y7, AD0 to AD7, UV_SEL, HSYNC, HD, VD and WCLIP. 2. Data outputs: WDINT, CLK2OUT, WDMNT and LWDB (open-drain outputs with 1 kΩ output load resistor). 3. Tamb = 25 °C; VDD = 3.0 V. tf handbook, full pagewidth tW CLK1 tr 90% CLK1 90% VIH Vref 10% 10% tsuDI VIL thDI 90% 90% 10% 10% VIH data inputs tdDO VIL tdDO 90% VIH 90% (1) data outputs 10% 10% VIL MHA291 (1) 50% for open-drain outputs. Fig.6 Data input/output timing (CLK1). 1996 Oct 10 11 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H MICROPROCESSOR COMMANDS Table 1 Write commands; note 1 DATA COMMAND FUNCTION IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 81H(2) X X X1[5] X1[4] X1[3] X1[2] X1[1] X1[0] X1 address 82H(2) X X X2[5] X2[4] X2[3] X2[2] X2[1] X2[0] X2 address 83H(2) X X X3[5] X3[4] X3[3] X3[2] X3[1] X3[0] X3 address 84H(2) X X X4[5] X4[4] X4[3] X4[2] X4[1] X4[0] X4 address 85H(2) X X Y1[5] Y1[4] Y1[3] Y1[2] Y1[1] Y1[0] Y1 address 86H(2) X X Y2[5] Y2[4] Y2[3] Y2[2] Y2[1] Y2[0] Y2 address 87H(2) X X Y3[5] Y3[4] Y3[3] Y3[2] Y3[1] Y3[0] Y3 address 88H(2) X X Y4[5] Y4[4] Y4[3] Y4[2] Y4[1] Y4[0] Y4 address 8BH X TEST2 TEST1 TEST0 X IIRC2 IIRC1 IIRC0 IIRC 8CH THB[3] THB[2] THB[1] THB[0] THA[3] THA[2] THA[1] THA[0] TH1 8DH X X X X THC[3] THC[2] THC[1] THC[0] TH2 8EH SFTY SFT1 SFT0 X HON MODE2 MODE1 MODE0 MODE 8FH X SIZE MWD1 MWD0 X PHS PHD PVD SET Notes 1. X = don’t care. 2. For auto exposure processing different windows in the active video field are taken with different weighting factors. The coordinates of the five windows are set according to Fig.7. The resolution is 1 bit ≡ 16 pixel in x-direction and 1 bit ≡ 8 lines in y-direction. handbook, 0/0 halfpage active video X3/Y3 X1/Y1 WIN2 WIN1 WIN4 WIN3 WIN5 X2/Y2 X4/Y4 MHA289 Fig.7 Window size control for AE processing (see WRITE command 81H to 88H). 1996 Oct 10 12 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H Address 8BH Table 2 IIRC (IO[2] to IO[0]) IIRC2 IIRC1 IIRC0 0 0 0 1 MHz HPF select for auto focus processing 0 0 1 700 kHz HPF select for auto focus processing 0 1 0 220 kHz HPF select for auto focus processing 0 1 1 bypass HPF for auto focus processing 1 1 0 110 kHz select for auto focus processing Table 3 FUNCTION IIRC 9IO[6] to 9IO[4]; note 1 TEST2 TEST1 TEST0 X X X FUNCTION only for test purposes Note 1. X = don’t care. Address 8CH and 8DH Address 8CH and 8DH are used to define the active range that is taken for auto white balance processing. The calculation of active area can be seen in Fig.8. handbook, full pagewidth R−Y (V) THB THA −THA B−Y (U) −THB Conditions: (1) U + V < THA. (2) V < THB. (3) Y > THC. Threshold values can be set with 4-bit resolution. MHA290 Fig.8 Set threshold values for Auto White Balance (AWB) mode. 1996 Oct 10 13 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H Address 8EH By applying address 8EH and setting the MODE bits it is possible to read the values that are stored in the registers corresponding to the selected mode. The selection which register will be read is then defined by READ address 70H to 7BH (see Tables 6 and 7). Table 4 IO7 MODE and shift definition (see WRITE command 8EH); note 1 IO6 IO5 SFTY SFT1 SFT0 IO4 − IO3 IO2 IO1 IO0 MODE FUNCTION HON MODE MODE MODE X X X X X 0 0 0 AE set mode: read AE values X X X X X 0 0 1 AF set mode: read AF values X X X X X 0 1 1 AWB (B − Y) set mode: read AWB (B − Y) values X X X X X 1 0 0 AWB (R − Y) set mode: read AWB (R − Y) values X X X X X 1 0 1 AWB ∆ set mode: read AWB ∆ values X X X X X 1 1 0 AWB Y set mode: read AWB Y values X X X X 0 0 0 0 H dec decimation for 1H off X X X X 1 0 0 0 H dec decimation for 1H on X 0 0 X X 0 0 1 AF shift select CDS5 to CDS0 for AF processing X 0 1 X X 0 0 1 AF shift select CDS6 to CDS1 for AF processing X 1 X X X 0 0 1 AF shift select CDS7 to CDS2 for AF processing 0 X X X X 0 0 0 AE shift take AE[5] to AE[0] for internal AE processing (see Chapter “Functional description”) 1 X X X X 0 0 0 AE shift take AE[5] to AE[1] for internal AE processing (see Chapter “Functional description”) Note 1. X = don’t care. 1996 Oct 10 14 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H Address 8FH To apply several types of CCDs it is possible to set polarity VD, HD and HSYNC by PVD, PHD and PHS. The modes set by MWD and SIZE bit are only used for system evaluation. During normal application mode they can have any value. Table 5 Settings (see WRITE command 8FH); note 1 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 − SIZE MWD1 MWD0 − PHS PHD PVD X X X X X X X 0 PVD VD ‘H’ active X X X X X X X 1 PVD VD ‘L’ active X X X X X X 0 X PHD HD ‘H’ active X X X X X X 1 X PHD HD ‘L’ active X X X X X 0 X X PHSYNC HSYNC ‘H’ active X X X X X 1 X X PHSYNC HSYNC ‘L’ active X X 0 0 X X X X MWD AE monitor AE window X X 0 1 X X X X MWD AF monitor AF window X X 1 0 X X X X MWD AWB monitor AWB window X X 1 1 X X X X MWD ALL monitor all windows X 0 X X X X X X MWD SMALL monitor small window X 1 X X X X X X MWD LARGE monitor large window MODE FUNCTION Note 1. X = don’t care. READ commands The values of the internal registers can be read as follows: 1. Set mode AF, AE or AWB by WRITE command 8EH according to Table 4. 2. Select register by READ command 70H to 7BH according to Table 6. Table 6 Read command DATA COMMAND FUNCTION IO7 IO6 IO5 IO4 IO3 IO2 70H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] 71H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] 72H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] 73H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] 74H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] 75H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] 76H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] 77H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] 78H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] 79H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] 7BH O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] 1996 Oct 10 15 IO1 IO0 REG1 REG2 REG3 REG4 REG5 REG0 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H Register assignment For the different modes (AF, AE and AWB) the contents of the registers are assigned according to Table 7. Table 7 Register assignment MODE AF REGISTER REG0 (8-bit) DATA FUNCTION O[7] to O[5] n.a. O[4] overflow information of AF block O[3] to O[0] contrast peak within one field REG1 (18-bit) O[15] to O[0] n.a. REG2 (18-bit) O[15] to O[0] accumulated data in the large window REG3 (18-bit) O[15] to O[0] accumulated data in the centre window REG4 (18-bit) O[15] to O[0] accumulated data of the large window minus the data of the centre window REG5 (18-bit) O[15] to O[0] n.a. AE REG0 (8-bit) O[7] to O[5] 18-bit adder overflow information O[4] to O[0] white-clip counter output REG1 (18-bit) O[15] to O[0] accumulated data in WIN1; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated data in WIN2; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated data in WIN3; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated data in WIN4; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] accumulated data in WIN5; REG5[18] to REG5[3] AWB (B − Y) REG0 (8-bit) O[7] to O[5] n.a. O[4] to O[0] white-clip or AWB limiter count REG1 (18-bit) O[15] to O[0] accumulated B − Y data of 1st quadrant; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated B − Y data of 2nd quadrant; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated B − Y data of 3rd quadrant; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated B − Y data of 4th quadrant; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. AWB (R − Y) REG0 (8-bit) O[7] to O[5] n.a. O[4] to O[0] white-clip or AWB limiter count REG1 (18-bit) O[15] to O[0] accumulated R − Y data of 1st quadrant; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated R − Y data of 2nd quadrant; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated R − Y data of 3rd quadrant; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated R − Y data of 4th quadrant; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. AWB (∆) REG0 (8-bit) O[7] to O[5] n.a. O[4] to O[0] white-clip or AWB limiter count REG1 (18-bit) O[15] to O[0] accumulated ∆(R − Y) data of WIN1 to WIN5; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated ∆(B − Y) data of WIN1 to WIN5; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated ∆(R − Y) data of WIN3; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated ∆(B − Y) data of WIN3; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. 1996 Oct 10 16 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) MODE AWB (Y) REGISTER REG0 (8-bit) DATA SAA9740H FUNCTION O[7] to O[5] n.a. O[4] overflow information of auto focus block O[3] to O[0] contrast peak within one field REG1 (18-bit) O[15] to O[0] accumulated R − Y data of 1st quadrant; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated R − Y data of 2nd quadrant; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated R − Y data of 3rd quadrant; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated R − Y data of 4th quadrant; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. 1996 Oct 10 17 Y hall sensor LPF ADC 18 D/A serial data bus ADC UV7 to UV0 Y7 to Y3 UV_SEL HSYNC WCLIP MICROPROCESSOR high speed shuffle control MOTOR DRIVER SAA9750H iris PPG UV (8-bit) SIGNAL PROCESS Y/C SEPARATION SSG ENCODER 8-bit HD, VD MOTOR DRIVER Y (8-bit) CAMDSP CDS AGC, GAMMA AGC focus lens C clamp CCD zoom lens BPF Philips Semiconductors focus sensor CAMERA Advanced Auto Control Function (A2CF) zoom encoder APPLICATION INFORMATION 1996 Oct 10 handbook, full pagewidth A2CF AF/AE/AWB IRIS DRIVER SAA9740H CDS7 to CDS0 IO7 to IO0 3 MHA293 Product specification SAA9740H Fig.9 Camera block diagram (SAA9750H and SAA9740H). Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H PACKAGE OUTLINE LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM θ bp pin 1 index 64 Lp L 17 1 detail X 16 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) θ 1.45 1.05 7 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-12-19 97-08-01 SOT314-2 1996 Oct 10 EUROPEAN PROJECTION 19 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) If wave soldering cannot be avoided, the following conditions must be observed: SOLDERING Introduction • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • The footprint must be at an angle of 45° to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1). This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. 1996 Oct 10 SAA9740H 20 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) SAA9740H DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Oct 10 21 Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) NOTES 1996 Oct 10 22 SAA9740H Philips Semiconductors Product specification Advanced Auto Control Function (A2CF) NOTES 1996 Oct 10 23 SAA9740H Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1996 SCA52 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1200/02/pp24 Date of release: 1996 Oct 10 Document order number: 9397 750 01158