PHILIPS 2N7002

SO
T2
3
2N7002
60 V, 300 mA N-channel Trench MOSFET
Rev. 7 — 8 September 2011
Product data sheet
1. Product profile
1.1 General description
N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using
Trench MOSFET technology.
1.2 Features and benefits
 Suitable for logic level gate drive
sources
 Surface-mounted package
 Trench MOSFET technology
 Very fast switching
1.3 Applications
 Logic level translators
 High-speed line drivers
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
-
60
V
ID
drain current
VGS = 10 V; Tsp = 25 °C; see Figure 1;
see Figure 3
-
-
300
mA
Ptot
total power dissipation
Tsp = 25 °C; see Figure 2
-
-
0.83
W
VGS = 10 V; ID = 500 mA; Tj = 25 °C;
see Figure 6; see Figure 8
-
2.8
5
Ω
Static characteristics
drain-source on-state
resistance
RDSon
2. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
G
gate
2
S
source
3
D
drain
Simplified outline
Graphic symbol
3
D
G
1
2
SOT23 (TO-236AB)
mbb076
S
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
3. Ordering information
Table 3.
Ordering information
Type number
Package
2N7002
Name
Description
Version
TO-236AB
plastic surface-mounted package; 3 leads
SOT23
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
2N7002
12%
[1]
% = placeholder for manufacturing site code
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
60
V
VDGR
drain-gate voltage
25 °C ≤ Tj ≤ 150 °C; RGS = 20 kΩ
-
60
V
VGS
gate-source voltage
-30
30
V
VGSM
peak gate-source voltage
pulsed; tp ≤ 50 µs; δ = 0.25
-40
40
V
ID
drain current
VGS = 10 V; Tsp = 25 °C; see Figure 1;
see Figure 3
-
300
mA
VGS = 10 V; Tsp = 100 °C; see Figure 1
-
190
mA
IDM
peak drain current
pulsed; tp ≤ 10 µs; Tsp = 25 °C; see
Figure 3
-
1.2
A
Ptot
total power dissipation
Tsp = 25 °C; see Figure 2
-
0.83
W
Tj
junction temperature
-65
150
°C
Tstg
storage temperature
-65
150
°C
Source-drain diode
IS
source current
Tsp = 25 °C
-
300
mA
ISM
peak source current
pulsed; tp ≤ 10 µs; Tsp = 25 °C
-
1.2
A
2N7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
2 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
03aa25
120
03aa17
120
Ider
(%)
Pder
(%)
80
80
40
40
0
0
0
50
100
150
200
0
50
100
Tsp (°C)
Fig 1.
150
200
Tsp (°C)
Normalized continuous drain current as a
function of solder point temperature
Fig 2.
Normalized total power dissipation as a
function of solder point temperature
003aab350
10
ID
(A)
Limit RDSon = VDS / ID
tp = 10 µs
1
100 µs
10-1
1 ms
DC
10 ms
100 ms
10-2
1
Fig 3.
10
102
VDS (V)
Safe operating area; continous and peak drain currents as a function of drain-source voltage
2N7002
Product data sheet
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Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
3 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance
from junction to
ambient
Mounted on a printed-circuit board;
minimum footprint ; vertical in still air
-
-
350
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
see Figure 4
-
-
150
K/W
003aab351
103
Zth(j-sp)
(K/W)
102
δ = 0.5
0.2
0.1
10
δ=
P
0.05
tp
T
0.02
single pulse
t
tp
T
1
10-5
Fig 4.
10-4
10-3
10-2
10-1
1
tp (s)
10
Transient thermal impedance from junction to solder point as a function of pulse duration
2N7002
Product data sheet
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Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
4 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
7. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source
breakdown voltage
ID = 10 µA; VGS = 0 V; Tj = 25 °C
60
-
-
V
ID = 10 µA; VGS = 0 V; Tj = -55 °C
55
-
-
V
VGSth
gate-source threshold
voltage
ID = 0.25 mA; VDS = VGS; Tj = 25 °C;
see Figure 9; see Figure 10
1
2
2.5
V
ID = 0.25 mA; VDS = VGS; Tj = 150 °C;
see Figure 9; see Figure 10
0.6
-
-
V
ID = 0.25 mA; VDS = VGS; Tj = -55 °C;
see Figure 9; see Figure 10
-
-
2.75
V
IDSS
drain leakage current
VDS = 48 V; VGS = 0 V; Tj = 25 °C
-
0.01
1
µA
VDS = 48 V; VGS = 0 V; Tj = 150 °C
-
-
10
µA
IGSS
gate leakage current
VGS = 15 V; VDS = 0 V; Tj = 25 °C
-
10
100
nA
VGS = -15 V; VDS = 0 V; Tj = 25 °C
-
10
100
nA
VGS = 10 V; ID = 500 mA; Tj = 25 °C;
see Figure 6; see Figure 8
-
2.8
5
Ω
VGS = 10 V; ID = 500 mA; Tj = 150 °C;
see Figure 6; see Figure 8
-
-
9.25
Ω
VGS = 4.5 V; ID = 75 mA; Tj = 25 °C; see
Figure 6; see Figure 8
-
3.8
5.3
Ω
VDS = 10 V; f = 1 MHz; VGS = 0 V;
Tj = 25 °C
-
31
50
pF
-
6.8
30
pF
-
3.5
10
pF
VGS = 10 V; VDS = 50 V; RL = 250 Ω;
RG(ext) = 50 Ω; RGS = 50 Ω
-
2.5
10
ns
-
11
15
ns
RDSon
drain-source on-state
resistance
Dynamic characteristics
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
ton
turn-on time
toff
turn-off time
Source-drain diode
VSD
source-drain voltage
IS = 300 mA; VGS = 0 V; Tj = 25 °C; see
Figure 11
-
0.85
1.5
V
Qr
recovered charge
-
30
-
nC
trr
reverse recovery time
VGS = 0 V; IS = 300 mA;
dIS/dt = -100 A/µs
-
30
-
ns
2N7002
Product data sheet
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Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
003aab352
1
10
ID
(A)
5
003aab353
10000
VGS (V) = 4
RDSon
(mΩ)
0.8
8000
4.5
4.5
0.6
6000
4
5
0.4
4000
10
VGS (V) = 3.5
0.2
2000
0
0
0
Fig 5.
1
2
3
VDS (V)
4
Output characteristics: drain current as a
function of drain-source voltage; typical values
0
Fig 6.
003aab354
1
ID
(A)
0.2
0.4
0.6
0.8
ID (A)
1
Drain-source on-state resistance as a function
of drain current; typical values
03aa28
2.4
a
0.8
1.8
0.6
1.2
0.4
Tj = 150 °C
25 °C
0.6
0.2
0
0
Fig 7.
2
4
VGS (V)
Transfer characteristics: drain current as a
function of gate-source voltage; typical values
2N7002
Product data sheet
0
−60
6
Fig 8.
0
60
120
180
Tj (°C)
Normalized drain-source on-state resistance
factor as a function of junction temperature
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
6 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
003aab101
3
VGS(th)
(V)
typ
10-4
min
1
0
-60
Fig 9.
ID
(A)
max
2
003aab100
10-3
min
typ
max
10-5
10-6
0
60
120
Tj (°C)
Gate-source threshold voltage as a function of
junction temperature
003aab356
1
0
180
1
2
VGS (V)
3
Fig 10. Sub-threshold drain current as a function of
gate-source voltage
003aab357
102
IS
(A)
0.8
C
(pF)
Ciss
0.6
10
0.4
Coss
Crss
0.2
Tj = 25 °C
150 °C
0
0.2
0.4
0.6
0.8
VSD (V)
1
Fig 11. Source current as a function of source-drain
voltage; typical values
2N7002
Product data sheet
1
10-1
1
10
VDS (V)
102
Fig 12. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
7 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
8. Package outline
Plastic surface-mounted package; 3 leads
SOT23
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
bp
c
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
REFERENCES
IEC
JEDEC
JEITA
TO-236AB
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
Fig 13. Package outline SOT23 (TO-236AB)
2N7002
Product data sheet
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Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
9. Soldering
3.3
2.9
1.9
solder lands
solder resist
3
2
1.7
solder paste
occupied area
0.6
(3×)
0.7
(3×)
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
Fig 14. Reflow soldering footprint for SOT23 (TO-236AB)
2.2
1.2
(2×)
1.4
(2×)
solder lands
4.6
solder resist
2.6
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
2.8
4.5
sot023_fw
Fig 15. Wave soldering footprint for SOT23 (TO-236AB)
2N7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
9 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
10. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
2N7002 v.7
20110908
Product data sheet
-
2N7002 v.6
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
2N7002 v.6
20060428
Product data sheet
2N7002 v.5
2N7002 v.5
20051115
Product data sheet
2N7002 v.4
2N7002 v.4
20050426
Product data sheet
2N7002 v.3
2N7002 v.3
20000727
Product specification
2N7002 v.2
19970617
Product specification
2N7002 v.1
19901031
Product specification
2N7002
Product data sheet
HZG336
2N7002 v.2
2N7002 v.1
-
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
-
© NXP B.V. 2011. All rights reserved.
10 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
11. Legal information
11.1 Data sheet status
Document status [1] [2]
Product status [3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
2N7002
Product data sheet
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
11 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
2N7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
12 of 13
2N7002
NXP Semiconductors
60 V, 300 mA N-channel Trench MOSFET
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .1
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
Thermal characteristics . . . . . . . . . . . . . . . . . . .4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Contact information. . . . . . . . . . . . . . . . . . . . . .12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 September 2011
Document identifier: 2N7002