DISCRETE SEMICONDUCTORS DATA SHEET MF1011B900Y Microwave power transistor Product specification Supersedes data of December 1994 1997 Feb 18 Philips Semiconductors Product specification Microwave power transistor FEATURES • Suitable for short and medium pulse applications up to 100 µs pulse width, duty factor 10% • Diffused emitter ballasting resistors improve ruggedness • Interdigitated emitter-base structure provides high emitter efficiency • Gold metallization with barrier realizes very stable characteristics and excellent lifetime • Multicell geometry improves power sharing and reduces thermal resistance MF1011B900Y QUICK REFERENCE DATA Microwave performance up to Tmb = 25 °C in a common-base class C narrowband amplifier. MODE OF OPERATION CONDITIONS tp = 10 µs; δ = 1% Class C f (GHz) VCC (V) PL (W) Gp (dB) ηC (%) 1.09 50 800 ≥6 ≥40 PINNING - SOT448A PIN DESCRIPTION 1 collector 2 emitter 3 base connected to flange • Internal input and output prematching networks allow an easier design of circuits. APPLICATIONS Intended for use in common base class C broadband pulsed power amplifiers for IFF, TCAS and Mode S applications in the 1030 MHz to 1090 MHz band. Also suitable for medium pulse, heavy duty operation within this band. 1 handbook, 4 columns c b 3 3 e 2 MAM045 Top view DESCRIPTION NPN silicon planar epitaxial microwave power transistor in a SOT448A glued cap metal ceramic flange package, with base connected to flange. Fig.1 Simplified outline and symbol. WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1997 Feb 18 2 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 65 V VCES collector-emitter voltage RBE = 0 − 65 V VCEO collector-emitter voltage open base − 15 V VEBO emitter-base voltage open collector − 3 V ICM peak collector current tp = 10 µs; δ = 1% − 50 A Ptot total power dissipation Tmb < 75 °C; tp ≤ 10 µs; δ ≤ 1% − 1750 W Tstg storage temperature −65 +200 °C Tj junction temperature − 200 °C Tsld soldering temperature − 235 °C t ≤ 10 s; note 1 Note 1. Up to 0.2 mm from ceramic. MLC721 1800 handbook, halfpage P tot (W) 1200 600 0 50 0 50 100 150 200 o T mb ( C) tp = 10 µs; δ = 1%. Fig.2 Power derating curve. 1997 Feb 18 3 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MAX. UNIT Rth j-mb thermal resistance from junction to mounting base Tj = 120 °C 0.84 K/W Rth mb-h thermal resistance from mounting base to heatsink note 1 0.2 K/W Zth thermal impedance from junction to heatsink 0.01 K/W tp = 10 µs; δ = 1%; notes 1and 2 Notes 1. See “Mounting recommendations in the General part of handbook SC19a”. 2. Equivalent thermal impedance under pulsed microwave operating conditions. CHARACTERISTICS Tmb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT ICBO collector cut-off current IE = 0; VCB = 50 V 27 mA ICES collector cut-off current VBE = 0; VCE = 50 V 27 mA IEBO emitter cut-off current IC = 0; VEB = 1.5 V 7 mA V(BR)CBO collector-base breakdown voltage IC = 180 mA 65 V V(BR)CES collector-emitter breakdown voltage IC = 180 mA; VBE = 0 65 V APPLICATION INFORMATION Microwave performance up to Tmb = 25 °C in a common-base test circuit as shown in Fig.3. MODE OF OPERATION f (GHz) VCC (V) PL (W) Gp (dB) ηC (%) 1.09 50 ≥800 typ. 900 ≥6 typ. 6.5 ≥40 typ. 48 tp = 112 µs; δ = 1% 1.03 to 1.09 50 typ. 750 typ. 5.7 typ. 36 tp = 32 µs; δ = 1% 1.09 50 typ. 870 typ. 6.3 typ. 46 CONDITIONS tp = 10 µs; δ = 1% Class C 1997 Feb 18 tp = 0.5 µs; δ = 50% 4 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y 30 handbook, full pagewidth 18.5 30 4.0 7.5 7.5 1.6 4.0 10.0 1.0 5.9 20.0 40 5.0 10.5 21.0 0.64 40 0.64 C4 VCC C5 C2 C3 L1 output input R/L3 C1 L2 C7 C6 MLC720 Dimensions in mm. Substrate: Epsilam 10. Thickness: 0.635 mm. Permittivity: εr = 10. Fig.3 Broadband test circuit. 1997 Feb 18 5 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y List of components (see Fig.3) COMPONENT DESCRIPTION VALUE C1 capacitor 100 pF C2,C3 tantalum capacitor 10 µF; 50 V C4 electrolytic capacitor 1 mF; 63 V C5 feedthrough bypass capacitor C6, C7 variable gigatrim capacitor L1, L2 0.65 mm copper wire; total length = 26 mm; height of loop = 10 mm L3 4 turns 0.65 mm copper wire; total length = 48 mm R resistor ORDERING INFORMATION ATC 100A101kp50x Erie 1250-003 0.8 to 8 pF Tekelec 729-1 4.7 Ω; 0.5 W MLC722 1000 PL (W) MLC723 60 handbook, halfpage handbook, halfpage ηc (%) 800 40 600 400 20 200 0 0 0 50 100 150 200 250 P i (W) 0 100 150 200 250 P i (W) Class C pulse operation. tp = 10 µs; δ = 1%; VCC = 50 V; f = 1.09 GHz. In broadband test circuit as shown in Fig.3. Class C pulse operation. tp = 10 µs; δ = 1%; VCC = 50 V; f = 1.09 GHz. In broadband test circuit as shown in Fig.3. Fig.5 Fig.4 Load power as a function of input power. 1997 Feb 18 50 6 Collector efficiency as a function of input power. Philips Semiconductors Product specification Microwave power transistor MF1011B900Y Input and optimum load impedances VCE = 50 V; typical values at PL = PL1 (see Figs 6 and 7). f (GHz) Zi (Ω) ZL (Ω) 1.03 0.22 + j0.19 0.14 − j0.10 1.09 0.23 + j0.12 0.12 − j0.08 1.15 0.19 + j0.06 0.09 − j0.09 1 handbook, full pagewidth 0.5 2 0.2 5 1.03 GHz Zi 0 10 1.09 GHz +j 1.15 GHz 0.2 0.5 2 5 ∞ 10 –j 10 5 0.2 2 0.5 1 MLC724 VCC = 50 V; Zo = 10 Ω; Po = 240 W. Fig.6 Input impedance as a function of frequency. 1997 Feb 18 7 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y 1 handbook, full pagewidth 0.5 2 0.2 5 10 +j 0 0.2 0.5 2 5 ∞ 10 1.09 GHz –j 1.03 GHz 10 1.15 GHz 0.2 ZL 5 2 0.5 1 MLC725 VCC = 50 V; Zo = 50 Ω; Po = 240 W. Fig.7 Optimum load impedance as a function of frequency. 1997 Feb 18 8 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y PACKAGE OUTLINE 15.5 max 0.15 max 6 max 3.3 2.9 1.6 max 3 26 max seating plane 3.7 max 2.7 min 1 9.85 max 3.3 3 3 2.7 min 2 MSA376 10.15 20.3 Dimensions in mm. Torque on screws: max. 0.5 Nm. Recommended screw: M3. Recommended pitch for mounting screws: 19 mm. Fig.8 SOT448A. 1997 Feb 18 10.3 10.0 9 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Feb 18 10 Philips Semiconductors Product specification Microwave power transistor MF1011B900Y NOTES 1997 Feb 18 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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