DISCRETE SEMICONDUCTORS DATA SHEET RX1214B300Y NPN microwave power transistor Product specification Supersedes data of June 1992 1997 Feb 19 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y FEATURES PINNING - SOT439A • Interdigitated structure provides high emitter efficiency PIN • Diffused emitter ballasting resistors providing excellent current sharing and withstanding a high VSWR 1 collector • Gold metallization realizes very stable characteristics and excellent lifetime 2 emitter 3 base connected to flange DESCRIPTION • Multicell geometry improves power sharing and reduces thermal resistance • Internal input and output matching networks for an easy circuit design. 1 olumns c APPLICATIONS b • Common base class-C wideband amplifiers operating under pulsed conditions, recommended for L-band radar applications. 3 3 e 2 MAM045 Top view DESCRIPTION NPN silicon planar epitaxial microwave power transistor in a SOT439A metal ceramic flange package with the base connected to the flange. Fig.1 Simplified outline and symbol. QUICK REFERENCE DATA Microwave performance at Tmb ≤ 25 °C in a common base class-C wideband amplifier. MODE OF OPERATION Class-C tp = 150 µs; δ = 5 % f (GHz) VCC (V) PL (W) GP (dB) ηC (%) Zi; ZL (Ω) 1.2 to 1.4 50 ≥250 ≥7 ≥35 see Fig 6 WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1997 Feb 19 2 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 65 V VCES collector-emitter voltage RBE = 0 Ω − 60 V VEBO emitter-base voltage open collector − 3 V IC collector current (DC) tp ≤ 150 µs; δ = 5 % − 21 A Ptot total power dissipation tp ≤ 150 µs; δ = 5 %; Tmb = 75 °C − 570 W Tstg storage temperature −65 +200 °C Tj operating junction temperature − 200 °C Tsld soldering temperature at 0.2 mm from case; t ≤ 10 s − 235 °C MGD976 800 handbook, halfpage Ptot (W) 600 400 200 0 −50 0 50 100 150 200 Tmb (°C) tp = 150 µs; δ = 5 % Fig.2 1997 Feb 19 Power derating curve. 3 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y THERMAL CHARACTERISTICS Tj = 100 °C unless otherwise specified SYMBOL PARAMETER CONDITIONS MAX. UNIT 0.8 K/W Rth j-mb thermal resistance from junction to mounting-base Rth mb-h thermal resistance from mounting base to heatsink note 1 0.2 K/W Zth j-h thermal impedance from junction to heatsink tp = 150 µs; δ = 5 %; notes 1 and 2 0.22 K/W MAX. UNIT Notes 1. See “Mounting recommendations in the General part of handbook SC19a”. 2. Equivalent thermal impedance under nominal pulse microwave operating conditions. CHARACTERISTICS Tmb = 25 °C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. V(BR)CBO collector-base breakdown voltage IC = 140 mA; IE = 0 65 − V V(BR)CES collector-emitter breakdown voltage IC = 140 mA; RBE = 0 Ω 60 − V V(BR)EBO emitter-base breakdown voltage IC = 0; IE = 20 mA 3 − V ICBO collector cut-off current VCB = 50 V; IE = 0 − 14 mA IEBO emitter cut-off current VEB = 1.5 V; IC = 0 − 1.4 mA APPLICATION INFORMATION Microwave performance at Tmb ≤ 25 °C in a common base class C wideband amplifier. f (GHz) VCC (V) PL (W) GP (dB) ηC (%) Zi; ZL (Ω) Pulsed tp = 150 µs; δ = 5 % 1.2 to 1.4 50 ≥250 typ. 320 ≥7 typ. 8 ≥35 typ. 40 see Fig 6 tp = 300 µs; δ = 10 % 1.2 to 1.4 50 typ. 300 typ. 7.5 typ. 35 see Fig 6 MODE OF OPERATION 1997 Feb 19 4 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y ,,,,,,,,,,,,,,,, ,,, ,,,,,,,,, ,,,,,,, , , ,, ,,,,,,, ,,, ,,, , ,,,,,,,,, ,,,,,,,,, ,, ,,,,,,,,,, ,, ,,,, ,, 12 handbook, full pagewidth 4 2.5 3 1.5 0.59 0.59 1.5 input 50 Ω output 50 Ω 2 4 12.5 10.5 2 10 1 1.5 5 1 3.5 0.5 4 1 MGK065 1.5 Dimensions in mm. Substrate: Epsilam printed-circuit board. Thickness: 0.635 mm. Permittivity: εr = 10. Fig.3 Wideband test circuit board for 1.2 to1.4 GHz application. MBH904 400 MBH903 10 handbook, halfpage handbook, halfpage Gp (dB) PL (W) Pin = 60 W 9 8 300 40 W 7 200 1.18 1.26 1.34 6 1.18 1.42 f (GHz) 1.5 tp = 150 µs; δ = 5 %. Fig.4 1997 Feb 19 1.26 1.34 f (GHz) 1.42 tp = 150 µs; δ = 5 %. Load power as a function of frequency; typical values. Fig.5 5 Power gain as a function of frequency; typical values. Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y 1 handbook, full pagewidth 0.5 2 0.2 10 1.3 +j 1.4 GHz 0.5 0.2 0 – j 5 Z i 1.2 1 2 5 10 ∞ 1.4 1.3 ZL 10 1.2 GHz 0.2 5 2 0.5 1 MCD631 Zo = 5 Ω; VCC = 50 V; PL = 250 W; Tmb = 25 °C; tp = 150 µs; δ = 5 %; class C operation. Fig.6 Input and optimum load impedances as functions of frequency; typical values. 1997 Feb 19 6 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y PACKAGE OUTLINE 12.85 max handbook, full pagewidth 0.15 max 6 max 3.3 2.9 1.6 max 3 23 max seating plane 3.7 max 2.7 min 1 9.85 max 3.3 2.7 min 2 MBC881 8.25 16.5 Dimensions in mm. Torque on nut: Max. 0.4 Nm Recommended screw: M3 Recommended pitch for mounting screw: 19 mm. Fig.7 SOT439A. 1997 Feb 19 7 10.3 10.0 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Feb 19 8 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y NOTES 1997 Feb 19 9 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y NOTES 1997 Feb 19 10 Philips Semiconductors Product specification NPN microwave power transistor RX1214B300Y NOTES 1997 Feb 19 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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