INTEGRATED CIRCUITS DATA SHEET SAA1504T Safety IC Objective specification File under Integrated Circuits, IC17 2000 Mar 07 Philips Semiconductors Objective specification Safety IC SAA1504T FEATURES GENERAL DESCRIPTION • Zero voltage start-up The SAA1504T is manufactured in a BCD Power Logic 70 process and is intended to be used as a protection circuit for single cell Li-ion battery packs. The current and voltage ratings are especially designed for use in battery packs for portable telephones such as GSM. • Discharge and charge overcurrent protection • Automatic release of current protection at removal of charger or load • Low current consumption in normal operating mode The circuit continuously monitors the battery voltage, current and junction temperature and will disconnect the battery in case of an overload situation: • Very low current consumption when battery voltage is lower than 2.3 V • Accurate voltage detection levels • Overdischarge protection prevents deep discharge of the cell; deep discharge of a Li-ion cell degrades the life cycle • Continuous monitoring of battery voltage and charge or discharge current • External power FETs are driven with an elevated supply voltage, reducing the on-resistance • Overcharge protection for safety reasons • Overcurrent protection on charge or discharge current rate • Able to accommodate 20 V charge voltage • Read out of charge (disable) status • Temperature protection for preventing charge or discharge at high temperatures • Small package (SO8) • Low external components count • Short circuit protection. • Temperature protection It must be stated that this is a safety IC to be integrated inside a battery pack. It is not primarily intended as an end of charge provision. • Charger reverse connection protection. ORDERING INFORMATION TYPE NUMBER SAA1504T 2000 Mar 07 PACKAGE NAME SO8 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm 2 VERSION SOT96-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... ST 7 5 LEVEL SHIFTER ESD VCC Philips Semiconductors Safety IC BLOCK DIAGRAM handbook, full pagewidth 2000 Mar 07 CEXT K1 × Vptat 8 ESD SAA1504T ESD reset disable mode set disable mode 6.8 V K2 × Vptat Vref VCC 2.3 V CHARGE PUMP Vcp 3 LEVEL SHIFTER 3.95 V LOGIC n.c. 6 2 4.18 V ESD Vref VSS ESD 175 mV −185 mV 3 CO ESD 4 Fig.1 Block diagram. SAA1504T MGS969 Objective specification VM CURRENT PROTECTION 1 DO Philips Semiconductors Objective specification Safety IC SAA1504T PINNING FUNCTIONAL DESCRIPTION SYMBOL PIN The basic function of the SAA1504T is to protect a single Li-ion cell against overcharge and overdischarge for reasons of life time and safety. The voltage across the cell terminals (Vbat) is monitored continuously and compared to an accurate internal reference voltage. DESCRIPTION VSS 1 ground supply DO 2 output to gate of discharge power FET CO 3 output to gate of charge power FET VM 4 negative sense input ST 5 status output n.c. 6 not connected CEXT 7 connection for external delay capacitor VCC 8 positive battery sense input The circuit diagram (see Fig.3) of a Li-ion battery pack shows the SAA1504T and 2 power NMOS transistors which are connected in anti series. Both transistors must have their backgate connected to their source, resulting in 2 backgate diodes in anti series. The timing diagram (see Fig.6) shows the detection levels for the various modes of operation. Battery voltage between 2.6 and 4.18 V handbook, halfpage VSS 1 The safety IC is in the normal operating mode for Vbat = 2.6 to 4.18 V, a charge or discharge current below the current-protection level and a junction temperature below the temperature protection activation level. In this mode transistors SW1 and SW2 are driven with an elevated supply voltage (with a charge pump) which guarantees a low on-resistance in the main current path. This is important for fully utilizing the high energy density of the Li-ion battery technology. 8 VCC DO 2 7 CEXT SAA1504T CO 3 6 n.c. VM 4 5 ST MGS970 Fig.2 Pin configuration. handbook, full pagewidth R1 + charger/load 1 kΩ C1 0.47 µF Vbat VCC 8 CEXT 7 C2 VSS DO 2 SW2 SW1 CO 5 1 3 SAA1504T 4 VM − charger/load MGS971 Fig.3 Safety IC connection diagram. 2000 Mar 07 ST 4 Philips Semiconductors Objective specification Safety IC SAA1504T Battery voltage below 2.3 V Zero voltage start-up When Vbat < 2.3 V the safety IC is in the Power-down mode: SW2 is open to block a further discharge. The safety IC has to be able to charge the battery at 0 V. This means that when connecting a charger in case of a completely empty battery, SW1 has to be open. The battery voltage will increase stepwise, because of the sudden disconnection of the load. The safety IC will not re-enter the normal operating mode at this event unless the battery voltage exceeds the power-down release level of 2.6 V and a charge current is present. So when no charger is present in the Power-down mode, the safety IC stays in this mode, independent of the battery voltage. In the Power-down mode output CO is connected via a diode to VCC, so that the charge transistor will be active when VVM is negative. Maximum charge or discharge current and temperature protection Connecting a charger in the Power-down mode is detected by a negative voltage on pin VM. Because the voltage at pin VM is defined by a charge current via the backgate diode of SW2, a charge current of a few nAs is already detected. When a charge current is detected and Vbat > 2.6 V, the system will go from the Power-down mode to the normal operating mode. When the maximum charge or discharge current is exceeded or when the maximum temperature is detected the disable mode is activated and will open both switches. Exceeding the maximum charge or discharge current is detected by a voltage drop or rise on pin VM when both switches are closed. A release of this mode can only be achieved by removing the load (or charger) and at a junction temperature below 60 °C. The disable mode is followed by a return to its previous mode. In the Power-down mode the supply current is reduced to 150 nA (typical value) for minimizing the discharge of the battery by the safety IC. This is achieved by disabling all analog circuitry, except the circuitry for detecting the presence of a charger and for detecting Vbat > 2.6 V. Because the charge pump is disabled and battery charging should be possible, SW1 is switched on with a reduced Vgs voltage. Normal operating mode In case of correct temperature, battery voltage and charge or discharge current, the system will be in the normal operating mode (see Fig.4). Battery voltage above 4.18 V Both the charge and discharge outputs will be HIGH (CO = 1 and DO = 1), so both switches are closed. When the battery is charged to Vbat > 4.18 V, the safety IC will enter the charge inhibit mode: SW1 is open and charging is disabled. Power-down mode When Vbat < 2.3 V the safety IC will enter the Power-down mode (see Fig.4). The power-down detection level of 2.3 V has a delay of 5 ms (typical value). The Power-down mode will also be entered without delay when Vbat < 1.9 V. Connecting a load in the charge inhibit mode is detected by the reversal of the voltage across SW1 and will immediately close SW1, so entering the discharge enable mode. A short time is needed to charge the gate of SW1. During this time the backgate diode between drain and source of SW1 conducts. In this mode only charging of the battery is allowed (CO = 1 and DO = 0). The safety IC will remain in the discharge enable mode unless: The safety IC will return to the normal operating mode as soon as Vbat > 2.6 V and a charge current is detected at the same time. • Vbat < 3.95 V, which results in re-entering the normal operating mode. This transition is not externally noticeable, because both switches remain closed. • A charger is connected, which will immediately open SW1. As an additional safety precaution Vbat > 4.18 V also yields the same reaction, because otherwise a small current of a charger may be undetected, leading to overcharging the Li-ion cell. 2000 Mar 07 5 Philips Semiconductors Objective specification Safety IC SAA1504T From the discharge enable mode the charge inhibit mode will be entered again as soon as a charge current is detected or Vbat > 4.18 V. The detection of a higher voltage than 4.18 V is necessary. If the battery is charged with a very low charge current, the safety IC will not switch from the discharge enable mode to the charge inhibit mode. Eventually, the safety IC will enter the charge inhibit mode if the battery is overcharged to Vbat > 4.18 V because of a small charge current. Charge inhibit mode When Vbat > 4.18 V, the charge inhibit mode will be entered (see Fig.4). At this mode the battery can only be discharged (CO = 0 and DO = 1). The excess charge delay can be set by means of an external capacitor. The delay is then defined as: ted(det) = 30 × CCEXT with ted(det) in ms and CCEXT in nF. When Vbat < 3.95 V, the safety IC will return from the charge inhibit mode to the normal operating mode. When Vbat < 3.95 V the safety IC will return from the discharge enable to the normal operating mode. The charge inhibit mode will also be entered as soon as a charge current is detected in the discharge enable mode If the safety IC is in the charge inhibit mode, it will usually go to the normal operating mode via the discharge enable mode. But if the system is in the charge inhibit mode and the battery pack is stored for several years, the battery voltage can drop because of the battery discharge by the safety IC and the self discharge of the battery. So a voltage drop of the battery is possible, without detecting a discharge current. Because of this, the normal operating mode should also be entered from the charge inhibit mode when Vbat < 3.95 V and not only from the discharge enable mode. In this way, charging a battery is always possible if Vbat < 3.95 V. Discharge enable mode When the safety IC is in the charge inhibit mode, charging of the battery is disabled because SW1 is open. Initially discharge of the battery will then occur via the backgate diode of SW1. The load voltage will be approximately 0.6 V lower and dissipation of the backgate diode of SW1 will occur. It is preferable to close both switches at that time without allowing charging of the battery until Vbat < 3.95 V. If a discharge current is detected in the charge inhibit mode, the system will activate the discharge enable mode, closing both switches. handbook, full pagewidth T > 100 °C or I > Imax VVM > 480 mV disable mode(1) CO, DO discharge enable CO, DO −185 mV < VVM < 175 mV and T < 60 °C Vbat > 4.18 V or VVM < −10 mV Vbat < 3.95 V to previous mode normal operating CO, DO charge inhibit CO, DO Vbat < 3.95 V Vbat > 4.18 V Vbat > 2.6 V and VVM < −185 mV power down CO, DO (1) Minimum time in the disable mode is about 5 ms. Fig.4 Flow diagram. 2000 Mar 07 6 from all modes Vbat < 1.9 V or Vbat < 2.3 V at 5 ms MGS973 Philips Semiconductors Objective specification Safety IC SAA1504T Disable mode The delay of the current protection as a function of the sense voltage VVM (for charge and discharge) is given in Fig.5. When the charge or discharge current exceeds the specified maximum value, the disable mode is entered. Detection of the maximum charge or discharge current is only activated when the outputs are HIGH (CO = 1 and DO = 1) as explained next. The disable mode is also entered when the junction temperature exceeds 100 °C. When the temperature drops below 60 °C and at the absence of a charger or load, the safety IC will return to its previous mode. If the safety IC is in the Power-down mode and a charge current is detected (e.g. VVM = −0.6 V) the normal operating mode will be entered when Vbat > 2.6 V. Because of a minimum time in which the gate capacitors have to be charged, VVM = −0.6 V for a small period, when the safety IC is already in the normal operating mode. VVM = −0.6 V could also occur when the battery is charged with a current exceeding the maximum charge current. To prevent that a maximum charge current is detected when coming from the Power-down mode a delay is included to ensure charging of both outputs CO and DO. So entering of the disable mode is enabled when both outputs CO and DO are fully charged or after a certain delay. The delay is necessary to activate the current protection even in case the outputs CO or DO can not be fully charged. Status output The status of the safety IC is available on pin ST. Table 1 Functional table of the status output MODE OUTPUT PIN ST Normal operating LOW Charge inhibit HIGH Discharge enable LOW Power-down LOW Disable HIGH (note 1) Note 1. Only when a charger is connected. The same applies for entering the disable mode when the safety IC is in the discharge enable mode. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages measured with respect to pin VSS. SYMBOL PARAMETER CONDITION MIN. MAX. UNIT VCC positive battery sense input voltage DC constant −0.3 +4.5 V VCC(clamp) clamping voltage ICC(clamp) = 7 mA; t < 60 ms − 8.5 V ICC(clamp) clamping current − 7 mA Vrev reverse charger voltage − 20 V VVM negative sense input voltage VCC − 20 VCC + 20 V VST voltage on pin ST VVM VCC V Tamb ambient temperature −25 +80 °C Tstg storage temperature −55 +150 °C Vrev = −(VCC − VVM); VVM positive with respect to VCC THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS thermal resistance from junction to ambient in free air QUALITY SPECIFICATION In accordance with “SNW-FQ-611-D” and JEDEC class III. 2000 Mar 07 7 VALUE UNIT 160 K/W Philips Semiconductors Objective specification Safety IC SAA1504T CHARACTERISTICS Tamb = 25 °C; voltages measured with respect to pin VSS; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 0 − 4.5 V 7.0 9.0 11 µA VCC = 2.0 V 75 150 300 nA VCC = 1.5 V 35 75 150 nA at zero charge current; VCC = 0 V 1.8 2.4 3.0 V Supply behaviour VCC positive battery sense input voltage ICC supply current VCC = 4.0 V; VVM = 0 V Iq quiescent supply current Power-down mode VCC − VVM minimum charge voltage Detection levels of Vbat; note 1 Vec(det) excess charge detection voltage Tj = 25 °C 4.155 4.18 4.205 V Tj = −10 to +60 °C 4.150 4.18 4.210 V tec(det) excess charge detection voltage delay CCEXT = 33 nF ±10% 0.4 1 2 s Vec(rel) excess charge release voltage 3.87 3.95 4.03 V Vpd(rel) power-down release voltage 2.35 2.6 2.85 V Vpd(det) power-down detection voltage 2.25 2.3 2.35 V tpd(det) power-down detection voltage delay 1 5 17 ms Vpd(min) power-down minimum voltage 1.6 1.9 2.2 V charge inhibit mode 450 480 510 mV Detection levels on pin VM Vdch(det) discharge detection voltage Vch(det) charge detection voltage discharge enable mode −5 −10 −20 mV Vch(pres) charger present voltage Power-down or disable mode −120 −185 −250 mV Vl(pres) load present voltage disable mode 145 175 205 mV IVM current at pin VM VCC − VVM = 15 V; VCC = 4.33 V 1 2 3 µA Outputs on pins CO and DO VOH HIGH-level output voltage VCC = 2.4 V; RL = ∞ 4.4 4.6 4.8 V VCC = 4.0 V; RL = ∞ 6.4 7 7.6 V disable mode 90 100 110 °C 50 60 70 °C Temperature protection Tprot(start) start of temperature protection Tprot(rel) release of temperature protection Current protection; see Fig.5; note 2 Vprot(min) minimum current-protection voltage DC level on pin VM 150 250 350 mV td delay minimum value 100 200 400 µs at VVM = 510 mV 2 4 8 ms 2000 Mar 07 8 Philips Semiconductors Objective specification Safety IC SAA1504T SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC − VVM = 20 V 13 17 21 µA VCC − VVM = 4 V 9 12 15 µA Status output on pin ST output current IO pin ST = HIGH; see Table 1; VST = VVM + 0.5 V Notes 1. The voltages are measured at the terminals of the battery. This voltage equals the voltage across series resistor R1 = 1 kΩ plus the voltage on pin VCC (see Fig.3). 2. For both charge and discharge state. MGS972 10 handbook, halfpage td (s) 1 charge discharge 10−1 10−2 10−3 10−4 −1 −0.5 0 0.5 1 VVM (V) Fig.5 Current-protection delay. 2000 Mar 07 9 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors Safety IC Objective specification SAA1504T MGS974 TIMING DIAGRAM SW1 on off SW2 on off VM Vbat +Vdiode −Vdiode 0 Vbat − Vcharger 10 charger present load present no charger; no load no charger; no load no charger; no load charger present load present no charger; no load charger present I ch > I max charger present no charger; no load charger present no charger; no load I dch > I max load present load present load present disable mode discharge enable charge inhibit normal operating disable mode normal operating power-down handbook, full pagewidth normal operating discharge enable charge inhibit discharge enable charge inhibit power-down normal operating 2000 Mar 07 td ted(det) tec(det) Fig.6 Timing diagram. td tec(det) normal operating 2.6 2.3 no charger; no load 4.18 3.95 discharge enable Vbat Philips Semiconductors Objective specification Safety IC SAA1504T PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 2000 Mar 07 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 11 o 8 0o Philips Semiconductors Objective specification Safety IC SAA1504T SOLDERING If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 2000 Mar 07 12 Philips Semiconductors Objective specification Safety IC SAA1504T Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2000 Mar 07 13 Philips Semiconductors Objective specification Safety IC SAA1504T NOTES 2000 Mar 07 14 Philips Semiconductors Objective specification Safety IC SAA1504T NOTES 2000 Mar 07 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403506/25/01/pp16 Date of release: 2000 Mar 07 Document order number: 9397 750 06537