V6203628 VID

REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Make change to VIH and VIL as specified under
paragraph 1.4.
03-10-31
R. MONNIN
B
Add device type 02. Make changes to 1.3, 1.4,
table I, figure 1, figure 2, figure 3, and
figure 4. - ro
05-09-29
R. MONNIN
C
Update boilerplate paragraphs to current
requirements. - PHN
13-10-28
Thomas M. Hess
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
TOM HESS
03-04-08
TITLE
MICROCIRCUIT, DIGITAL-LINEAR, LOW POWER,
DUAL, 12-BIT DIGITAL-TO-ANALOG CONVERTER
WITH INTERNAL REFERENCE AND POWER DOWN,
MONOLITHIC SILICON
APPROVED BY
RAYMOND MONNIN
SIZE
CODE IDENT. NO.
A
REV
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DWG NO.
V62/03628
16236
C
PAGE
1
OF
13
5962-V004-14
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance low power, dual, digital-to-analog converter
with internal reference and power down microcircuit, with an operating temperature ranges of -40°C to +125°C for device type 01 and of
-55°C to +125°C for device type 02.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/03628
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
01
TLV5638Q-EP
02
TLV5638M-EP
Circuit function
Low power, dual, digital-to-analog converter
with internal reference and power down
Low power, dual, digital-to-analog converter
with internal reference and power down
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
8
JEDEC PUB 95
Package style
MS-012
Plastic small outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer:
Finish designator
A
B
C
D
E
Z
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
SIZE
A
CODE IDENT NO.
16236
REV
C
DWG NO.
V62/03628
PAGE
2
1.3 Absolute maximum ratings.
1/
Supply voltage (VDD to AGND) ....................................................................... 7 V
Reference input voltage range ........................................................................ -0.3 V VDD +0.3 V
Digital input voltage range ...............................................................................
Storage temperature range ..............................................................................
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds ....................
Package thermal impedance, (θJA) .................................................................
-0.3 V VDD +0.3 V
-65°C to +150°C
260°C
131°C/W
1.4 Recommended operating conditions. 2/
Supply voltage (VDD):
With VDD = 5 V ............................................................................................ 4.5 V to 5.5 V
With VDD = 3 V ............................................................................................ 2.7 V to 3.3 V
Power on reset (POR) ..................................................................................... 0.55 V to 2.0 V
High level digital input voltage (VIH):
With VDD = 2.7 V ......................................................................................... 2.0 V minimum
With VDD = 5.5 V ......................................................................................... 2.4 V minimum
Low level digital input voltage (VIL):
With VDD = 2.7 V ......................................................................................... 0.6 V maximum
With VDD = 5.5 V ......................................................................................... 0.8 V maximum
Reference voltage (Vref to REF terminal):
With VDD = 5 V ............................................................................................ AGND to VDD-1.5 3/
With VDD = 3 V ............................................................................................ AGND to VDD-1.5 3/
Load resistance (RL) ....................................................................................... 2 kΩ minimum
Load capacitance (CL) .................................................................................... 100 pF maximum
Clock frequency (fCLK) .................................................................................... 20 MHz maximum
Ambient operating temperature range (TA) :
Device type 01 ............................................................................................. -40°C to +125°C 4/
Device type 02 ............................................................................................. -55°C to +125°C 4/
1/
2/
3/
4/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
Due to the x2 output buffer, a reference input voltage ≥ (VDD – 0.4 V) / 2 causes clipping of the transfer function.
The output buffer of the internal reference must be disabled, if an external reference in used.
Long term high temperature storage and/or extended use at maximum recommended operating conditions may result in a
reduction of overall device life.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
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V62/03628
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington,
VA 22201-3834 or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Block diagram. The block diagram shall be as shown in figure 3.
3.5.4 Timing waveforms. The timing waveforms shall be as shown in figure 4.
DEFENSE SUPPLY CENTER, COLUMBUS
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CODE IDENT NO.
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TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Limits
Min
Unit
Max
Power supply section
Power supply current
IDD
VDD = 5 V, internal reference, fast
no load, all inputs = AGND or VDD,
DAC latch = 0x800
VDD = 5 V, internal reference, slow
-40°C to +125°C for
device type 01
and
-55°C to +125°C for
device type 02
7
mA
3.6
no load, all inputs = AGND or VDD,
DAC latch = 0x800
6.3
VDD = 3 V, internal reference, fast
no load, all inputs = AGND or VDD,
DAC latch = 0x800
3.0
VDD = 3 V, internal reference, slow
no load, all inputs = AGND or VDD,
DAC latch = 0x800
6.3
VDD = 5 V, external reference, fast
no load, all inputs = AGND or VDD,
DAC latch = 0x800
3.0
VDD = 5 V, external reference, slow
no load, all inputs = AGND or VDD,
DAC latch = 0x800
5.7
VDD = 3 V, external reference, fast
no load, all inputs = AGND or VDD,
DAC latch = 0x800
2.6
VDD = 3 V, external reference, slow
no load, all inputs = AGND or VDD,
DAC latch = 0x800
Power down supply
current
Power supply rejection
10
PSRR
ratio
Zero scale 3/
-65 typical
Full scale 4/
-65 typical
µA
dB
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
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SIZE
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CODE IDENT NO.
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PAGE
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Limits
Min
Unit
Max
Static DAC specifications section
Resolution
Integral nonlinearity,
end point adjusted
INL
5/
Differential nonlinearity
DNL
6/
Zero scale error
(offset error at zero
scale)
EZS
7/
Zero scale error
temperature
coefficient
EZS TC
8/
Gain error
EG
9/
Gain error temperature
coefficient
EG TC
10/
-40°C to +125°C for
device type 01
and
-55°C to +125°C for
device type 02
12
Bits
±6
LSB
±1
LSB
±24
mV
10 typical
±0.6
10 typical
ppm/°C
% full
scale V
ppm/°C
Output specifications section
Output voltage
VO
Output load regulation
accuracy
RL = 10 kΩ
VO = 4.096 V, 2.048 V, RL = 2 kΩ
-40°C to +125°C for
device type 01
and
-55°C to +125°C for
device type 02
0
VDD –
0.4
V
±0.25
% full
scale V
-40°C to +125°C for
device type 01
and
-55°C to +125°C for
device type 02
1.003
1.045
V
2.027
2.069
V
1
mA
Reference pin configured as output (REF) section
Low reference voltage
Vref
(OUTL)
High reference voltage
Vref
(OUTH)
Output source current
Iref
(source)
Output sink current
Iref
(sink)
VDD > 4.75 V
-1
mA
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Limits
Min
Unit
Max
Reference pin configured as output (REF) section – continued
Load capacitance
CL
Power supply rejection
ratio
PSRR
-40°C to +125°C
for device type 01
and
-55°C to +125°C
for device type 02
100
pF
-65 typical
dB
0
V
Reference pin configured as output (REF) section
Input voltage
-40°C to +125°C
for device type 01
and
-55°C to +125°C
for device type 02
VI
Input resistance
RI
Input capacitance
CI
Reference input
bandwidth
Reference feedthrough
VDD –
1.5
10 typical
MΩ
5 typical
pF
REF = 0.2 VPP + 1.024 V dc, fast
1.3 typical
MHz
REF = 0.2 VPP + 1.024 V dc, slow
525 typical
KHz
REF = 1 VPP at 1 kHz + 1.024 V dc 11/
-80 typical
dB
1
µA
Digital inputs section
High level digital input
current
IIH
VI = VDD
Low level digital input
current
IIL
VI = 0 V
Input capacitance
CI
-40°C to +125°C
for device type 01
and
-55°C to +125°C
for device type 02
µA
-1
8 typical
pF
Analog output dynamic performance section
Output settling time,
full scale
tS(FS)
RL = 10 kΩ, CL = 100 pF, fast 12/
RL = 10 kΩ, CL = 100 pF, slow 12/
Output settling time,
code to code
tS(CC)
-40°C to +125°C
for device type 01
and
-55°C to +125°C
for device type 02
3
µs
7
RL = 10 kΩ, CL = 100 pF, fast 13/
1.5
RL = 10 kΩ, CL = 100 pF, slow 13/
2
µs
See footnotes at end of table.
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SIZE
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CODE IDENT NO.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Limits
Min
Unit
Max
Analog output dynamic performance section – continued
Slew rate
SR
RL = 10 kΩ, CL = 100 pF, fast 14/
RL = 10 kΩ, CL = 100 pF, slow 14/
Glitch energy
DIN = 0 to 1, FCLK = 100 kHz,
-40°C to +125°C
for device type 01
and
-55°C to +125°C
for device type 02
12 typical
V/µs
1.8 typical
5 typical
nV-s
CS = VDD
Signal to noise ratio
SNR
fS = 480 kSPS, fout = 1 kHz,
69
dB
58
dB
RL = 10 kΩ, CL = 100 pF
Signal to noise +
distortion
S/(N+D)
Total harmonic
distortion
THD
fS = 480 kSPS, fout = 1 kHz,
RL = 10 kΩ, CL = 100 pF
-57
fS = 480 kSPS, fout = 1 kHz,
dB
RL = 10 kΩ, CL = 100 pF
Spurious free
dynamic range
fS = 480 kSPS, fout = 1 kHz,
57
dB
10
ns
10
ns
RL = 10 kΩ, CL = 100 pF
Digital input timing requirement section
Setup time, CS low
before first negative
SCLK edge
tSU
(CS-CK)
See figure 4
Setup time, 16 th
negative SCLK edge
(when D0 is sampled)
tSU
(C16-CS)
See figure 4
SCLK pulse width high
tWH
See figure 4
25
ns
SCLK pulse width low
tWL
See figure 4
25
ns
-40°C to +125°C
for device type 01
and
-55°C to +125°C
for device type 02
before CS rising
edge
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/
Temperature,
TA
Limits
Min
Unit
Max
Digital input timing requirement section – continued.
Setup time, data ready
before SCLK falling
edge
tsu(D)
See figure 4
Hold time, data held
valid after SCLK
falling edge
th(D)
See figure 4
-40°C to +125°C for
device type 01
and
-55°C to +125°C for
device type 02
10
ns
5
ns
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
2/
Unless otherwise specified, VDD = 2.7 V to 5.5 V, Vref = 2.048 V, Vref = 1.024 V.
3/
Power supply rejection ratio at zero scale is measured by varying VDD and is given by:
PSRR = 20 log [ (EZS (VDDmax) – EZS (VDDmin)) / VDDmax ].
4/
Power supply rejection ratio at full scale error is measured by varying VDD and is given by:
7/
PSRR = 20 log [ (EG (VDDmax) – EG (VDDmin)) / VDDmax ].
The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of
the output from the line between zero and full scale excluding the effects of zero code and full scale errors.
Tested from code 32 to 4095.
The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measure and
ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same
direction (or remains constant) as a change in the digital input code.
Zero scale error is the deviation from zero voltage output when the digital input code is zero.
8/
Zero scale error temperature coefficient is given by: EZS TC = [ EZS (Tmax) – EZS (Tmin) ] / Vref x 10 / (Tmax – Tmin).
9/
Gain error is the deviation from the ideal output (2 Vref – 1 LSB) with an output load of 10 kΩ excluding the effects of
the zero-error.
5/
6/
6
6
10/
Gain temperature coefficient is given by: EG TC = [ EG (Tmax) – EG (Tmin) ] / Vref x 10 / (Tmax – Tmin).
11/ Reference feedthrough is measured at the DAC output with an input code = 0x000.
12/ Settling time is the time for the output signal to remain within ±0.5 LSB of the final measured value for a digital input code
change of 0x020 to 0xFDF and 0xFDF to 0x020 respectively. Not tested, assured by design.
13/ Settling time is the time for the output signal to remain with ±0.5 LSB of the final measured value for a digital input code
change of one count. Not tested, assured by design.
14/ Slew rate determines the time it takes for a change of the DAC output from 10% to 90% full scale voltage.
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Case X
FIGURE 1. Case outlines.
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Case X
Dimensions
Millimeters
Symbol
Min
Max
Symbol
Inches
Min
Max
A
A1
b
c
D
--0.069
0.004
0.010
0.012
0.020
0.008 nominal
0.189
0.197
--1.75
0.10
0.25
0.31
0.51
0.20 nominal
4.80
5.00
E
E1
e
L
Inches
Min
Max
0.150 0.157
0.228 0.244
0.050
0.016 0.050
Millimeters
Min
Max
3.80
5.80
4.00
6.20
1.27
0.40
1.27
NOTE:
1. Controlling dimensions are inch, millimeter dimensions are given for reference only.
2. Body dimensions do not include mold flash or protrusion not to exceed 0.006 inch (0.15 mm).
3. Falls within JEDEC MS-012-AA.
FIGURE 1. Case outline. – continued.
Device types
01 and 02
Terminal number
Terminal symbol
I/O/P
Description
1
DIN
I
Digital serial data input
2
SCLK
I
Digital serial clock input
3
CS
I
Chip select. Digital input active low, used
to enable/disable inputs.
4
OUTPUT A
O
DAC A analog output
5
AGND
P
Ground
6
REF
I/O
7
OUTPUT B
O
DAC B analog output
8
VDD
P
Positive power supply
Analog reference voltage input / output
FIGURE 2. Terminal connections.
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FIGURE 3. Block diagram.
FIGURE 4. Timing waveforms.
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4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Vendor part number
Top-side marking
V62/03628-01XE
01295
TLV5638QDREP
5638QE
V62/03628-02XE
01295
TLV5638MDREP
5638ME
1/ The vendor item drawing establishes an administrative control number for identifying the item
on the engineering documentation.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
SIZE
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CODE IDENT NO.
16236
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