LDS-0185-1

2N3057A
Compliant
LOW POWER NPN SILICON TRANSISTOR
Qualified per MIL-PRF-19500/391
Qualified Levels:
JAN, JANTX,
JANTXV, and JANS
DESCRIPTION
This 2N3057A NPN leaded silicon transistor device is military qualified for high-reliability
applications. Microsemi also offers numerous other transistor products to meet higher and
lower power ratings with various switching speed requirements in both through-hole and
surface-mount packages.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
•
JEDEC registered 2N3057 number.
•
•
JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/391.
Rad hard levels are also available per MIL-PRF-19500/391.
(For RHA datasheet see JANSD2N3057A.)
RoHS compliant by design.
•
TO-46 (TO-206AB)
Package
Also available in:
TO-39 (TO-205AD)
(short-leaded)
2N3019S
TO-5 package
APPLICATIONS / BENEFITS
•
•
•
•
(long-leaded)
2N3019
Low profile metal TO-46 leaded package.
Light weight.
General–purpose switching and amplifier applications.
Military and high-reliability applications.
TO-18 (TO-206AA)
(leaded)
2N3700
UB package
(surface mount)
2N3700UB
o
MAXIMUM RATINGS @ TA = +25 C unless otherwise noted.
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Impedance Junction-to-Ambient
Thermal Impedance Junction-to-Case
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current
o
(1)
Total Power Dissipation:
@ TA = +25 C
o
(2)
@ TC = +25 C
Notes:
Symbol
Value
TJ and TSTG
RӨJA
RӨJC
VCEO
VCBO
VEBO
IC
PD
-65 to +200
325
80
80
140
7.0
1.0
0.5
1.8
1. Derate linearly 2.3 mW/°C for TA ≥ +25 °C.
2. Derate linearly 10.3 mW/°C for TC ≥ +25 °C.
T4-LDS-0185-1, Rev. 1 (121562)
Unit
o
C
C/W
o
C/W
V
V
V
A
W
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
©2012 Microsemi Corporation
Page 1 of 6
2N3057A
MECHANICAL and PACKAGING
•
•
•
•
•
CASE: Low profile nickel cap.
TERMINALS: Gold over nickel plated kovar leads. Solder dip (Sn63/Pb37) available upon request. NOTE: Solder dip will
eliminate RoHS compliance.
MARKING: Part number, date code, manufacturer’s ID and serial number.
WEIGHT: Approximately 0.234 grams.
See Package Dimensions on last page.
PART NOMENCLATURE
JAN
2N3057A
Reliability Level
JAN = JAN level
JANTX = JANTX level
JANTXV = JANTXV level
JANS = JANS level
Blank = Commercial
Symbol
f
IB
IE
TA
TC
VCB
VCE
VEB
JEDEC type number
(see Electrical Characteristics
table)
SYMBOLS & DEFINITIONS
Definition
Frequency
Base current (dc)
Emitter current (dc)
Ambient temperature
Case temperature
Collector to base voltage (dc)
Collector to emitter voltage (dc)
Emitter to base voltage (dc)
T4-LDS-0185-1, Rev. 1 (121562)
©2012 Microsemi Corporation
Page 2 of 6
2N3057A
ELECTRICAL CHARACTERISTICS @ TA = +25 °C, unless otherwise noted
Parameters / Test Conditions
OFF CHARACTERISTICS
Collector-Emitter Breakdown Current
IC = 30 mA
Collector-Base Cutoff Current
VCB = 140 V
Emitter-Base Cutoff Current
VEB = 7 V
Collector-Emitter Cutoff Current
VCE = 90 V
Emitter-Base Cutoff Current
VEB = 5.0 V
ON CHARACTERISTICS
Forward-Current Transfer Ratio
Symbol
Min.
V(BR)CEO
80
IC = 150 mA, VCE = 10 V
IC = 0.1 mA, VCE = 10 V
IC = 10 mA, VCE = 10 V
IC = 500 mA, VCE = 10 V
IC = 1.0 A, VCE = 10 V
Max.
Unit
V
ICBO
10
µA
IEBO1
10
µA
ICES
10
ηA
IEBO2
10
ηA
hFE
100
50
90
50
15
300
300
300
Collector-Emitter Saturation Voltage
IC = 150 mA, IB = 15 mA
IC = 500 mA, IB = 50 mA
VCE(sat)
0.2
0.5
V
Base-Emitter Saturation Voltage
IC = 150 mA, IB = 15 mA
VBE(sat)
1.1
V
Unit
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions
Small-Signal Short-Circuit Forward Current Transfer Ratio
IC = 1.0 mA, VCE = 5.0 V, f = 1.0 kHz
Symbol
Min.
Max.
hfe
80
400
5.0
20
Magnitude of Small-Signal Short-Circuit Forward Current
Transfer Ratio
IC = 50 mA, VCE = 10 V, f = 20 MHz
|hfe|
Output Capacitance
VCB = 10 V, IE = 0, 100 kHz ≤ f ≤ 1.0 MHz
Cobo
12
pF
Input Capacitance
VEB = 0.5 V, IC = 0, 100 kHz ≤ f ≤ 1.0 MHz
Cibo
60
pF
T4-LDS-0185-1, Rev. 1 (121562)
©2012 Microsemi Corporation
Page 3 of 6
2N3057A
ELECTRICAL CHARACTERISTICS @ TA = +25 °C, unless otherwise noted (continued)
SAFE OPERATION AREA (See SOA graph below and MIL-STD-750, method 3053)
DC Tests
TC = 25 °C, 1 cycle, t = 10 ms
Test 1
VCE = 10 V
IC = 180 mA
Test 2
VCE = 40 V
IC = 45 mA
Test 3
VCE = 80 V
IC = 22.5 mA
IC – COLLECTOR CURRENT - µA
(1) Pulse Test: Pulse Width = 300 µs, duty cycle ≤ 2.0%.
VCE – COLLECTOR – EMITTER VOLTAGE – V
Maximum Safe Operating Area
T4-LDS-0185-1, Rev. 1 (121562)
©2012 Microsemi Corporation
Page 4 of 6
2N3057A
Maximum DC Operation Rating (W)
GRAPHS
o
TA ( C) Ambient
Maximum DC Operation Rating (W)
FIGURE 1
Temperature-Power Derating (RӨJA)
Leads = .125 inch (3.175mm)
o
TC ( C) Case at base
FIGURE 2
Temperature-Power Derating (RӨJC)
T4-LDS-0185-1, Rev. 1 (121562)
©2012 Microsemi Corporation
Page 5 of 6
2N3057A
PACKAGE DIMENSIONS
Symbol
CD
CH
HD
LC
LD
LL
LU
L1
L2
TL
TW
r
α
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.178
.195
4.52
4.95
.065
.085
1.65
2.16
.209
.230
5.31
5.84
.100 TP
2.54 TP
.016
.021
0.41
0.53
.500
1.750 12.70 44.45
.016
.019
0.41
0.48
.050
1.27
.250
6.35
.028
.048
0.71
1.22
.036
.046
0.91
1.17
.007
0.18
45° TP
45° TP
Note
6
7
7
7
7
7
3
2
10, 11
6
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
Dimensions are in inches.
Millimeters are given for general information only.
Beyond r (radius) maximum, TW shall be held for a minimum length of .011 inch (0.28 mm).
Dimension TL measured from maximum HD.
Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm)
radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. This device may be measured by
direct methods.
Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in
L1 and beyond LL minimum.
All three leads.
The collector shall be internally connected to the case.
Dimension r (radius) applies to both inside corners of tab.
In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
Lead 1 = emitter, lead 2 = base, lead 3 = collector.
T4-LDS-0185-1, Rev. 1 (121562)
©2012 Microsemi Corporation
Page 6 of 6