QTP NO 063202 44-LEAD-BELOW TSOPII, NIPDAU, KE-G3000-6000DA MC, MSL3, 260C, CML-R.pdf

Document No. 001-85277 Rev. *A
ECN #: 4629950
Cypress Semiconductor
Package Qualification Report
QTP# 063202 VERSION*A
January 2015
<44-Lead TSOP II
NiPdAu, MSL3, 260C Reflow
CML-R
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No. 001-85277 Rev. *A
ECN #: 4629950
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
DESCRIPTION OF QUALIFICATION PURPOSE
DATE
COMP.
060905
<44-Lead TSOP II (without down bonds), using Hitachi-CEL9200CYR Mold
Compound, NiPdAu, MSL3, 260C Reflow assembled at CML-R
May 06
063202
<44-Lead TSOP II NiPdAu, using Kyocera KE-G3000DA (for non-SRAMs), KEG6000DA (for SRAMs) Mold Compound, MSL3, 260C Reflow assembled at
CML-R
Oct 06
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Document No. 001-85277 Rev. *A
ECN #: 4629950
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
ZW44
Package Designation:
Package Outline, Type, or Name:
Mold Compound Flammability Rating:
44-Lead Thin Small Outline. Type II
Kyocera - KE G3000DA with PMC (for non-SRAMs)
Kyocera - KE G6000DA (for SRAMs)
UL94 – V0
Oxygen Rating Index:
None
Leadframe
Copper
Mold Compound Name/Manufacturer:
Material:
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation
Method/Metallization:
Backgrind
Die Separation Method:
100% Saw Through
Die Attach Supplier:
Dexter
Die Attach Material:
QMI509
Die Attach Method:
Epoxy
Bond Diagram Designation
Not Applicable
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au. 1.0 mil
Thermal Resistance Theta JA C/W:
50.66 °C/W
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
Not Applicable
Name/Location
facility:
of
Assembly
(prime)
CML-R
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test
Location:
CML-R
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No. 001-85277 Rev. *A
ECN #: 4629950
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Temperature Cycle
Test Condition
(Temp/Bias)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Result
P/F
P
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
Pressure Cooker Test
121°C, 100%RH, 15 Psig
P
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
High Accelerated Saturation Test (HAST)
130°C, 3.63V, 85%RH
P
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
Acoustics Microscopy
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30C, 60% RH)
P
Dye Penetration
Test to determine the existence and extent of cracks, Criteria: No
Package Crack
P
High Temperature Storage
150°C, no bias
P
X-Ray
MIL-STD-883-2012
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
Document No. 001-85277 Rev. *A
ECN #: 4629950
Reliability Test Data
QTP #: 060905
Device
Fab Lot #
Assy Lot # Assy Loc Duration
Samp
Rej
CY7C1041BV33 (7C1341C)
4436950
610511269
CML-R
COMP
15
0
CY7C1041BV33 (7C1341C)
4436950
610511569
CML-R
COMP
15
0
CY7C1041BV33 (7C1341C)
4435627
610514432
CML-R
COMP
15
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH, PRE COND 192HR 30C/60%RH, MSL3
CY7C1041BV33 (7C1341C)
4428378
610510764
CML-R
128
45
0
STRESS: HIGH TEMPERATURE STORAGE, no bias
CY7C1041CV33 (7C1341R)
4428378
610514205
CML-R
500
50
0
CY7C1041CV33 (7C1341R)
4428378
610514205
CML-R
1000
50
0
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192HR 30C/60%RH, MSL3
CY7C1041BV33 (7C1341C)
4428378
610458652
CML-R
168
50
0
STRESS: TC COND. C –65C TO 150C, PRE COND 192HR 30C/60%RH, MSL3
CY7C1041BV33 (7C1341C)
4436950
610511269
CML-R
300
50
0
CY7C1041BV33 (7C1341C)
4436950
610511269
CML-R
500
50
0
CY7C1041BV33 (7C1341C)
4436950
610511569
CML-R
300
50
0
CY7C1041BV33 (7C1341C)
4435627
610514432
CML-R
300
50
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No. 001-85277 Rev. *A
ECN #: 4629950
Reliability Test Data
QTP #: 063202
Device
Fab Lot #
Assy Lot # Assy Loc Duration
Samp
Rej
CY7C1041D (7C1541SC)
4620290
610643650M
CML-R
COMP
15
0
CY7C1041D (7C1541SC)
4620290
610643650M1 CML-R
COMP
15
0
CY7C1041D (7C1541SC)
4620290
610643650M2 CML-R
COMP
15
0
4620290
610643650M2 CML-R
COMP
15
0
1000
50
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: DYE PENETRATION
CY7C1041D (7C1541SC)
STRESS: HIGH TEMPERATURE STORAGE, no bias
CY62256LL (7A62256E)
4512383
610535998
CML-R
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192HR 30C/60%RH, MSL3
CY7C1041D (7C1541SC)
4620290
610643650M
CML-R
168
50
0
STRESS: TC COND. C –65C TO 150C, PRE COND 192HR 30C/60%RH, MSL3
CY7C1041D (7C1541SC)
4620290
610643650M
CML-R
300
50
0
CY7C1041D (7C1541SC)
4620290
610643650M
CML-R
500
50
0
CY7C1041D (7C1541SC)
4620290
610643650M1 CML-R
300
50
0
CY7C1041D (7C1541SC)
4620290
610643650M1 CML-R
500
48
0
CY7C1041D (7C1541SC)
4620290
610643650M2 CML-R
300
50
0
CY7C1041D (7C1541SC)
4620290
610643650M2 CML-R
500
50
0
4620290
610643650M
COMP
15
0
STRESS: X-RAY
CY7C1041D (7C1541SC)
CML-R
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No. 001-85277 Rev. *A
ECN #: 4629950
Document History Page
Document Title:
Document Number:
Rev. ECN
No.
**
3840171
*A
4629950
QTP No. 063202: 44-Lead-Below TSOPII, NiPdAu, KE-G3000-6000DA MC, MSL3, 260C, CML-R
001-85277
Orig. of
Change
HLR
HSTO
Description of Change
Initial Spec Release.
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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