Document No. 001-85277 Rev. *A ECN #: 4629950 Cypress Semiconductor Package Qualification Report QTP# 063202 VERSION*A January 2015 <44-Lead TSOP II NiPdAu, MSL3, 260C Reflow CML-R FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 001-85277 Rev. *A ECN #: 4629950 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 060905 <44-Lead TSOP II (without down bonds), using Hitachi-CEL9200CYR Mold Compound, NiPdAu, MSL3, 260C Reflow assembled at CML-R May 06 063202 <44-Lead TSOP II NiPdAu, using Kyocera KE-G3000DA (for non-SRAMs), KEG6000DA (for SRAMs) Mold Compound, MSL3, 260C Reflow assembled at CML-R Oct 06 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No. 001-85277 Rev. *A ECN #: 4629950 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION ZW44 Package Designation: Package Outline, Type, or Name: Mold Compound Flammability Rating: 44-Lead Thin Small Outline. Type II Kyocera - KE G3000DA with PMC (for non-SRAMs) Kyocera - KE G6000DA (for SRAMs) UL94 – V0 Oxygen Rating Index: None Leadframe Copper Mold Compound Name/Manufacturer: Material: Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Through Die Attach Supplier: Dexter Die Attach Material: QMI509 Die Attach Method: Epoxy Bond Diagram Designation Not Applicable Wire Bond Method: Thermosonic Wire Material/Size: Au. 1.0 mil Thermal Resistance Theta JA C/W: 50.66 °C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Not Applicable Name/Location facility: of Assembly (prime) CML-R MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No. 001-85277 Rev. *A ECN #: 4629950 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Result P/F P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Pressure Cooker Test 121°C, 100%RH, 15 Psig P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C High Accelerated Saturation Test (HAST) 130°C, 3.63V, 85%RH P Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Acoustics Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH) P Dye Penetration Test to determine the existence and extent of cracks, Criteria: No Package Crack P High Temperature Storage 150°C, no bias P X-Ray MIL-STD-883-2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 Document No. 001-85277 Rev. *A ECN #: 4629950 Reliability Test Data QTP #: 060905 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C1041BV33 (7C1341C) 4436950 610511269 CML-R COMP 15 0 CY7C1041BV33 (7C1341C) 4436950 610511569 CML-R COMP 15 0 CY7C1041BV33 (7C1341C) 4435627 610514432 CML-R COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH, PRE COND 192HR 30C/60%RH, MSL3 CY7C1041BV33 (7C1341C) 4428378 610510764 CML-R 128 45 0 STRESS: HIGH TEMPERATURE STORAGE, no bias CY7C1041CV33 (7C1341R) 4428378 610514205 CML-R 500 50 0 CY7C1041CV33 (7C1341R) 4428378 610514205 CML-R 1000 50 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192HR 30C/60%RH, MSL3 CY7C1041BV33 (7C1341C) 4428378 610458652 CML-R 168 50 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192HR 30C/60%RH, MSL3 CY7C1041BV33 (7C1341C) 4436950 610511269 CML-R 300 50 0 CY7C1041BV33 (7C1341C) 4436950 610511269 CML-R 500 50 0 CY7C1041BV33 (7C1341C) 4436950 610511569 CML-R 300 50 0 CY7C1041BV33 (7C1341C) 4435627 610514432 CML-R 300 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No. 001-85277 Rev. *A ECN #: 4629950 Reliability Test Data QTP #: 063202 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C1041D (7C1541SC) 4620290 610643650M CML-R COMP 15 0 CY7C1041D (7C1541SC) 4620290 610643650M1 CML-R COMP 15 0 CY7C1041D (7C1541SC) 4620290 610643650M2 CML-R COMP 15 0 4620290 610643650M2 CML-R COMP 15 0 1000 50 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: DYE PENETRATION CY7C1041D (7C1541SC) STRESS: HIGH TEMPERATURE STORAGE, no bias CY62256LL (7A62256E) 4512383 610535998 CML-R STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192HR 30C/60%RH, MSL3 CY7C1041D (7C1541SC) 4620290 610643650M CML-R 168 50 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192HR 30C/60%RH, MSL3 CY7C1041D (7C1541SC) 4620290 610643650M CML-R 300 50 0 CY7C1041D (7C1541SC) 4620290 610643650M CML-R 500 50 0 CY7C1041D (7C1541SC) 4620290 610643650M1 CML-R 300 50 0 CY7C1041D (7C1541SC) 4620290 610643650M1 CML-R 500 48 0 CY7C1041D (7C1541SC) 4620290 610643650M2 CML-R 300 50 0 CY7C1041D (7C1541SC) 4620290 610643650M2 CML-R 500 50 0 4620290 610643650M COMP 15 0 STRESS: X-RAY CY7C1041D (7C1541SC) CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No. 001-85277 Rev. *A ECN #: 4629950 Document History Page Document Title: Document Number: Rev. ECN No. ** 3840171 *A 4629950 QTP No. 063202: 44-Lead-Below TSOPII, NiPdAu, KE-G3000-6000DA MC, MSL3, 260C, CML-R 001-85277 Orig. of Change HLR HSTO Description of Change Initial Spec Release. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7