Document No.001-89482 Rev. *A ECN # 4517626 Cypress Semiconductor Package Qualification Report QTP# 054502 VERSION*A September 2014 28/32-Lead SOJ, 20/24/28-Lead SOIC 28-Lead SNC Packages (300mils) NiPdAu, MSL3, 260C Reflow CML-R FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 6 Document No.001-89482 Rev. *A ECN # 4517626 PACKAGE QUALIFICATION HISTORY QUAL REPORT 054502 DESCRIPTION OF QUALIFICATION PURPOSE 28/32-Lead SOJ, 20/24/28 Lead SOIC and 28-Lead SNC packages with 300 mils body size using Kyocera KE-G3000DA (for non-SRAMs), KE-G6000DA (for SRAMs) Mold Compound, NiPdAu Leadframe, @ 260 Solder Reflow, MSL3, CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 6 DATE COMP. Dec 05 Document No.001-89482 Rev. *A ECN # 4517626 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: V32 Mold Compound Flammability Rating: 32-Lead Plastic Small Outline J-Bend Package (SOJ) Kyocera - KE G3000DA with PMC (for non-SRAMs) Kyocera - KE G6000DA (for SRAMs) N/A Oxygen Rating Index: >28% None Leadframe Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrinding Die Separation Method: 100% Sawing Die Attach Supplier: Dexter Die Attach Material: QMI 509 Die Attach Method: Epoxy Bond Diagram Designation 10-02612 Wire Bond Method: Thermosonic Wire Material/Size: Au. 1.0 mil Thermal Resistance Theta JA °C/W: 63.74°C/W Package Cross Section Yes/No: No Name/Location of Assembly (prime) facility: Cypress Philippines (CML-R) MSL Level 3 Reflow Profile 260C Mold Compound Name/Manufacturer: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 6 Document No.001-89482 Rev. *A ECN # 4517626 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Storage 150oC±5oC, no bias Test (Temp/Bias ) Result P/F P 121°C, 100%RH, 15 Psig Pressure Cooker Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C P Acoustic Microscopy J-STD-020 P X-Ray MIL-STD-883, Method 32012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 6 Document No.001-89482 Rev. *A ECN # 4517626 Reliability Test Data QTP #: 054502 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C188 (7C188BT) 2206290 610548061 CML-R COMP 15 0 CY7C188 (7C188BT) 2206290 610548062 CML-R COMP 15 0 CY7C188 (7C188BT) 2206290 610548063 CML-R COMP 15 0 2206290 610548061 CML-R COMP 3 0 Failure Mechanism STRESS: ACOUSTIC STRESS: FLAMMABILITY CY7C188 (7C188BT) STRESS: HIGH TEMPERATURE STORAGE, 150C, NO BIAS CY7C109 (7C109MC) 4520821 610528421 CML-R 500 45 0 CY7C109 (7C109MC) 4520821 610528421 CML-R 1000 45 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig) PRE COND 192 HR 30C/60%RH, MSL3 CY7C188 (7C188BT) 2206290 610548061 CML-R 168 50 0 STRESS: TC COND. C –65C TO 150C PRE COND 192 HR 30C/60%RH, MSL3 CY7C188 (7C188BT) 2206290 610548061 CML-R 300 50 0 CY7C188 (7C188BT) 2206290 610548062 CML-R 300 50 0 CY7C188 (7C188BT) 2206290 610548063 CML-R 300 50 0 CY7C188 (7C188BT) 2206290 610548061 CML-R COMP 15 0 CY7C188 (7C188BT) 2206290 610548062 CML-R COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 6 Document No.001-89482 Rev. *A ECN # 4517626 Document History Page Document Title: QTP# 054502: 28/32-Lead SOJ, 20/24/28-Lead SOIC 28-Lead SNC Packages (300mils) NiPdAu, MSL3, 260C Reflow CML-R Document Number: 001-89482 Rev. ECN Orig. of No. Change ** 4142872 HSTO *A 4517626 HSTO Description of Change Initial Spec Release Initiate report as per memo LGQ-654. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 6