Document No.001-89620 Rev. *A ECN # 4544959 Cypress Semiconductor Package Qualification Report QTP# 093102 VERSION*A October 2014 8L DFN (5X6X0.8mm) NiPdAu, MSL3, 260°C Reflow Amkor-Phil (Phil-MB) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-89620 Rev. *A ECN # 4544959 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number 093102 Description of Qualification Purpose To qualify 8L-DFN(5X6X0.8mm) NiPdAu using Nitto 7470LA Mold compound, MSL3, 260C Reflow at Amkor Phil (Phil-MB) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Feb 10 Document No.001-89620 Rev. *A ECN # 4544959 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION LH08 Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: 8 – Dual Flat No Lead (DFN) 7470-LA Nitto V-0 Mold Compound Alpha Emission Rate: <0.001 counts/cm2 Oxygen Rating Index: NA Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: AMK-06 Die Attach Method: Epoxy Bond Diagram Designation: 001-51523 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 16.83 Package Cross Section Yes/No: N/A Assembly Process Flow: 001-52216 Name/Location of Assembly (prime) facility: Amkor-Phil (Phil-MB) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-89620 Rev. *A ECN # 4544959 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Temperature Cycle Test Condition (Temp/Bias) Result P/F P High Temp Storage MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C 130°C, 5.5V Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C 121°C, 100%, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C 150C, no bias Acoustics Microscopy MSL 3 J-STD-020 P Ball Shear JESD22-B116A P Bond Pull MIL-STD-883 – Method 2011 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P High Accelerated Saturation Test Pressure Cooker Test MIL-STD-883, Method 2019 Per die size: Die Shear • • • Dye Penetration test P P P P <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Criteria: No Package Crack P Final Visual MIL-PRF-38535, MIL-STD-883, METHOD 2009, P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability, Steam Aged Thermal Shock X-Ray J-STD-002, JESD22-B102 95% solder coverage minimum 125C, -55C MIL-STD-883C, Method 1011 MIL-STD-883 – 2012, Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P P P Document No.001-89620 Rev. *A ECN # 4544959 Reliability Test Data QTP #: 093102 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 10 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 10 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 2 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 2 0 4908403 N/A PHIL-MB COMP 5 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 5 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY14B101Q2 (7C1401B5CC) STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 128 79 0 STRESS: HIGH TEMP STORAGE, 150C no bias CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 500 80 0 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 1000 80 0 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 1500 80 0 4908403 N/A PHIL-MB COMP 5 0 STRESS: INTERNAL VISUAL CY14B101Q2 (7C1401B5CC) STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 168 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-89620 Rev. *A ECN # 4544959 Reliability Test Data QTP #: 093102 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB COMP 3 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 3 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 500 80 0 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 1000 80 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB 500 79 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB 1000 79 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB 500 77 0 CY14B101Q2 (7C1401B5CC) 4908403 610923657 PHIL-MB 1000 77 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 200 80 0 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB 1000 80 0 CY14B101Q2 (7C1401B5CC) 4908403 N/A PHIL-MB COMP 15 0 CY14B101Q2 (7C1401B5CC) 4908403 610923656 PHIL-MB COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-89620 Rev. *A ECN # 4544959 Document History Page Document Title: QTP# 093102: 8L DFN (5X6X0.8mm) NiPdAu MSL3, 260C Reflow Amkor-Phil (Phil-MB) Document Number: 001-89620 Rev. ECN No. ** 4150806 *A 4544959 Orig. of Change HSTO HSTO Description of Change Initial Spec Release Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7