QTP 093102 8L DFN (5X6X0.8mm) NiPdAu, MSL3, 260C Reflow Amkor-Phil (Phil-MB).pdf

Document No.001-89620 Rev. *A
ECN # 4544959
Cypress Semiconductor
Package Qualification Report
QTP# 093102 VERSION*A
October 2014
8L DFN (5X6X0.8mm) NiPdAu,
MSL3, 260°C Reflow
Amkor-Phil (Phil-MB)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-89620 Rev. *A
ECN # 4544959
PACKAGE/PRODUCT QUALIFICATION HISTORY
QTP
Number
093102
Description of Qualification Purpose
To qualify 8L-DFN(5X6X0.8mm) NiPdAu using Nitto 7470LA Mold
compound, MSL3, 260C Reflow at Amkor Phil (Phil-MB)
Company Confidential
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Page 2 of 7
Date
Feb 10
Document No.001-89620 Rev. *A
ECN # 4544959
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
LH08
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
8 – Dual Flat No Lead (DFN)
7470-LA Nitto
V-0
Mold Compound Alpha Emission Rate:
<0.001 counts/cm2
Oxygen Rating Index:
NA
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAu-Ag
Die Backside Preparation
Method/Metallization:
Backgrind
Die Separation Method:
Saw
Die Attach Supplier:
Henkel
Die Attach Material:
AMK-06
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-51523
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au, 0.8mil
Thermal Resistance Theta JA °C/W:
16.83
Package Cross Section Yes/No:
N/A
Assembly Process Flow:
001-52216
Name/Location of Assembly (prime) facility:
Amkor-Phil (Phil-MB)
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability
Company Confidential
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Page 3 of 7
Document No.001-89620 Rev. *A
ECN # 4544959
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Temperature Cycle
Test Condition (Temp/Bias)
Result
P/F
P
High Temp Storage
MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity MSL 3
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C
130°C, 5.5V
Precondition: JESD22 Moisture Sensitivity MSL 3
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C
121°C, 100%, 15 Psig
Precondition: JESD22 Moisture Sensitivity MSL 3
192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+5, -0°C
150C, no bias
Acoustics Microscopy MSL 3
J-STD-020
P
Ball Shear
JESD22-B116A
P
Bond Pull
MIL-STD-883 – Method 2011
P
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress
package
P
High Accelerated Saturation Test
Pressure Cooker Test
MIL-STD-883, Method 2019
Per die size:
Die Shear
•
•
•
Dye Penetration test
P
P
P
P
<3000 sq. mils = 1.2 kgf
30001-5000 sq. mils = 1.2 kgf
>5001 sq. mils = 1.2 kgf
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
P
Final Visual
MIL-PRF-38535, MIL-STD-883, METHOD 2009,
P
Internal Visual
MIL-STD-883-2014
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Solderability, Steam Aged
Thermal Shock
X-Ray
J-STD-002, JESD22-B102
95% solder coverage minimum
125C, -55C
MIL-STD-883C, Method 1011
MIL-STD-883 – 2012,
Company Confidential
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Page 4 of 7
P
P
P
Document No.001-89620 Rev. *A
ECN # 4544959
Reliability Test Data
QTP #: 093102
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp
Rej
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
10
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
10
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
2
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
2
0
4908403
N/A
PHIL-MB
COMP
5
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
5
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
5
0
Failure Mechanism
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY14B101Q2 (7C1401B5CC)
STRESS: DIE SHEAR
STRESS: DYE PENETRANT TEST
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
15
0
STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
128
79
0
STRESS: HIGH TEMP STORAGE, 150C no bias
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
500
80
0
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
1000
80
0
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
1500
80
0
4908403
N/A
PHIL-MB
COMP
5
0
STRESS: INTERNAL VISUAL
CY14B101Q2 (7C1401B5CC)
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
168
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-89620 Rev. *A
ECN # 4544959
Reliability Test Data
QTP #: 093102
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp Rej Failure Mechanism
STRESS: PHYSICAL DIMENSION
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
COMP
3
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
3
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
COMP
3
0
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH, MSL3
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
500
80
0
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
1000
80
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
500
79
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
1000
79
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
500
77
0
CY14B101Q2 (7C1401B5CC)
4908403
610923657
PHIL-MB
1000
77
0
STRESS: THERMAL SHOCK COND. B – 55C TO 125C
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
200
80
0
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
1000
80
0
CY14B101Q2 (7C1401B5CC)
4908403
N/A
PHIL-MB
COMP
15
0
CY14B101Q2 (7C1401B5CC)
4908403
610923656
PHIL-MB
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-89620 Rev. *A
ECN # 4544959
Document History Page
Document Title: QTP# 093102: 8L DFN (5X6X0.8mm) NiPdAu MSL3, 260C Reflow Amkor-Phil (Phil-MB)
Document Number: 001-89620
Rev. ECN
No.
**
4150806
*A
4544959
Orig. of
Change
HSTO
HSTO
Description of Change
Initial Spec Release
Align qualification report based on the new template in the front page
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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