Document No.001-88990 Rev. *C ECN # 5143976 Cypress Semiconductor Package Qualification Report QTP# 133307 VERSION*C February 2016 TQFP (14x14x1.4mm) NiPdAu, CuPd Wire MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-88990 Rev. *C ECN # 5143976 PACKAGE QUALIFICATION HISTORY QTP Number 133307 Description of Qualification Purpose Qualification of TQFP 100L 14x14x1.4mm assembled in CML Autoline using 0.8mil CuPd wire, KEG-6000DA mold comp, QMI509 die attach epoxy with NiPdAu lead finish. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date Aug 2013 Document No.001-88990 Rev. *C ECN # 5143976 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: TQFP 100L Package Outline, Type, or Name: AZ0AB (14x14x1.4mm) Mold Compound Name/Manufacturer: KEG6000DA / Kyocera Mold Compound Flammability Rating: UL 94 V=0 pass Mold Compound Alpha Emission Rate: 0.002 cph/m2 Oxygen Rating Index: >28% 54% (typical) Lead Frame Designation: RMP Lead Frame Material: Copper Substrate Material: n/a Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Dexter Die Attach Material: QMI509 Bond Diagram Designation 001-75839 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 34.64 C/W Package Cross Section Yes/No: n/a Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML (R) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-88990 Rev. *C ECN # 5143976 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P X-Ray Criteria: Meet external and internal characteristics of package JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow MIL-STD-883 - 2012 Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Internal Visual MIL-STD-883-2014 P High Temp Storage JESD22-A103: 150 C, no bias P Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22-A106B MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis High Accelerated Saturation Test (HAST) Thermal Shock Bond Pull Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P P P P P P Document No.001-88990 Rev. *C ECN # 5143976 Reliability Test Data QTP #: 133307 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 30 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 30 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 30 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 30 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 30 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 30 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 5 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 5 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 5 0 STRESS: DYE PENETRANT TEST CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA 128 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA 128 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 128 80 0 STRESS: HIGH TEMPERATURE STORAGE CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 500 80 0 CY8C4245AXI (8CP44200AC) AZ44A 4315616 611325459 CML-RA 500 79 0 CY8C4245AXI (8CP44200AC) AZ44A 4315616 611325458 CML-RA 500 80 0 CY8C4245AXI (8CP44200AC) AZ44A 4315616 611325457 CML-RA 500 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-88990 Rev. *C ECN # 5143976 Reliability Test Data QTP #: 133307 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: INTERNAL VISUAL CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 5 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 5 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 5 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA 168 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA 288 79 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA 168 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA 288 79 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 168 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 288 80 0 STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA 500 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA 1000 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA 500 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA 1000 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 500 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 1000 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA 200 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 200 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA 530 80 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314905 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314906 CML-RA COMP 15 0 CY8C5868AXI (8C561001AC) AZ100 4304019 611314907 CML-RA COMP 15 0 STRESS: THERMAL SHOCK STRESS: XRAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-88990 Rev. *C ECN # 5143976 Document History Page Document Title:QTP#133307:TQFP (14x14x1.4mm) NiPdAu, CuPd Wire MSL3, 260C Reflow CML-RA Document Number: 001-88990 Rev. ECN No. ** 4109488 *A 4122585 *B 4495798 *C 5143976 Orig. of Change HSTO HSTO HSTO HSTO Description of Change DCON Removed Distribution: WEB and Posting: None in the document history page. Initial spec release Update Package Qualification History table in page 2 Align qualification report based on the new template in the front page Update contact for Reliability Director Corrected mold compound material Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7