QTP # 065201 :FX2LP18 DEVICE FAMILY (CY7C68053) C8Q-3R TECHNOLOGY, FAB 5

Document No.001-88009 Rev. *A
ECN # 4417916
Cypress Semiconductor
Product Qualification Report
QTP# 065201 VERSION *A
June 2014
FX2LP18 DEVICE FAMILY
C8Q-3R TECHNOLOGY, FAB 5
CY7C68053
MoBL-USB™ FX2LP18
USB Micro controller
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Lorena R. Zapanta (ILZ)
Reliability Engineer
Reviewed By:
Zhaomin Ji (ZIJ)
Reliability Manager
Approved By:
Richard Oshiro(RGO)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 10
1
Document No.001-88009 Rev. *A
ECN # 4417916
PRODUCT QUALIFICATION HISTORY
QUAL
REPORT
065201
DESCRIPTION OF QUALIFICATION PURPOSE
Qualify FX2LP18 Device Family on C8Q-3R Technology at GSMC Foundry (Fab 5)
DATE
COMP.
Sep 07
Cypress products are manufactured using qualified processes. The technology qualification for this product is referenced above
and must be considered to get a complete and thorough evaluation of the reliability of the product.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 10
2
Document No.001-88009 Rev. *A
ECN # 4417916
PRODUCT DESCRIPTION (for qualification)
Qualification Purpose:
Qualify FX2LP18 Device Family on C8Q-3R Technology at GSMC Foundry (Fab 5)
Marketing Part #:
CY7C68053-56BAXC
Device Description:
FX2LP18
USB 2.0 MoBL
Cypress Semiconductor Corporation – Consumer and Computation Division
TM
Cypress Division:
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number of Metal Layers:
4
Metal Composition:
Metal 1:
Metal 2:
Metal 3:
Metal 4:
400Å TiN / 2,900Å Al 0.5% Cu / 600Å TiN
550Å TiN / 3,600Å Al 0.5% Cu / 600Å TiN
550Å TiN / 3,600Å Al 0.5% Cu / 600Å TiN
500Å TiN / 6,500Å Al 0.5% Cu / 250 Å TiN
Passivation Type and Materials:
1000Å TeOs / 9000Å Si3N4
Generic Process Technology/Design Rule (µ-drawn):
0.13µ
Gate Oxide Material/Thickness (MOS):
32A-STD 55A HV
Name/Location of Die Fab (prime) Facility:
GSMC China
Die Fab Line ID/Wafer Process ID:
C8Q-3R, Fab 5
PACKAGE AVAILABILITY
ASSEMBLY FACILITY SITE
PACKAGE
56-Ball VFBGA
CML-RA, Taiwan-G
56-Pin SSOP
CML-RA, Taiwan-T, China-JT
Note: Package Qualification details available upon request.
3
Company Confidential
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Page 3 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
BZ56
56-Ball Very Fine Ball Grid Array (VFBGA)
KE-G2270/ Kyocera
UL-94 V-0
Oxygen Rating Index:
N/A
Substrate Material:
BT Resin
Lead Finish, Composition / Thickness:
N/A
Die Backside Preparation
Method/Metallization:
Die Separation Method:
Grinding
Die Attach Supplier:
Ablestik
Die Attach Material:
2025D
Die Attach Method:
Epoxy
Bond Diagram Designation:
001-10741
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au/1.0mil
Thermal Resistance Theta JA °C/W:
45 °C/W, 19 °C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
001-06964
Name/Location of Assembly (prime) facility:
Taiwan-G
MSL Level
3
Reflow Profile
260C
Sawing
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA,KYEC, Taiwan
4
Company Confidential
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Page 4 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
SP56
56- Shrunk Small Outline Package (SSOP)
MP8500/Nitto
UL-94 V-0
Oxygen Rating Index:
N/A
Lead Frame Material:
Copper
Lead Finish, Composition / Thickness:
NiPdAu
Die Backside Preparation
Method/Metallization:
Die Separation Method:
Backgrind
Die Attach Supplier:
Dexter Hysol
Die Attach Material:
QMI509
Die Attach Method:
Dispensing
Wire Bond Method:
Thermosonic
Wire Material/Size:
Au/1.0mil
Thermal Resistance Theta JA °C/W:
58°C/W, 27°C/W
Package Cross Section Yes/No:
No
Name/Location of Assembly (prime) facility:
CML-R
MSL Level
3
Reflow Profile
260C
100% Saw
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA, KYEC,Taiwan
Note: Please contact a Cypress Representative for other packages availability.
5
Company Confidential
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Page 5 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Te
st
Electrostatic Discharge
Human Body Model
Test
Condition
(Temp/Bias
2200V
JESD22, Method A114-E
Electrostatic Discharge
Charge Device Model
Result
P/F
P
P
High Accelerated Saturation Test
(HAST)
130°C, 3.65V, 85%RH
High Temperature Operating Life
Dynamic Operating Condition, Vcc=3.8V, 150°C
P
Dynamic Operating Condition, Vcc=3.8V, 150°C
P
High Temperature Steady State life
Static Operating Condition, Vcc= 3.63V, 150°C
P
High Temperature Storage
P
Low Temperature Operating Life
150C, No bias
Dynamic Operating Condition, Vcc=4.3V, -30°C
Pressure Cooker
121°C, 100%RH, 15 Psig
P
P
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C
Early Failure Rate
High Temperature Operating Life
Latent Failure Rate
P
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C
Static Latchup
125C, ± 200mA,
In accordance with JESD78
P
Temperature Cycle
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C
P
Acoustic Microscopy
J-STD-020
P
6
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Page 6 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal3
A.F
Failure
Rate
High Temperature Operating Life
Early Failure Rate1
1,026 Devices
0
N/A
N/A
0 PPM
High Temperature Operating Life1,2
Long Term Failure Rate
272,000 DHRs
0
0 .7
170
20 FIT
1
2
3
Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C.
Chi-squared 60% estimations used to calculate the failure rate.
Thermal Acceleration Factor is calculated from the Arrhenius equation
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
where:
EA =The Activation Energy of the defect mechanism.
k = Boltzmann's constant = 8.62x10-5 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of
the device at use conditions.
7
Company Confidential
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Page 7 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
Reliability Test Data
QTP #:
Fab Lot #
065201
Assy Lot #
Assy Loc Duration
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
CY7C68053 (7C680510BK) 4720785
610729797
CY7C68053 (7C680510BK)
610739937
Device
STRESS:
STRESS:
Samp
Rej
COMP
15
0
TAIWN-G
COMP
15
0
TAIWN-G
COMP
15
0
ACOUSTIC-MSL3
4727325
ESD-CHARGE DEVICE MODEL (500V)
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
9
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
9
0
STRESS:
ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
8
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
8
0
STRESS:
HIGH TEMP STEADY STATE LIFE TEST (150C, 3.63V)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
80
80
0
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
168
80
0
STRESS:
HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V, Vcc Max)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
48
338
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
48
348
0
CY7C68053 (7C680510BK) 4727325
610739215
CML-R
48
340
0
STRESS:
Failure Mechanism
HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V, Vcc Max)
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
80
182
0
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
500
182
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
80
182
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
500
182
0
CY7C68053 (7C680510BK) 4727325
610739215
CML-R
80
180
0
CY7C68053 (7C680510BK) 4727325
610739215
CML-R
500
180
0
8
Company Confidential
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Page 8 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
Reliability Test Data
QTP #: 065201
Device
STRESS:
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
Rej
HI-ACCEL SATURATION TEST (130C, 85%RH, 3.65V), PRE COND 192 HR, 30C/60%RH, MSL3
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
128
50
0
CY7C68053 (7C680510BK) 4720785
610731288
CML-R
128
45
0
500
45
0
STRESS:
LOW TEMPERATURE OPERATING LIFE (-30C, 4.3V)
CY7C68053 (7C680510BK) 9714792
STRESS:
Failure Mechanism
610721250
CML-R
STATIC LATCH-UP TESTING (125C, ±200mA)
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
COMP
3
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
COMP
6
0
STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
500
50
0
CY7C68053 (7C680510BK) 9714792
610721250
CML-R
1000
50
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
168
48
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
168
50
0
STRESS:
TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
300
50
0
CY7C68053 (7C680510BK) 9714792
610721014
TAIWN-G
1000
50
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
500
50
0
CY7C68053 (7C680510BK) 4720785
610729797
TAIWN-G
1000
50
0
CY7C68053 (7C680510BK) 4727325
610739937
TAIWN-G
300
50
0
9
Company Confidential
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Page 9 of 10
Document No.001-88009 Rev. *A
ECN # 4417916
Document History Page
Document Title:
Document Number:
QTP # 065201 : FX2LP18 DEVICE FAMILY (CY7C68053) C8Q-3R TECHNOLOGY, FAB 5
001-88009
Rev. ECN
Orig. of
No.
Change
**
4033621 ILZ
*A
4417916 ILZ
Description of Change
Initial Spec Release
Qualification report published on Cypress.com is documented on
memo HGA-246 is not in spec format.
Initiated spec for QTP 065201 and all data from Memo HGA-246 was
transferred to qualification report spec template.
Deleted package qualification details on package qualification history
table.
Deleted Cypress reference Spec and replaced with Industry Standards
Updated package availability based on current qualified test &
assembly site.
Sunset Spec Review
Updated front page to reflect new qualification report template per
Spec 001-57716
Distribution: WEB
Posting:
None
10
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Page 10 of 10
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