Document No.001-88443 Rev. *A ECN # 4462875 Cypress Semiconductor Package Qualification Report QTP# 083907 VERSION *A August 2014 32L QFN (5x5x1) Saw Type NiPdAu-Ag, MSL3, 260°C Reflow Amkor-Philippines (P3) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-88443 Rev. *A ECN # 4462875 PACKAGE QUALIFICATION HISTORY QUAL REPORT 083907 DESCRIPTION OF QUALIFICATION PURPOSE Qualify 32L Saw Type QFN 5x5x1mm Pb-Free Package Using Nitto Nitto 7470-LA Mold Compound, AMK-06 Epoxy, NiPdAu-Ag plating at MSL3/260°C Solder Reflow at Amkor- Philippines (P3) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 DATE COMP. Nov 08 Document No.001-88443 Rev. *A ECN # 4462875 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LT32B 32 Quad Flat No Lead (QFN) Nitto 7470-LA Mold Compound Flammability Rating: V-0 UL-94 Oxygen Rating Index: N/A Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Die Attach Supplier: Henkel Die Attach Material: AMK-06 Die Attach Method: Epoxy Bond Diagram Designation: 001-51969 Wire Bond Method: Thermosonic Wire Material/Size: Au/ 0.8 mil Thermal Resistance Theta JA °C/W : 22°C /W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-20659 Name/Location of Assembly (prime) facility: Amkor-Philippines (P3) MSL Level: 3 Reflow Profile: 260C Saw ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, KYEC, ASE-G Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No.001-88443 Rev. *A ECN # 4462875 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Test Condition (Temp/Bias) Stress/Test Acoustic Microscopy Test High Accelerated Saturation Test (HAST) Pressure Cooker Test J-STD-020 P 130°C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity Level 3 P 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 Temperature Cycle Result P/F P P 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V MIL-STD-883, Method 3015.7 Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/1000V/1250V P P JESD22-C101 Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack P X-Ray MIL-STD-883-2012 P Ball Shear JESD22-B116A P Bond Pull MIL-STD-883 – Method 2011, P Die Shear MIL-STD-883, Method 2019 P Final Visual Inspection JESD22-B101B P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Solderability J-STD-002, JESD22-B102 P Thermal Shock MIL-STD-883C, Method 1011 P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 Document No.001-88443 Rev. *A ECN # 4462875 Reliability Test Data QTP #: 083907 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ACOUSTIC, MSL3 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 15 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES COMP 15 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES COMP 15 0 5821006 610841287 M-PHILIPPINES COMP 10 0 5821006 610841287 M-PHILIPPINES COMP 10 0 5821006 610841287 M-PHILIPPINES COMP 5 0 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 15 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES COMP 15 0 STRESS: BALL SHEAR CY8C21434 (8C214345AK) STRESS: BOND PULL CY8C21434 (8C214345AK) STRESS: CONSTRUCTIONAL ANALYSIS CY8C21434 (8C214345AK) STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 15 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES COMP 15 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES COMP 15 0 M-PHILIPPINES COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C21434 (8C214345AK) STRESS: 5821006 610841287 ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 8 0 610841287 M-PHILIPPINES COMP 2009 0 STRESS: FINAL VISUAL INSPECTION CY8C21434 (8C214345AK) STRESS: 5821006 HI-ACCEL SATURATION TEST, (130C, 5.25), 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES 128 77 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES 128 77 0 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 5 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES COMP 5 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES COMP 5 0 STRESS: INTERNAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-88443 Rev. *A ECN # 4462875 Reliability Test Data QTP #: 083907 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanis STRESS: PHYSICAL DIMENSIONS CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 30 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES COMP 30 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES COMP 30 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES 168 80 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES 168 80 0 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES COMP 3 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES COMP 3 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES 500 80 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES 500 80 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES 500 80 0 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES 200 80 0 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES 1000 80 0 CY8C21434 (8C214345AK) 5821006 610841287 M-PHILIPPINES 500 10 0 CY8C21434 (8C214345AK) 5821006 610841288 M-PHILIPPINES 500 10 0 CY8C21434 (8C214345AK) 5821006 610841289 M-PHILIPPINES 500 10 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-88443 Rev. *A ECN # 4462875 Document History Page Document Title: QTP#083907: 32L QFN (5x5x1) Saw Type NiPdAu-Ag, MSL3, 260C Reflow Amkor-Philippines (P3) Document Number: 001-88443 Rev. ECN Orig. of No. Change ** 4064100 HSTO *A 4462875 HSTO Description of Change Initial Spec Release Qualification report published on Cypress.com is documented on memo HGA-1028 and was transferred to qualification report spec template. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7