Document No. 001-95767 Rev. *A ECN #: 4804514 Cypress Semiconductor Product Qualification Report QTP# 142501 VERSION*A June, 2015 130nm F-RAM Device Family 130nm Technology, TI Fab FM22L16-55-TG 4-Mbit (256 K × 16) Parallel F-RAM Memory FM22LD16-55-BG 4-Mbit (256 K × 16) Parallel F-RAM Memory FM22L16-55-TGTR 4-Mbit (256 K × 16) Parallel F-RAM Memory FM22LD16-55-BGTR 4-Mbit (256 K × 16) Parallel F-RAM Memory FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Zhaomin Ji (ZIJ) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 143801 Qualification of Additional Passivation Layers on F-RAM Products Nov 2014 142501 Qualification of Additional PO2 Passivation Layer on FM22L16 (Largest F-RAM Die) at TI DM5 Dallas Fab Dec 2014 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify Additional PO2 Passivation Layer on FM22L16 (Largest F-RAM Die) at TI DM5 Dallas Fab Marketing Part #: FM22L16-55-TG, FM22LD16-55-BG, FM22L16-55-TGTR, FM22LD16-55-BGTR Device Description: F-RAM Cypress Division: Cypress Semiconductor Corporation – Memory Product Division (MPD) TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: Proprietary* Metal Composition: Proprietary* Proprietary* Passivation Type and Thickness: Generic Process Technology/Design Rule (-drawn): CMOS / 130nm Gate Oxide Material/Thickness (MOS): Proprietary* Name/Location of Die Fab (prime) Facility: Texas Instruments / Dallas Die Fab Line ID/Wafer Process ID: DMOS 5 / E035.1 *Texas Instruments’ proprietary information is available with signed NDA. ALTERNATIVE PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE 44L TSOP II ASEK-Taiwan (G) 48 FBGA ASEK-Taiwan (G) Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: ZW44B 44L TSOP II G631H / Sumitomo Mold Compound Flammability Rating: V-0 Mold Compound Alpha Emission Rate: <0.1 Oxygen Rating Index: >28% 53% Lead Frame Designation: FMP Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: Matte Sn Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Sumitomo Die Attach Material: CRM1076WA Bond Diagram Designation 001-85443 Wire Bond Method: Thermosonic Wire Material/Size: Au / 0.8 mil Thermal Resistance Theta JA C/W: 107 C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: ASEK-Taiwan (G) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: KYEC-Taiwan Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) 200°C, 4HRS Acoustic Microscopy Aged Bond Strength MIL-STD-883, Method 883-2011 Result P/F P P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Criteria: Meet external and internal characteristics of Constructional Analysis Cypress package 125°C, 1000 Hours Data Retention JESD22-A117 and JESD22-A103 High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130°C, 85%RH, 3.6V, Precondition: JESD22 Moisture Sensitivity Level P P P (192 Hrs., 30C, 60% RH, 260C Reflow) High Temperature Operating Life Dynamic Operating Condition, 125°C, 3.6V, 96 Hours Early Failure Rate (EFR) JESD22-A-108 High Temperature Operating Life Dynamic Operating Condition, 125°C, 3.6V, 168,1000 Hours Latent Failure Rate (LFR) JESD22-A-108 Pressure Cooker JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level P P P (192 Hrs., 30C, 60% RH, 260C Reflow) Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65 °C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 13 P Document No. 001-95767 Rev. *A ECN #: 4804514 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 1,499 Devices 0 N/A N/A 0 PPM (1) 1,009,000 DHRs 0 0.7 170 16 FIT (2) Long Term Failure Rate 1 2 3 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. (1) (2) Early Failure Rate was computed from QTP#142501 Long Term Failure Rate was computed from QTP#143801 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, M SL3 CY15B102Q-SXE 4351641 611410018 UTAC COMP 22 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 15 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 15 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP 15 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 15 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP 15 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 15 0 CY15B102Q-SXE 4351641 611410018 UTAC COMP 30 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP 5 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 5 0 CY15B102Q-SXE 4351641 611410018 UTAC COMP 30 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP 5 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 5 0 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: AGED BOND PULL (200C, 4 Hours) CY15B102Q-SXE 4351641 611410018 UTAC COMP 5 CY15B102Q-SXE 4351641 611410018 UTAC COMP EQUIVALENT FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP EQUIVALENT FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP EQUIVALENT FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN COMP EQUIVALENT FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP EQUIVALENT STRESS: CLASS YIELD Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: CONSTRUCTIONAL ANALYSIS FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP 5 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP 5 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329042 611340083 UTAC COMP 5 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP 5 0 STRESS: DATA RETENTION, 125C CY15B102Q-SXE 4351641 611410018 UTAC 500 77 0 CY15B102Q-SXE 4351641 611410018 UTAC 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 75 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 500 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 500 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.6V), PRE COND 128 HR 30C/60%RH (M SL3) CY15B102Q-SXE 4351641 611410018 UTAC 96 77 0 CY15B102Q-SXE 4351641 611410018 UTAC 128 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 128 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 256 72 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 256 72 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 128 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 256 73 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 256 73 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 128 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 256 72 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 256 72 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 128 63 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 128 63 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 128 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 128 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 128 66 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 128 66 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEM P DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.6V, Vcc M ax) CY15B102Q-SXE 4351641 611410018 UTAC 96 500 0 CY15B102Q-SXE 4351641 611410018 UTAC 96 1200 0 CY15B102Q-SXE 4351641 611410018 UTAC 96 1800 0 CY15B102Q-SXE 4351641 611410018 UTAC 96 100 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 96 800 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 96 792 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 96 799 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 96 799 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 96 800 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 96 799 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 96 800 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 96 800 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 96 800 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 96 800 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 96 798 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 96 798 0 STRESS: HIGH TEM P DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.6V, Vcc M ax) FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 168 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 168 57 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 168 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEM P DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.6V, Vcc M ax) FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH, 15 Psig), PRE COND 192 HR 30C/60%RH (M SL3) CY15B102Q-SXE 4351641 611410018 UTAC 96 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 288 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 288 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 168 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 288 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 168 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 288 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 168 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 288 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 168 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 288 77 0 CY15B102Q-SXE 4351641 611410018 UTAC COMP EQUIVALENT FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN COMP EQUIVALENT FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN COMP EQUIVALENT FM25V02-G (FM25V02A) 2327007 611339585 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329042 611339583 UTAC COMP EQUIVALENT FM25V02-G (FM25V02A) 2329041 611339581 UTAC COMP EQUIVALENT STRESS: SORT YIELD STRESS: TEM PERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (M SL3 CY15B102Q-SXE 4351641 611410018 UTAC 500 77 0 CY15B102Q-SXE 4351641 611410018 UTAC 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2327007 611340032 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329042 611340033 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 500 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V01-G (FM25V01A) 2329041 611340037 LINGSEN 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 500 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2327007 611339585 UTAC 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Reliability Test Data QTP #: 143801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TEM PERATURE CYCLE (COND. C, -65C TO 150C), PRE COND 192 HR 30C/60%RH (M SL3 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 500 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329042 611339583 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 500 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 FM25V02-G (FM25V02A) 2329041 611339581 UTAC 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Ass Loc 142501 Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, M SL3 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an COMP 15 0 2443003 611440903 G-Taiw an COMP 5 0 2443003 611440903 G-Taiw an COMP 10 0 2443003 611440903 G-Taiw an COMP 12 0 STRESS: AGED BOND STRENGTH FM22L16 (FP22L16A) STRESS: BALL SHEAR FM22L16 (FP22L16A) STRESS: BOND PULL FM22L16 (FP22L16A) STRESS: DATA RETENTION, 125C FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 500 80 0 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 1000 80 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 3.6V, PRE COND 192 HR 30C/60%RH, M SL3 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 96 77 0 1499 0 STRESS: HIGH TEM P DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 3.6V FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 96 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, M SL3 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 168 80 0 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 288 80 0 STRESS: TEM PERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, M SL3 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 500 80 0 FM22L16 (FP22L16A) 2443003 611440903 G-Taiw an 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 13 Document No. 001-95767 Rev. *A ECN #: 4804514 Document History Page Document Title: Document Number: QTP#142501: 130NM F-RAM DEVICE FAMILY, 130NM TECHNOLOGY, TI FAB 001-95767 Rev. ECN No. ** *A 4602939 4804514 Orig. of Change JYF BECK Description of Change Initial spec release. Indicated “Proprietary” Items on the “TECHNOLOGY/FAB PROCESS DESCRIPTION” Table, Page 3, and removed proprietary items from Page 2 (Qualification History). Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 13