Document No.001-88011 Rev. *B ECN # 4419050 Cypress Semiconductor Product Qualification Report QTP# 072404 VERSION*B June, 2014 WEST BRIDGE ANTIOCH C8Q-3RL TECHNOLOGY, FAB 5 CYWB0113AB CYWB0124AB CYWB0120AB West Bridge ™ : Antioch ™ USB/Mass Storage Peripheral Controller FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 14 Document No.001-88011 Rev. *B ECN # 4419050 PRODUCT QUALIFICATION HISTORY Qual Report Description of Qualification Purpose Date Comp 065201 Qualify FX2LP18 Device Family on C8Q-3R Technology at GSMC Foundry (Fab 5) Sep 07 072404 Qualify DCD West Bridge Antioch (7C07100A) on C8Q-3RL Technology at Fab 5 Jan 08 080604 Rule Based OPC P1M Mask change on Antioch Device 7C07100B using C8Q-3R Technology May 08 at Fab 5 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 14 Document No.001-88011 Rev. *B ECN # 4419050 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify DCD West Bridge Antioch (7C07100A) on C8Q-3RL Technology at Fab 5 Marketing Part #: CYWB0124AB, CYWB0113AB Device Description: Handset Peripheral Controller Cypress Division: Cypress Semiconductor Corporation – Data Communication Division (DCD) Number of Metal Layers: TECHNOLOGY/FAB PROCESS DESCRIPTION Metal 1: 400° TiN, 2900° Al, 4 Metal Composition: Metal 2: 550° TiN, 3600° Al, Metal 3: 550° TiN, 3600° Al, Metal 4: 500° TiN, 6500° Al, Passivation Type and Materials: 1000A TeOs / 7,000A Si3N4 Generic Process Technology/Design Rule (µ- CMOS, 0.13 µm Gate Oxide Material/Thickness (MOS): 32A-STD 55A HV Name/Location of Die Fab (prime) Facility: GSMC China Die Fab Line ID/Wafer Process ID: C8Q-3R, Fab5 600° TiN 600° TiN 600° TiN 250° TiN PACKAGE AVAILABILITY PACKAGE 100-Ball BGA ASSEMBLY SITE FACILITY CML-RA, TAIWAN(G) Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 14 Document No.001-88011 Rev. *B ECN # 4419050 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: BZ100 100-Ball VFBGA KE-2270 V-O per UL94 N/A Oxygen Rating Index: N/A Substrate Material CCL-HL832NX Lead Finish, Composition / Thickness: SnAgCu/0.3mm Die Backside Preparation Method / Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Hysol Die Attach Material: 2025D Die Attach Method: Epoxy Bond Diagram Designation: 001-07669 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 44.21°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 11-21101 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Fault Coverage: CML-RA, KYEC, Taiwan 100% Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 14 Document No.001-88011 Rev. *B ECN # 4419050 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Temperature Steady State life Low Temperature Operating Life High Temperature Storage High Accelerated Saturation Test (HAST) Temperature Cycle Pressure Cooker Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc Max=3.8V, 125°C Dynamic Operating Condition, Vcc Max=3.8V, 150°C JESD22-A108 Dynamic Operating Condition, Vcc Max=3.8V, 125°C Dynamic Operating Condition, Vcc Max=3.8V, 150°C JESD22-A108 Static Operating Condition, Vcc Max=3.63V, 150°C JESD22-A108 Dynamic Operating Condition, Vcc=4.3V, -30C JESD22-A108 JESD22-A103:150 C, no bias JEDEC STD 22-A110: 130°C, 1.8V/3.63V, 85%RH Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) JESD22-A102, 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) Result P/F P P P P P P P P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JEDEC EIA/JESD22-A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) Static Latch-up 125C, ± 200mA , In accordance with JESD78 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 14 P P Document No.001-88011 Rev. *B ECN # 4419050 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: BZ100 100-Ball VFBGA KE-2270 V-O per UL94 N/A Oxygen Rating Index: N/A Substrate Material CCL-HL832NX Lead Finish, Composition / Thickness: SnAgCu/0.3mm Die Backside Preparation Method / Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Hysol Die Attach Material: 2025D Die Attach Method: Epoxy Bond Diagram Designation: 001-07669 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 44.21°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 11-21101 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Fault Coverage: CML-RA, KYEC, Taiwan 100% Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 14 Document No.001-88011 Rev. *B ECN # 4419050 RELIABILITY FAILURE RATE SUMMARY Device Tested/ Device Hours # Fails Activation Energy Thermal3 A.F Failure Rate High Temperature Operating Life Early Failure Rate1 1, 506 Devices 0 N/A N/A 0 PPM High Temperature Operating Life1,2 Long Term Failure Rate 989,168 DHRs 0 0 .7 170 11 FIT Stress/Test 1 2 3 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 Where: EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Reliability Test Data QTP #: 065201 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej ACOUSTIC-MSL3 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 15 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 15 0 CY7C68053 (7C680510BK) 610739937 TAIWN-G COMP 15 0 STRESS: 4727325 ESD-CHARGE DEVICE MODEL (500V) CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 9 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 8 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 8 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 3.63V) CY7C68053 (7C680510BK) 9714792 610721250 CML-R 80 80 0 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 168 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 3.8V, Vcc Max) CY7C68053 (7C680510BK) 9714792 610721250 CML-R 48 338 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 48 348 0 CY7C68053 (7C680510BK) 4727325 610739215 CML-R 48 340 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 3.8V, Vcc Max) CY7C68053 (7C680510BK) 9714792 610721250 CML-R 80 182 0 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 500 182 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 80 182 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 500 182 0 CY7C68053 (7C680510BK) 4727325 610739215 CML-R 80 180 0 CY7C68053 (7C680510BK) 4727325 610739215 CML-R 500 180 0 STRESS: Failure Mechanism HI-ACCEL SATURATION TEST (130C, 85%RH, 3.65V), PRE COND 192 HR, 30C/60%RH, MSL3 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 128 50 0 CY7C68053 (7C680510BK) 4720785 610731288 CML-R 128 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Reliability Test Data QTP #: 065201 Device STRESS: Fab Lot # Assy Loc Duration Samp Rej Failure Mechanism LOW TEMPERATURE OPERATING LIFE (-30C, 4.3V) CY7C68053 (7C680510BK) 9714792 STRESS: Assy Lot # 610721250 CML-R 500 45 0 STATIC LATCH-UP TESTING (125C, ±200mA) CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G COMP 3 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G COMP 6 0 STRESS: HIGH TEMPERATURE STORAGE, 150C, no bias CY7C68053 (7C680510BK) 9714792 610721250 CML-R 500 50 0 CY7C68053 (7C680510BK) 9714792 610721250 CML-R 1000 50 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G 168 48 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G 168 50 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G 300 50 0 CY7C68053 (7C680510BK) 9714792 610721014 TAIWN-G 1000 50 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G 500 50 0 CY7C68053 (7C680510BK) 4720785 610729797 TAIWN-G 1000 50 0 CY7C68053 (7C680510BK) 4727325 610739937 TAIWN-G 300 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Reliability Test Data QTP #: 072404 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej ACOUSTIC-MSL3 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA COMP 15 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA COMP 5 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA COMP 5 0 610754005/6/7/8 CML-RA COMP 9 0 8 0 STRESS: ESD-CHARGE DEVICE MODEL (500V) CYWB0124AB (7C07100B) 4738561 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CYWB0124AB (7C07100B) 4738561 STRESS: 610754005/6/7/8 CML-RA COMP HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100B) 4738561 CYWB0124AB (7C07100B) 4739848 610754005/6/7/8 CML-RA 610756608 CML-RA 96 96 817 268 0 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 96 270 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 96 269 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 96 270 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 96 270 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 96 270 0 STRESS: Failure Mechanism HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 168 180 0 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 1000 179 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 1000 60 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 1000 60 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Reliability Test Data QTP #: 072404 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 168 60 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 168 59 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 1000 59 0 STRESS: Failure Mechanism HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max) HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND 192 HR, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 128 76 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 168 26 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 168 24 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 168 26 0 COMP 6 0 STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA) CYWB0124AB (7C07100B) 4738561 STRESS: 610754005/6/7/8 CML-RA TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 300 50 0 CYWB0124AB (7C07100B) 4738561 610754005/6/7/8 CML-RA 500 50 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739848 610756608 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739848 610756609 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739848 610756607 CML-RA 1000 32 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 300 32 0 CYWB0124AB (7C07100B) 4739893 610756142 CML-RA 500 32 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 300 31 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 500 31 0 CYWB0124AB (7C07100B) 4739893 610756144 CML-RA 1000 31 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Reliability Test Data QTP #: 072404 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 300 31 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 500 31 0 CYWB0124AB (7C07100B) 4739893 610756145 CML-RA 1000 31 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Reliability Test Data QTP #: 080604 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100BK) 4803330 STRESS: 96 1506 0 610805143 CML-RA COMP 9 0 3 0 ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CYWB0124AB (7C07100BK) 4803330 STRESS: CML-RA ESD-CHARGE DEVICE MODEL (500V) CYWB0124AB (7C07100BK) 4803330 STRESS: 610805143 610805143 CML-RA COMP HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (125C, 3.8V, Vcc Max) CYWB0124AB (7C07100BK) 4803330 610805143 CML-RA 168 179 0 CYWB0124AB (7C07100BK) 4803330 610805143 CML-RA 1000 179 0 COMP 6 0 STRESS: STATIC LATCH-UP TESTING (125C, 5.4V, ±200mA) CYWB0124AB (7C07100BK) 4803330 STRESS: 610805143 CML-RA TC COND. C -65C TO 150C, PRE COND 192 HRS, 30C/60%RH, MSL3 CYWB0124AB (7C07100BK) 4803330 610805143 CML-RA 500 81 0 CYWB0124AB (7C07100BK) 4803330 610805143 CML-RA 1000 81 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 14 Document No.001-88011 Rev. *B ECN # 4419050 Document History Page Document Title: QTP # 072404 : WEST BRIDGE ANTIOCH, (CYWB0113AB, CYWB0124AB) C8Q3RL TECHNOLOGY, FAB5 Document Number: 001-88011 Rev. ECN Orig. of No. Change ** 4033646 ILZ Description of Change *A *B Add device CYWB0120AB in this QTP report. Sunset review: Updated QTP title page and Reliability Tests Performed table (EFR/LFR, HTSSL, LTOL, HTS, HAST, PCT, ESD-HBM, Acoustic Microscopy). 4050739 HSTO 4419050 JYF Initial Spec Release Qualification report published on Cypress.com is documented on memo HGA-825 and not in spec format. Initiated spec for QTP 072404 and all data from Memo HGA-825 was transferred to qualification report spec template. Deleted package qualification details on package qualification history table. Deleted Cypress reference Spec and replaced with Industry Standards Updated package availability based on current qualified test & assembly site. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 14