V6203619 VID

REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Make a correction under paragraph 6.3 to change
the lead finish from “A” to “E”. Add a footnote
under Table I and two notes under figure 1.
Add paragraph 1.5. Make changes to CMRR
and IDD (SHDN) tests under the conditions
column. - ro
05-10-11
R. MONNIN
B
Add device types 06 and 07.
Add case outline Z. - ro
05-11-01
R. MONNIN
C
Update document to current requirements. - ro
14-06-05
C. SAFFLE
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
TOM HESS
03-01-28
AMSC N/A
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TITLE
MICROCIRCUIT, LINEAR, LOW POWER,
OPERATIONAL AMPLIFIER, MONOLITHIC
SILICON
CODE IDENT. NO.
A
REV
C
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
APPROVED BY
RAYMOND MONNIN
SIZE
C
DWG NO.
V62/03619
16236
C
PAGE
1
OF
19
5962-V068-14
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance low power operational amplifier microcircuit,
with an operating temperature range of -40°C to +125°C for device types 01, 02, 03, 04, 05 and -55°C to +125°C for device types 06
and 07.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/03619
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
Circuit function
01
TLV2460AQ-EP 1/
02
03
04
TLV2461AQ-EP 1/
TLV2462AQ-EP
TLV2463AQ-EP
05
06
07
TLV2464AQ-EP 1/
TLV2462AM-EP
TLV2464AM-EP
Low power operational amplifier
with shutdown mode
Low power operational amplifier
Dual, low power operational amplifier
Dual, low power operational amplifier
with shutdown mode
Quad, low power operational amplifier
Dual, low power operational amplifier
Quad, low power operational amplifier
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
Y
Z
8
14
14
JEDEC PUB 95
Package style
MS-012
MS-012
MO-153
Plastic small outline
Plastic small outline
Plastic small outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer:
Finish designator
A
B
C
D
E
Z
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
____
1/ Not yet available from a source of supply.
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1.3 Absolute maximum ratings.
2/
Supply voltage (+VDD) ............................................................................. +6 V dc 3/
Differential input voltage (VID) ................................................................. -0.2 V to VDD + 0.2 V
Input current (II) (any input) ..................................................................... ±200 mA
Output current (IO) ................................................................................... ±175 mA
Total input current (II) (into +VDD ) .......................................................... 175 mA
Total output current (IO) (out of GND) ..................................................... 175 mA
Continuous total power dissipation TA ≤ +25°C
Case X ................................................................................................. 710 mW
Case Y ................................................................................................. 1022 mW
Maximum junction temperature (TJ) ........................................................ +150°C
Storage temperature range (Tstg) ............................................................. -65°C to +150°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds ............ +260°C
Thermal resistance, junction-to-case (θJC): ............................................ See dissipation rating table 4/
Thermal resistance, junction-to-ambient (θJA): ........................................ See dissipation rating table 4/
1.4 Recommended operating conditions. 5/
Supply voltage (VDD):
Single supply ........................................................................................
Split supply ...........................................................................................
Common mode input voltage range (VICR) .............................................
Shutdown on/off voltage level: 6/
VIH .......................................................................................................
2.7 V dc minimum to 6 V dc maximum
±1.35 V dc minimum to ±3 V dc maximum
-0.2 V minimum to +VDD + 0.2 V dc maximum
2 V minimum
VIL ........................................................................................................ 0.7 V maximum
Operating free-air temperature (TA)
Device types 01, 02, 03, 04, and 05 ..................................................... -40°C minimum to +125°C maximum
Device types 06 and 07 ........................................................................ -55°C minimum to +125°C maximum
1.5 Dissipation rating table. 7/
θJC
Package
2/
3/
4/
5/
6/
7/
θJA 0 air flow
Units
High K
Low K
High K
Low K
X
39.4
42.4
97.1
165.5
°C/W
Y
51.5
53.7
86.2
133.5
°C/W
Z
45.8
46.6
111.7
131.4
°C/W
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
All voltage values, except differential voltages, are with respect to GND.
Thermal resistances are not production tested and are for informational purposes only.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
Relative to voltage on the GND terminal of the device.
High K specifies a high thermal conductivity printed circuit board used to measure theta parameters.
Low K specifies a low thermal conductivity printed circuit board used to measure theta parameters.
DEFENSE SUPPLY CENTER, COLUMBUS
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CODE IDENT NO.
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PAGE
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2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA
22201-3834 or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
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TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
Input offset voltage
Temperature
coefficient of input
offset voltage
VIO
αVIO
Unit
Max
VDD = 3 V, VIC = 1.5 V,
25°C
All
1500
VO = 1.5 V, RS = 50 Ω
-40°C to +125°C
01 - 05
1700
-55°C to +125°C
06, 07
1700
VDD = 5 V, VIC = 2.5 V,
25°C
All
1500
VO = 2.5 V, RS = 50 Ω
-40°C to +125°C
01 - 05
1700
-55°C to +125°C
06, 07
1700
25°C
All
VDD = 3 V, VIC = 1.5 V,
µV
µV/°C
2 typical
VO = 1.5 V, RS = 50 Ω
2 typical
VDD = 5 V, VIC = 2.5 V,
VO = 2.5 V, RS = 50 Ω
Input offset current
Input bias current
IIO
IIB
VDD = 3 V, VIC = 1.5 V,
25°C
All
7
VO = 1.5 V, RS = 50 Ω
-40°C to +125°C
01 - 05
75
-55°C to +125°C
06, 07
75
VDD = 5 V, VIC = 2.5 V,
25°C
All
7
VO = 2.5 V, RS = 50 Ω
-40°C to +125°C
01 - 05
60
-55°C to +125°C
06, 07
60
VDD = 3 V, VIC = 1.5 V,
25°C
All
14
VO = 1.5 V, RS = 50 Ω
-40°C to +125°C
01 - 05
75
-55°C to +125°C
06, 07
75
VDD = 5 V, VIC = 2.5 V,
25°C
All
14
VO = 2.5 V, RS = 50 Ω
-40°C to +125°C
01 - 05
60
-55°C to +125°C
06, 07
60
nA
nA
See footnote at end of table.
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TABLE I. Electrical performance characteristics – continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
High level output
voltage
VOH
VDD = 3 V, IOH = -2.5 mA
VDD = 3 V, IOH = -10 mA
VDD = 5 V, IOH = -2.5 mA
VDD = 5 V, IOH = -10 mA
Low level output
voltage
VOL
VDD = 3 V, VIC = 1.5 V,
IOL = 2.5 mA
VDD = 3 V, VIC = 1.5 V,
IOL = 10 mA
VDD = 5 V, VIC = 2.5 V,
IOL = 2.5 mA
VDD = 5 V, VIC = 2.5 V,
IOL = 10 mA
Unit
Max
25°C
All
2.9 typical
-40°C to +125°C
01 - 05
2.8
-55°C to +125°C
06, 07
2.8
25°C
All
-40°C to +125°C
01 - 05
2.5
-55°C to +125°C
06, 07
2.5
25°C
All
-40°C to +125°C
01 - 05
4.8
-55°C to +125°C
06, 07
4.8
25°C
All
-40°C to +125°C
01 - 05
4.7
-55°C to +125°C
06, 07
4.7
25°C
All
-40°C to +125°C
01 - 05
0.2
-55°C to +125°C
06, 07
0.2
25°C
All
-40°C to +125°C
01 - 05
0.5
-55°C to +125°C
06, 07
0.5
25°C
All
-40°C to +125°C
01 - 05
0.2
-55°C to +125°C
06, 07
0.2
25°C
All
-40°C to +125°C
01 - 05
0.3
-55°C to +125°C
06, 07
0.3
V
2.7 typical
4.9 typical
4.8 typical
0.1 typical
V
0.3 typical
0.1 typical
0.2 typical
See footnote at end of table.
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TABLE I. Electrical performance characteristics – continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
Short circuit output
current
IOS
VDD = 3 V, sourcing
VDD = 3 V, sinking
VDD = 5 V, sourcing
VDD = 5 V, sinking
Output current
IO
VDD = 3 V, measured 1 V from rail
25°C
All
-40°C to +125°C
01 - 05
20
-55°C to +125°C
06, 07
20
25°C
All
-40°C to +125°C
01 - 05
20
-55°C to +125°C
06, 07
20
25°C
All
-40°C to +125°C
01 - 05
60
-55°C to +125°C
06, 07
60
25°C
All
-40°C to +125°C
01 - 05
60
-55°C to +125°C
06, 07
60
25°C
All
AVD
VDD = 3 V, RL = 10 kΩ
VDD = 5 V, RL = 10 kΩ,
VIC = 2.5 V, VO = 1 V to 4 V
Differential input
resistance
ri(d)
VDD = 3 V
Ci(c)
50 typical
mA
40 typical
145 typical
100 typical
±40 typical
25°C
All
90
-40°C to +125°C
01 - 05
89
-55°C to +125°C
06, 07
89
25°C
All
92
-40°C to +125°C
01 - 05
90
-55°C to +125°C
06, 07
90
25°C
All
mA
dB
9
Ω
10 typical
9
VDD = 5 V
Common mode input
capacitance
Max
±80 typical
VDD = 5 V, measured 1 V from rail
Large signal
differential voltage
amplification
Unit
10 typical
All
25°C
VDD = 3 V, f = 10 kHz
7 typical
pF
7 typical
VDD = 5 V, f = 10 kHz
See footnote at end of table.
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TABLE I. Electrical performance characteristics – continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
Closed loop output
impedance
zo
All
25°C
VDD = 3 V, f = 100 kHz, AV = 10
CMRR
VDD = 3 V, RS = 50 Ω,
VICR = 0 V to 3V
VDD = 5 V, RS = 50 Ω,
VICR = 0 V to 5 V
Supply voltage
rejection ratio
(∆VDD / ∆VIO)
kSVR
VDD = 2.7 V to 6 V, no load,
VIC = VDD / 2
VDD = 3 V to 5 V, no load,
VIC = VDD / 2
Supply current
(per channels)
IDD
VDD = 3 V, VO = 1.5 V,
no load
VDD = 5 V, VO = 2.5 V,
no load
Supply current in
shutdown
IDD
VDD = 3 V, SHDN < 0.7 V,
(SHDN)
per channel in shutdown
Max
Ω
33 typical
29 typical
VDD = 5 V, f = 100 kHz, AV = 10
Common mode
rejection ratio
Unit
25°C
All
66
-40°C to +125°C
01 - 05
60
-55°C to +125°C
06, 07
60
25°C
All
71
-40°C to +125°C
01 - 05
60
-55°C to +125°C
06, 07
60
25°C
All
80
-40°C to +125°C
01 - 05
75
-55°C to +125°C
06, 07
75
25°C
All
85
-40°C to +125°C
01 - 05
80
-55°C to +125°C
06, 07
80
25°C
All
0.575
-40°C to +125°C
01 - 05
0.9
-55°C to +125°C
06, 07
0.9
25°C
All
0.65
-40°C to +125°C
01 - 05
1
-55°C to +125°C
06, 07
1
25°C
01,04
0.3 typical
mA
µA
1 typical
25°C
per channels in shutdown
dB
2.5
-40°C to +125°C
VDD = 5 V, SHDN < 0.7 V,
dB
3
-40°C to +125°C
See footnote at end of table.
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TABLE I. Electrical performance characteristics – continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
Slew rate at unity gain
Equivalent input noise
voltage
Equivalent input noise
current
SR
Vn
In
VDD = 3 V, VO(PP) = 2 V,
25°C
All
1
CL = 160 pF, RL = 10 kΩ
-40°C to +125°C
01 - 05
0.8
-55°C to +125°C
06, 07
0.8
VDD = 5 V, VO(PP) = 2 V,
25°C
All
1
CL = 160 pF, RL = 10 kΩ
-40°C to +125°C
01 - 05
0.8
-55°C to +125°C
06, 07
0.8
25°C
All
VDD = 3 V, f = 100 Hz
Amplifier turn on time
Max
V/µs
16 typical
VDD = 3 V, f = 1 kHz
11 typical
VDD = 5 V, f = 100 Hz
14 typical
VDD = 5 V, f = 1 kHz
11 typical
25°C
VDD = 3 V, f = 1 kHz
All
nV / Hz
0.13 typical
pA / Hz
0.13 typical
VDD = 5 V, f = 100 Hz
Total harmonic
distortion plus
noise
Unit
THD +
VDD = 3 V,
AV = 1
N
VO(PP) = 2 V,
AV = 10
0.02 % typical
RL = 10 kΩ,
f = 1 kHz
AV = 100
0.08 % typical
VDD = 5 V,
AV = 1
0.004 % typical
VO(PP) = 4 V,
AV = 10
0.01 % typical
RL = 10 kΩ,
f = 10 kHz
AV = 100
0.04 % typical
VDD = 3 V,
Both channels
AV = 1,
Channel 1
only,
Channel 2 on
t(on)
RL = 10 kΩ
25°C
25°C
All
All
0.006 % typical
µs
7.6 typical
7.65 typical
See footnote at end of table.
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TABLE I. Electrical performance characteristics – continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
Amplifier turn on time
Amplifier turn off time
Gain bandwidth
product
t(on)
t(off)
GBWP
All
Unit
Max
VDD = 5 V,
Both channels
AV = 1,
Channel 1 only,
Channel 2 on
7.65 typical
RL = 10 kΩ
Channel 2 only,
Channel 1 on
7.25 typical
VDD = 3 V,
Both channels
AV = 1,
Channel 1 only,
Channel 2 on
328 typical
RL = 10 kΩ
Channel 2 only,
Channel 1 on
329 typical
VDD = 5 V,
Both channels
333 typical
AV = 1,
Channel 1 only,
Channel 2 on
328 typical
RL = 10 kΩ
Channel 2 only,
Channel 1 on
329 typical
25°C
All
25°C
All
25°C
VDD = 3 V, f = 10 kHz,
7.6 typical
333 typical
5.2 typical
µs
ns
MHz
CL = 160 pF, RL = 10 kΩ
6.4 typical
VDD = 5 V, f = 10 kHz,
CL = 160 pF, RL = 10 kΩ
Settling time
tS
VDD = 3 V, AV = -1,
0.1 %
All
V(STEP)PP = 2 V,
0.01 %
1.78 typical
VDD = 3 V, AV = -1,
0.1 %
1.77 typical
V(STEP)PP = 2 V,
0.01 %
1.98 typical
25°C
1.47 typical
µs
CL = 10 pF, RL = 10 kΩ
CL = 56 pF, RL = 10 kΩ
See footnote at end of table.
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TABLE I. Electrical performance characteristics – continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Min
Settling time
tS
All
Unit
Max
VDD = 5 V, AV = -1,
0.1 %
V(STEP)PP = 2 V,
0.01 %
1.83 typical
VDD = 5 V, AV = -1,
0.1 %
3.13 typical
V(STEP)PP = 2 V,
0.01 %
3.33 typical
25°C
1.53 typical
µs
CL = 10 pF, RL = 10 kΩ
CL = 56 pF, RL = 10 kΩ
Phase margin at
unity gain
φm
All
25°C
VDD = 3 V, CL = 160 pF,
44° typical
RL = 10 kΩ
45° typical
VDD = 5 V, CL = 160 pF,
RL = 10 kΩ
Gain margin
All
25°C
VDD = 3 V, CL = 160 pF,
7 typical
dB
RL = 10 kΩ
7 typical
VDD = 5 V, CL = 160 pF,
RL = 10 kΩ
1/
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
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Case X
FIGURE 1. Case outlines.
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Case X – continued.
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
---
0.069
---
1.75
A1
0.004
0.010
0.10
0.25
b
0.014
0.020
0.35
0.51
c
D
0.008 nominal
0.189
e
0.20 nominal
0.197
4.80
0.050
5.00
1.27
E
0.150
0.157
3.81
4.00
E1
0.228
0.244
5.80
6.20
L
0.016
0.044
0.40
1.12
n
8 leads
8 leads
NOTE:
1. Controlling dimensions are inch, millimeter dimensions are given for reference only.
2. Body dimensions do not include mold flash or protrusion not to exceed 0.006 inch (0.15 mm).
3. Falls with JEDEC MS-012.
FIGURE 1. Case outlines. – continued.
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Case Y
FIGURE 1. Case outlines – continued.
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Case Y – continued.
Dimensions
Inches
Symbol
Millimeters
Min
Max
Min
Max
A
---
0.069
---
1.75
A1
0.004
0.010
0.10
0.25
b
0.014
0.020
0.35
0.51
c
D
0.008 nominal
0.337
e
0.20 nominal
0.344
8.55
0.050
8.75
1.27
E
0.150
0.157
3.81
4.00
E1
0.228
0.244
5.80
6.20
L
0.016
0.044
0.40
1.12
n
14 leads
14 leads
NOTE:
1. Controlling dimensions are inch, millimeter dimensions are given for reference only.
2. Body dimensions do not include mold flash or protrusion not to exceed 0.006 inch (0.15 mm).
3. Falls with JEDEC MS-012.
FIGURE 1. Case outlines. – continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
C
DWG NO.
V62/03619
PAGE
15
Case Z
FIGURE 1. Case outlines - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
C
DWG NO.
V62/03619
PAGE
16
Case Z – continued.
Dimensions
Millimeters
Symbol
Min
A
Inches
Max
Min
Max
1.20
.047
A1
0.05
0.15
.002
.006
b
0.19
0.30
.007
.012
c
0.15 nominal
.006 nominal
D
4.90
5.10
.193
.201
E
4.30
4.50
.169
.177
E1
6.20
6.60
.244
.260
e
L
0.65 BSC
0.50
0.75
.026 BSC
.020
.030
NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only
2. Body dimensions do not include mold flash or protrusion, not to exceed 0.15 millimeters (0.006 inch).
3. Fall within JEDEC MO-153.
FIGURE 1. Case outlines - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
C
DWG NO.
V62/03619
PAGE
17
Device types
01
02
03, 06
04
05, 07
07
Case outlines
X
X
X
Y
Y
Z
Terminal number
Terminal symbol
1
NC
NC
1 OUT
1 OUT
1 OUT
1 OUT
2
-IN
-IN
1 –IN
1 –IN
1 –IN
1 –IN
3
+IN
+IN
1 +IN
1 +IN
1 +IN
1 +IN
4
GND
GND
GND
GND
+VDD
+VDD
5
NC
NC
2 +IN
NC
2 +IN
2 +IN
6
OUT
OUT
2 –IN
1 SHDN
2 –IN
2 –IN
7
+VDD
+VDD
2 OUT
NC
2 OUT
2 OUT
8
SHDN
NC
+VDD
NC
3 OUT
3 OUT
9
---
---
---
2 SHDN
3 –IN
3 –IN
10
---
---
---
NC
3 +IN
3 +IN
11
---
---
---
2 +IN
GND
GND
12
---
---
---
2 –IN
4 +IN
4 +IN
13
---
---
---
2 OUT
4 –IN
4 –IN
14
---
---
---
+VDD
4 OUT
4 OUT
NC = No internal connection
FIGURE 2. Terminal connections.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
C
DWG NO.
V62/03619
PAGE
18
4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Vendor part number
Top side marking
V62/03619-01XE
01295
2/
V62/03619-02XE
01295
2/
V62/03619-03XE
01295
TLV2462AQDREP
2462AE
V62/03619-04YE
01295
TLV2463AQDREP
V2463AQE
V62/03619-05YE
01295
2/
V62/03619-06XE
01295
TLV2462AMDREP
2462AM
V62/03619-07YE
01295
TLV2464AMDREP
V2464AME
V62/03619-07ZE
01295
TLV2464AMPWREP
2464AME
1/ The vendor item drawing establishes an administrative control number for identifying the
item on the engineering documentation.
2/ Not yet available from a source of supply.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
SIZE
A
CODE IDENT NO.
16236
REV
C
DWG NO.
V62/03619
PAGE
19