V6204604 VID

REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Add device type 04. Update boilerplate to current
requirements. - CFS
06-06-06
Thomas M. Hess
B
Add case outline Y. - CFS
07-02-22
Thomas M. Hess
C
Add device type 05 and 06. Update boilerplate to
current requirements. - PHN
11-11-29
Thomas M. Hess
CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
Charles F. Saffle
Original date of drawing
CHECKED BY
Charles F. Saffle
YY-MM-DD
APPROVED BY
Thomas M. Hess
03-10-09
SIZE
A
REV
AMSC N/A
CODE IDENT. NO.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO 43218-3990
TITLE
MICROCIRCUIT, DIGITAL, MICROPOWER
SUPPLY VOLTAGE SUPERVISORS,
MONOLITHIC SILICON
DWG NO.
V62/04604
16236
C
PAGE
1
OF
12
5962-V011-12
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance micropower supply voltage
supervisors microcircuit, with an operating temperature range of -40°C to +125°C for device types 01, 02, and 03, and with
an operating temperature range of -55°C to +125°C for device type 04, 05 and 06.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/04604
-
Drawing
number
01
X
E
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device types.
Device type
Generic
01
02
03
04
05
06
TLC7701-EP
TLC7705-EP
TLC7733-EP
TLC7701-EP
TLC7705-EP
TLC7733-EP
Circuit function
Micropower supply voltage supervisor
Micropower supply voltage supervisor
Micropower supply voltage supervisor
Micropower supply voltage supervisor
Micropower supply voltage supervisor
Micropower supply voltage supervisor
1/
1/
1/
2/
2/
2/
1.2.2 Case outlines. The case outlines are as specified herein.
Outline letter
Number of pins
JEDEC PUB 95
X
Y
8
8
JEDEC MO-153
JEDEC MS-012
Package style
Plastic small-outline
Plastic small-outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer:
Finish designator
A
B
C
D
E
Z
Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
__________
1/
2/
Operating temperature range is -40°C to +125°C.
Operating temperature range is -55°C to +125°C.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
2
1.3 Absolute maximum ratings.
1/
Supply voltage (VDD) ...................................................................................................
Input voltage range (VI), CONTROL, RESIN, SENSE ................................................
Maximum low output current (IOL) ...............................................................................
Maximum high output current (IOH)..............................................................................
Input clamp current (IIK) (VI < 0 or VI > VDD) ................................................................
Output clamp current (IOK) (VO < 0 or VO >VDD)...........................................................
Continuous total power dissipation:
Case outline X:
TA ≤ 25°C .............................................................................................................
TA = 85°C .............................................................................................................
TA = 125°C ...........................................................................................................
Derating factor above TA = 25°C .........................................................................
Case outline Y:
TA ≤ 25°C .............................................................................................................
TA = 85°C .............................................................................................................
TA = 125°C ...........................................................................................................
Derating factor above TA = 25°C .........................................................................
Operating free-air temperature range (TA):
Device types 01, 02, and 03 ...................................................................................
Device type 04, 05, and 06 .....................................................................................
Storage temperature range (TSTG) ..............................................................................
7.0 V
-0.3 V to 7.0 V
10 mA
-10 mA
±10 mA
±10 mA
2/
525 mW
273 mW
105 mW
4.2 mW/°C
725 mW
377 mW
145 mW
5.8 mW/°C
-40°C to +125°C
-55°C to +125°C
-65°C to +150°C
1.4 Recommended operating conditions.
Supply voltage range (VDD) .........................................................................................
Input voltage range (VI) ...............................................................................................
Minimum high level input voltage at RESIN and CONTROL (VIH) ..............................
Maximum low level input voltage at RESIN and CONTROL (VIL) ...............................
Maximum high level output current (IOH) (VDD ≥ 2.7V) ...............................................
Maximum low level output current (IOL) (VDD ≥ 2.7V) .................................................
Maximum input transition rise and fall rate at RESIN and CONTROL(∆t/∆v) ..............
Operating free-air temperature range (TA):
Device types 01, 02, and 03 ...................................................................................
Device type 04, 05, and 06 ....................................................................................
1/
2/
3/
+2.0 V to +6.0 V
0.0 V to VDD
0.7xVDD 3/
0.2xVDD 3/
-2 mA
2 mA
100 ns/V
-40°C to +125°C
-55°C to +125°C
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
All voltage values are with respect to GND.
To ensure a low supply current, VIL should be kept < 0.3 V and VIH > VDD – 0.3 V.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
3
2. APPLICABLE DOCUMENTS
JEDEC PUB 95
-
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA
22201-3834 or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outlines. The case outlines shall be as shown in 1.2.2 and figure 1.
3.5.2 Function table. The function table shall be as shown in figure 2.
3.5.3 Functional diagram. The functional diagram shall be as shown in figure 3.
3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4.
3.5.5 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as shown in figure 5.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
4
TABLE I. Electrical performance characteristics.
Test
High level output
voltage
Low level output
voltage
Symbol
VOH
VOL
Test conditions
unless otherwise
specified 2/
IOH = -20 µA
Hysteresis voltage,
SENSE
Temperature,
TA
Device
type
Limits
Min
2.0 V
3/
All
2.5
4.5 V
4.3
IOH = -2 mA
4.5 V
3.7
IOL = 20 µA
2.0 V
VIT4/
Vres
5/
IOL = 20 µA
Input current
II
RESIN
VI = 0.0 V to VDD
CONTROL
VI = VDD
SENSE
VI = 5.0 V
SENSE
VI = 5.0 V
V
All
0.2
0.2
4.5 V
0.2
4.5 V
0.5
2.0 V
to
6.0 V
Power-up reset
voltage
Max
2.7 V
2.0 V
to
6.0 V
Vhys
3/
Unit
1.8
2.7 V
IOL = 2 mA
Negative-going input
threshold voltage,
SENSE
VDD
1/
3/
+25°C
01, 04
1.04
1.16
02, 05
4.43
4.63
03, 06
2.855
3.03
01, 04
30 TYP
02, 05
70 TYP
03, 06
70 TYP
V
V
mV
2.0 V
to
6.0 V
3/
All
1.0
V
2.0 V
to
6.0 V
3/
All
2.0
µA
15.0
10.0
01
2
Supply current
IDD
RESIN = VDD,
SENSE = VDD ≥ VITmax + 0.2 V,
CONTROL = 0.0 V,
Outputs open
2.0 V
to
6.0 V
3/
All
16.0
µA
Supply current
during td
IDD(d)
VCT = 0.0 V, RESIN = VDD,
SENSE = VDD,
CONTROL = 0.0 V,
Outputs open
5.0 V
3/
All
150
µA
Input capacitance,
SENSE
CI
VI = 0.0 V to VDD
2.0 V
to
6.0 V
+25°C
All
50 TYP
pF
See footnotes at end of table.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
5
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Delay time,
from VI(SENSE) ≥ VIT+
to RESET and
RESET
td
Propagation delay
time, from SENSE
to RESET
tPLH
Propagation delay
time, from SENSE
to RESET
tPLH
Propagation delay
time, from RESIN
to RESET
tPLH
Propagation delay
time, from RESIN
to RESET
tPLH
Propagation delay
time, from
CONTROL to
RESET
tPLH
tPHL
Test conditions
unless otherwise
specified 6/
VDD
Temperature,
TA
Device
type
RESIN = 0.7 x VDD,
CONTROL = 0.2 x VDD,
CT = 100 nF,
See figure 5
5.0 V
3/
01, 02
03
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V,
RESIN = 0.7 x VDD,
CONTROL = 0.2 x VDD,
CT = NC 7/
5.0 V
5.0 V
tPHL
VIH = 0.7 x VDD, VIL = 0.2 x VDD,
SENSE = VIT+max + 0.2 V,
CONTROL = 0.2 x VDD,
CT = NC 7/
5.0 V
5.0 V
4.2
Low-level minimum
pulse duration to
switch RESET and
RESET, from RESIN
VIH = 0.7 x VDD,
VIL = 0.2 x VDD
5.0 V
tr
10% to 90%
5.0 V
tf
90% to 10%
tPHL
ms
2.1 TYP
All
µs
20.0
3/
All
µs
5.0
3/
All
3/
All
tPHL
5.0 V
6/
7/
Max
1.1
20.0
VIH = VIT+max + 0.2 V,
VIL = VIT-min - 0.2 V
5/
Min
tPHL
Low-level minimum
pulse duration to
switch RESET and
RESET, from SENSE
2/
3/
4/
3/
Unit
5.0
5.0 V
1/
Limits
04, 05,
06
VIH = 0.7 x VDD, VIL = 0.2 x VDD,
SENSE = VIT+max + 0.2 V,
RESIN = 0.7 x VDD,
CT = NC 7/
Rise time, to RESET
and RESET
1/
3/
All
20.0
µs
60.0
ns
65.0
ns
20.0
µs
58.0
ns
58.0
3/
01, 02,
03
3.0
04, 05
,06
4
3/
All
1.0
3/
All
µs
µs
8.0 TYP
ns/V
4.0 TYP
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the
specified temperature range. Product may not necessarily be tested across the full temperature range and al parameters may not
necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or
design.
All characteristics are measured with CT = 0.1 µF.
TA = -40°C to +125°C for device types 01, 02, and 03. TA = -55°C to +125°C for device type 04, 05 and 06.
To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 µF) should be connected near the supply
terminals.
The lowest supply voltage at which RESET becomes active. The symbol Vres is not currently listed within EIA or JEDEC standards
for semiconductor symbology. Rise time of VDD ≥ 15 µs/V.
Switching characteristics are at VDD = 5.0 V, RL = 2 kΩ, CL = 50 pF, and TA = Full Range, unless otherwise noted.
NC = No capacitor, and includes up to 100 pF probe and jig capacitance.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
6
Case X
b
e
8
0.10(.004)
M
5
E E1
1
4
D
SEE
DETAIL A
A1
A
SEATING
PLANE
0.10(.004)
c
0°-8°
GAGE
PLANE
0.25(.010)
L
DETAIL A
Symbol
Millimeters
Min
Max
A
A1
b
c
D
1.20
0.05
0.15
0.19
0.30
0.15 NOM
2.90
3.10
Dimensions
Inches
Symbol
Min
Max
0.047
0.002 0.006
0.007 0.012
0.006 NOM
0.114 0.122
E
E1
e
L
Millimeters
Min
Max
Inches
Min
Max
4.30
4.50
6.20
6.60
0.65 NOM
0.50
0.75
0.169
0.177
0.244
0.260
0.026 NOM
0.020
0.030
NOTES:
1. This drawing is subject to change without notice.
2. Body dimensions do not include mold flash or protrusion not to exceed 0.15 mm (0.006 inches).
3. Falls within JEDEC MO-153.
4. All linear dimensions are shown in millimeters (inches). Inches equivalents are given for general information only.
FIGURE 1. Case outlines.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
7
Case Y
e
b
8
.010(0.25)
M
5
E
1
E1
4
PIN 1
INDEX AREA
D
SEE
DETAIL A
A1
A
c
GAUGE
.004(0.10)
0°-8°
SEATING
PLANE
PLANE
A2
L
DETAIL A
Symbol
Inches
Min
Max
A
A1
A2
b
c
--0.069
0.004
0.010
0.010 BSC
0.012
0.020
0.007
0.010
Dimensions
Millimeters
Symbol
Min
Max
--1.27
0.10
0.25
0.25 BSC
0.31
0.51
0.17
0.25
D
E
E1
e
L
Inches
Min
Max
Millimeters
Min
Max
0.189 0.197
0.150 0.157
0.228 0.244
0.050 BSC
0.016 0.050
4.80
5.00
3.80
4.00
5.80
6.20
1.27 BSC
0.40
1.27
NOTES:
1. This drawing is subject to change without notice.
2. Body length does not include mold flash, protrusions, or gate burrs not to exceed 0.006 inches (0.15 mm) per end.
Body width does not include interlead flash not to exceed 0.017 inches (0.43 mm) per side.
3. Falls within JEDEC MS-012 variation AA.
4. All linear dimensions are shown in inches (millimeters). Millimeters equivalents are given for general information only.
FIGURE 1. Case outlines - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
8
CONTROL
RESIN
VI(SENSE)>VIT+
RESET
RESET
L
L
False
H
L
L
L
True
H
L
L
H
False
H
L
L
H
True
L*
H*
H
L
False
H
L
H
L
True
H
L
H
H
False
H
L
H
H
True
H
H*
* = RESET and RESET states shown are valid for t > td.
FIGURE 2. Function table.
NOTE: 1. Outputs are totem-pole configuration. External pullup or pulldown resistors are not required.
2. Nominal values:
R1 (Typ)
R2 (Typ)
TLC7701
0
∞
TLC7705
910 kΩ
290 kΩ
TLC7733
750 kΩ
450 kΩ
FIGURE 3. Functional diagram.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
9
Device types
All
Case outlines
X and Y
Terminal number
Terminal symbol
1
CONTROL
2
RESIN
3
CT
4
GND
5
RESET
6
RESET
7
SENSE
8
VDD
FIGURE 4. Terminal connections.
NOTE: 1. For switching characteristics, RL = 2 kΩ.
2. CL = 50 pF includes jig and probe capacitance.
FIGURE 5. Timing waveforms and test circuit.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
10
FIGURE 5. Timing waveforms and test circuit - Continued.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
11
4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard
commercial practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item.
Vendor item drawing
administrative control
number 1/
V62/04604-01XE
V62/04604-02XE
V62/04604-03XE
V62/04604-04XE
V62/04604-04YE
V62/04604-05XE
V62/04604-06XE
Device
manufacturer
CAGE code
01295
01295
01295
01295
01295
2/
01295
Vendor part number
Top-Side
Marking
TLC7701QPWREP
TLC7705QPWREP
TLC7733QPWREP
TLC7701MPWREP
TLC7701MDREP
TLC7705MPWREP
TLC7733MPWREP
7701QE
7705QE
7733QE
7701ME
7701ME
7705ME
7733ME
1/ The vendor item drawing establishes an administrative control number for identifying the item
on the engineering documentation.
2/ Not available from an approved source of supply.
CAGE code
01295
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
Source of supply
Texas Instruments, Inc.
Semiconductor Group
8505 Forest lane
P.O. Box 660199
Dallas, TX 75243
Point of contact: U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
SIZE
CODE IDENT NO.
DWG NO.
A
16236
V62/04604
REV
C
PAGE
12