QF N3 2 HV SOT617-3 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 8 June 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HVQFN32 Package type industry code HVQFN32 Package style descriptive code HVQFN (thermal enhanced very thin quad flatpack; no leads) Package body material type P (plastic) JEDEC package outline code MO-220 Mounting method type S (surface mount) Issue date 22-10-2002 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 4.9 - 5 5.1 mm E package width 4.9 - 5 5.1 mm A seated height - - 0.85 - mm A2 package height - - - - e nominal pitch - - 0.5 - n2 actual quantity of termination - - 32 - mm SOT617-3 NXP Semiconductors DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 2. Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm D B SOT617-3 A terminal 1 index area A A1 E detail X C e1 e v w 1/2 e b 9 16 L y1 C C A B C y 17 8 e e2 Eh 1/2 e 24 1 terminal 1 index area 32 25 X Dh 0 2.5 Dimensions Unit(1) mm 5 mm scale A(1) A1 b max 0.05 0.30 nom 0.85 min 0.00 0.18 c 0.2 D(1) Dh E(1) Eh 5.1 3.75 5.1 3.75 4.9 3.45 4.9 3.45 e e1 e2 0.5 3.5 3.5 L 0.5 0.3 v 0.1 w y 0.05 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version SOT617-3 References IEC JEDEC JEITA sot617-3_po European projection Issue date 11-06-14 11-06-21 MO-220 Fig. 1. Package outline HVQFN32 (SOT617-3) SOT617-3 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT617-3 NXP Semiconductors DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 3. Soldering Footprint information for reflow soldering of HVQFN32 package SOT617-3 Hx Gx see detail X P nSPx By Hy Gy SLy Ay nSPy C D SLx Bx Ax 0.60 solder land 0.30 solder paste detail X occupied area Dimensions in mm P Ax Ay Bx By C D Gx Gy Hx Hy SLx SLy nSPx nSPy 0.5 5.95 5.95 4.25 4.25 0.85 0.27 5.25 5.25 6.2 6.2 3.75 3.75 3 3 Issue date 11-11-15 11-11-20 sot617-3_fr Fig. 2. Reflow soldering footprint for HVQFN32 (SOT617-3) SOT617-3 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT617-3 NXP Semiconductors DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 4. 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Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT617-3 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT617-3 NXP Semiconductors DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 June 2016 SOT617-3 Package information All information provided in this document is subject to legal disclaimers. 8 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5