TI DRV10866DSC

DRV10866
www.ti.com
SBVS206 – NOVEMBER 2012
5-V, THREE-PHASE, SENSORLESS BLDC MOTOR DRIVER
FEATURES
1
•
•
2
•
•
•
•
•
•
Input Voltage Range: 1.65 V to 5.5 V
Six Integrated MOSFETS With 680-mA Peak
Output Current
Ultralow Quiescent Current: 5 µA (typ) in
Standby Mode
Total Driver H+L RDSOn 900 mΩ
Sensorless Proprietary BMEF Control Scheme
150° Commutation
Synchronous Rectification PWM Operation
Selectable FG and ½ FG Open-Drain Output
•
•
•
•
•
PWMIN Input from 15 kHz to 50 kHz
Lock Detection
Voltage Surge Protection
UVLO
Thermal Shutdown
APPLICATIONS
•
•
•
Notebook CPU Fans
Game Station CPU Fans
ASIC Cooling Fans
DESCRIPTION
DRV10866 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current
capability up to 680 mA peak. DRV10866 is specifically designed for low noise and low external component
count fan motor drive applications. DRV10866 has built in over-current protection with no external current sense
resistor needed. The synchronous rectification mode of operation achieves increased efficiency for motor driver
applications. DRV10866 outputs either FG or ½ FG to indicate motor speed with open drain output. A 150°
sensorless BEMF control scheme is implemented for a three phase motor. DRV10866 is available in the
thermally efficient 10-pin, 3-mm x 3-mm x 0.75-mm SON (DSC) package. The operating temperature is specified
from -40°C to 125°C.
TYPICAL APPLICATION
100 kW
PWM
10
COM
CS
9
3
VCC
FGS
8
4
U
V
7
5
GND
W
6
1
FG
2
PWMIN
3.8 kW
VCC
2.2 mF/
6.3 V
M
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DRV10866
SBVS206 – NOVEMBER 2012
www.ti.com
ORDERING INFORMATION (1) (2)
(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
DRV10866
SON-10
DSC
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA,
QUANTITY
–40°C to +125°C
DRV10866
DRV10866DSC
Tape and Reel,
3000
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/package.
(2)
FUNCTIONAL BLOCK DIAGRAM
Lock
Detection
FG
PWM
PWM and
Standby
1/2
GND
COM
FGS
FIL
PCOM
U
V
W
Current
Comparator
Phase
Select
Phase
Select
VREF
UVLO and
Clamping
VCC
CS_S
CS
VCC
Core
Logic
Bandgap
Predriver
VREF
U
V
GND
Predriver
OSC (5 MHz)
VCC
GND
Thermal
Detection
Predriver
W
GND
2
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DRV10866
www.ti.com
SBVS206 – NOVEMBER 2012
PIN DESIGNATION
DSC PACKAGE
3-mm × 3-mm SON
(TOP VIEW)
FG
1
10
PWM
COM
2
9
CS
VCC
3
8
FGS
U
4
7
V
GND
5
6
W
Thermal Pad
(1)
GND
(1). Thermal pad connected to ground.
Table 1. PIN DESCRIPTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
FG
1
O
Frequency generator output. If the FGS pin is connected to ground, the output has a period
equal to six electrical states (FG). If the FGS pin is connected to VCC, the output has a
period equal to 12 electrical states (1/2FG).
COM
2
I
Motor common terminal input
VCC
3
I
Input voltage for motor and chip-supply voltage; the internal clamping circuit clamps the VCC
voltage.
U
4
O
Phase U output
GND
5
—
Ground pin
W
6
O
Phase W output
V
7
O
Phase V output
FGS
8
I
FG and 1/2FG control pin. Latched upon wake-up signal from the PWM pin. For details, refer
to the FG pin description section.
I
Overcurrent threshold setup pin. The constant current of the internal constant current source
flows through the resistor connected to this pin. The other side of the resistor is connected to
ground. The voltage across the resistor compares with the voltage converted from the
bottom MOSFET current. If the MOSFET current is high, the part enters the overcurrent
protection mode by turning off the top PWM MOSFET and holding the bottom MOSFET on. I
(mA) = 3120/RCS(kΩ).
Equation valid range: 300 mA < ILIMIT< 850 mA
I
PWM input pin. The PWM input signal is converted to a fixed 156-kHz switching frequency
on the MOSFET driver. The PWM input signal resolution is less than 1%. This pin can also
control the device and put it in or out of standby mode. After the signal at the PWM stays low
(up to 500 µs), the device goes into low-power standby mode. Standby current is
approximately 5 µA. The rising edge of the PWM signal wakes up the device and puts it into
active mode, where it is ready to start to turn the motor.
CS
PWM
9
10
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DRV10866
SBVS206 – NOVEMBER 2012
www.ti.com
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted).
VALUE
Input voltage range (1)
Output voltage range (1)
Temperature
Electrostatic discharge (ESD)
(1)
MIN
MAX
UNIT
VCC
–0.3
+6.0
V
CS, FGS, PWM
–0.3
+6.0
V
GND
–0.3
+0.3
V
COM
–1.0
+6.0
V
U, V, W
–1.0
+7.0
V
FG
–0.3
+6.0
V
Operating junction temperature, TJ
–40
+125
°C
Storage, Tstg
–55
+150
°C
4
kV
500
V
Human body model, HBM
Charge device model, CDM
All voltage values are with respect to network ground terminal unless otherwise noted.
THERMAL INFORMATION
DRV10866
THERMAL METRIC (1)
DSC
UNITS
10 PINS
θJA
Junction-to-ambient thermal resistance (2)
42.3
θJCtop
Junction-to-case (top) thermal resistance (3)
44.5
θJB
Junction-to-board thermal resistance (4)
17.1
(5)
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter (6)
17.3
θJCbot
Junction-to-case (bottom) thermal resistance (7)
4.3
(1)
(2)
(3)
(4)
(5)
(6)
(7)
4
0.3
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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DRV10866
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SBVS206 – NOVEMBER 2012
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
MIN
Supply voltage
Voltage range
NOM
MAX
UNIT
VCC
1.65
5.5
V
U, V, W
–0.7
6.5
V
FG, CS, FGS, COM
–0.1
5.5
V
GND
–0.1
0.1
V
PWM
–0.1
5.5
V
–40
+125
°C
Operating junction temperature, TJ
ELECTRICAL CHARACTERISTICS
Over operating free-air temperature range (unless otherwise noted).
DRV10866
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
IVcc
Supply current
TA = +25°C; PWM = VCC; VCC = 5 V
2.5
3.5
mA
IVcc-Standby
Standby current
TA = +25°C; PWM = 0 V; VCC = 5 V
5
10
µA
VUVLO-Th_r
UVLO threshold voltage,
rising
Rise threshold, TA = +25°C
1.80
1.9
V
VUVLO-Th_f
UVLO threshold voltage,
falling
Fall threshold, TA = +25°C
1.6
1.65
VUVLO-Th_hys
UVLO threshold voltage,
hysteresis
TA = +25°C
75
150
225
mV
TA = +25°C; VCC = 5 V; IO = 0.5 A
0.8
1.2
Ω
TA = +25°C; VCC = 4 V; IO = 0.5 A
0.9
1.4
Ω
TA = +25°C; VCC = 3 V; IO = 0.5 A
1.1
1.7
Ω
UVLO
V
INTEGRATED MOSFET
RDSON
Series resistance (H+L)
PWM
VPWM-IH
High-level input voltage
VCC ≥ 4.5 V
VPWM-IL
Low-level input voltage
VCC ≥ 4.5 V
FPWM
PWM input frequency
2.3
15
Standby mode, VCC = 5 V
IPWM-Source
TSTBY
V
0.8
V
50
kHz
5
µA
Active mode, VCC = 5 V
100
µA
PWM = 0
500
µs
FG AND FGS
IFG-Sink
VFGS-Th
FG pin sink current
FG set threshold voltage
VFG = 0.3 V
5
mA
FG pin output, full FG signal, VCC ≥ 4.5 V
FG pin output, one-half FG signal, VCC ≥ 4.5 V
0.8
2.3
V
V
LOCK PROTECTION
TLOCK-On
Lock detect time
TLOCK-Off
Lock release time
FG = 0
2
3
4
s
2.5
5
7.5
s
680
800
920
mA
CURRENT LIMIT
Current limit
CS pin to GND resistor = 3.9 kΩ
THERMAL SHUTDOWN
TSHDN
Shutdown temperature
threshold
Copyright © 2012, Texas Instruments Incorporated
Hysteresis
+160
°C
10
°C
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DRV10866
SBVS206 – NOVEMBER 2012
www.ti.com
DETAILED DEVICE DESCRIPTION
DRV10866 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current
capability up to 680-mA peak. DRV10866 is specifically designed for low noise, low external component count
fan motor drive applications. DRV10866 has built in over current protection with no external current sense
resistor needed. The synchronous rectification mode of operation achieves increased efficiency for motor driver
applications. DRV10866 can output either FG or ½ FG to indicate motor speed with open drain output through
FGS pin selection. A 150° sensorless BEMF control scheme is implemented for a three phase motor. Voltage
surge protection scheme prevents input VCC capacitor from over charge during motor acceleration and
deceleration modes. DRV10866 has multiple built-in protection blocks including UVLO, over current protection,
lock protection and thermal shut down protection.
Speed Control
DRV10866 can control motor speed through either the PWMIN or VCC pin. Motor speed will increase with higher
PWMIN duty cycle or VCC input voltage. The curve of motor speed (RPM) vs PWMIN duty cycle or VCC input
voltage is close to linear in most cases. However, motor characteristics will affect the linearity of this speed
curve. DRV10866 can operate at very low VCC input voltage down to 1.65 V. The PWMIN pin is pulled up to VCC
internally and frequency range can vary from 15 kHz to 50 kHz. The motor driver MOSFETs will operate at
constant switching frequency 156 kHz. With this high switching frequency, DRV10866 can eliminate audible
noise and reduce the ripple of VCC input voltage and current, and thus minimize EMI noise.
Frequency Generator
The FG pin outputs a 50% duty cycle of PWM waveform in the normal operation condition. The frequency of the
FG signal represents the motor speed and phase information. The FG pin is an open drain output, so an external
pull up resistor is needed when connected to an external system. During the startup, FG output will stay at high
impedance until the motor speed reaches a certain level and BEMF is detected. During lock protection condition,
FG output will remain high until the motor restarts and startup process is completed. DRV10866 can output either
FG or ½ FG to indicate motor status with open drain output through FGS pin selection. When FGS is pulled to
VCC, the frequency of FG output is half of that when FGS is pulled to GND. Motor speed can be calculated based
on the FG frequency when FGS is pulled to GND, which equals to:
(FG ? 60)
RPM =
pole pairs
(1)
Where FG is in hertz (Hz).
Lock Protection
If the motor is blocked or stopped by an external force, the lock protection is triggered after lock detection time.
During lock detection time, the circuit monitors the PWM and FG signals. If PWM has an input signal while the
FG output is in high impedance during this period, the lock protection will be enabled and DRV10866 will stop
driving the motor. After lock release time, DRV10866 will resume driving the motor again. If the lock condition still
exists, DRV10866 will proceed with the next lock protection cycle until the lock condition is removed. With this
lock protection, the motor and device will not get over heated or be damaged.
6
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DRV10866
www.ti.com
SBVS206 – NOVEMBER 2012
Voltage Surge Protection
The DRV10866 has a unique feature to clamp the VCC voltage during lock protection and standby mode. If the
lock mode condition is caused by an external force that suddenly stops the motor at a high speed, or the device
goes into standby mode from a high duty cycle, either situation releases the energy in the motor winding into the
input capacitor. When a small input capacitor and anti-reverse diode are used in the system design, the input
voltage of the IC could rise above the absolute voltage rate of the chip. This condition either destroys the device
or reduces the reliability of the device. For this reason, the DRV10866 has a voltage clamp circuit that clamps the
input voltage at 5.95 V, and has a hysteresis of 150 mV. This clamp circuit is only active during the lock
protection cycle or when the device enters standby mode. It is disabled during normal operation.
Overcurrent Protection
The DRV10866 can adjust the overcurrent point through an external resistor connected to the CS pin (pin 9) and
ground. Without this external current sense resistor, the DRV10866 senses the current through the power
MOSFET. Therefore, there is no power loss during the current sensing. The current sense architecture improves
the overall system efficiency. Shorting the CS pin to ground disables the overcurrent protection feature. During
overcurrent protection, the DRV10866 only limits the current to the motor; it does not shut down the device. The
overcurrent limit can be set by the value of current sensing resistor through Equation 2.
3120
I (A) =
RCS (W)
(2)
UVLO (Undervoltage Lockout)
The DRV10866 has a built in UVLO function block. The hysteresis of UVLO threshold is 150 mV. The device will
be locked out when VCC reaches 1.65 V and woke up at 1.8 V.
Thermal Shutdown
The DRV10866 has a built in thermal shunt down function, which will shut down the device when the junction
temperature is over 160°C and will resume operating when the junction temperature drops back to 150°C.
Copyright © 2012, Texas Instruments Incorporated
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DRV10866
SBVS206 – NOVEMBER 2012
www.ti.com
APPLICATION INFORMATION
The DRV10866 only requires three external components. A 2.2-µF or higher ceramic capacitor connected to VCC
and ground is needed for decoupling purposes. This capacitor must be placed close to the VCC pin (pin 3) and
GND pin (pin 5). During normal operation, a sudden drop in motor speed (caused by changing the PWM duty
from high to low immediately) causes the VCC voltage to rise to a very high level, especially when an anti-reverse
diode is added on the VCC side. In order to avoid this condition, a larger input capacitor between VCC and GND is
needed, along with removing the anti-reverse diode. The DRV10866 is simple to design with a single-layer
printed circuit board (PCB) layout. During layout, the strategy of ground copper pour is very important to enhance
the thermal performance. Refer to Figure 1 for an example of PCB layout.
Figure 1. Single-Layer PCB Layout
8
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Copyright © 2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
DRV10866DSCR
ACTIVE
Package Type Package Pins Package Qty
Drawing
SON
DSC
10
3000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
CU NIPDAU
Level-2-260C-1 YEAR
(4)
-40 to 85
10866
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DRV10866DSCR
Package Package Pins
Type Drawing
SON
DSC
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
3.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV10866DSCR
SON
DSC
10
3000
367.0
367.0
35.0
Pack Materials-Page 2
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