LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION Flip Chip construction EMI/RFI low-pass filter with integrated ESD protection 50 Ω line termination resistors ensure signal integrity Low TVS operating voltage (5V) Low leakage current 0.5mm Pitch Chip Scale Package designed for direct assembly on FR4 PCB using conventional assembly techniques The absence of leadframe and bondwires minimizes inductance and optimizes the high frequency filter performance. LX7207 exceeds the requirements of IEC61000-4-2 (15KV air discharge and 8KV contact discharge). IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com BENEFITS Filter response characterized up to 6 GHz 3.5dB insertion loss in the pass band >30dB attenuation in the 800-1000 MHz range >20dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz WWW . Microsemi .C OM LX7207 has 10 lines of integrated low pass filters with ESD protection that filter out EMI as well as protecting the equipment from ESD surge voltages. The device is a 5x5 array flip chip and measures 2.5 x 2.5 x 0.65 mm. APPLICATIONS LCD displays Wireless handsets PDA’s Portable Information Terminals Notebook Computers Point of Sale Terminals Fingerprint Sensors PRODUCT HIGHLIGHT 50 IN OUT E F9 F10 GND F10 F9 D F7 F8 GND F8 F7 C F5 F6 GND F6 F5 B F3 F4 GND F4 F3 A F1 F2 GND F2 F1 1 2 3 4 5 CTOT = 40pF Circuit Diagram For Each of 10 EMI Filters Pinout of CSP EMI Filter With ESD Protection F1 is Filter #1 etc. Bottom View (Bumps up) LX7207 PACKAGE ORDER INFO TJ (°C) -40 to 125 SP 0.5mm Pitch Chip Scale Package (CSP) LX7207ISP Marking Quantity per Reel LX7207 Date Code 3000 Reel Diameter 7 in. (177.8mm) Note: Available only in Tape & Reel Append the letters “TR” to the part number (i.e. LX7207ISP-TR) Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 1 LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS CSP- TOP VIEW WWW . Microsemi .C OM Steady State Power ....................................................................................100mW ESD Air Discharge per IEC61000-4-2 .......................................................±16KV ESD Contact Discharge per IEC61000-4-2 ................................................±11KV Reflow Temperature (10 Seconds) .............................................................. 240°C Operating Temperature .................................................................. -40° to +125°C Storage Temperature Range........................................................... -55° to +150°C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. FUNCTIONAL PIN DESCRIPTION Name Description A1, B1, C1, D1, E1 Filter Inputs 1, 3, 5, 7, 9 A2, B2, C2, D2, E2 Filter Inputs 2, 4, 6, 8, 10 A3, B3, C3, D3, E3 Ground A4, B4, C4, D4, E4 Filter Outputs 2, 4, 6, 8, 10 A5, B5, C5, D5, E5 Filter Outputs 1, 3, 5, 7, 9 ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA where otherwise noted. Parameter Symbol Stand-Off Voltage Breakdown Voltage Leakage Current Series Resistance VRWM VBR IR RS Temperature Co-Efficient of RS Total Capacitance Attenuation in the Pass Band Cut-off Frequency Tcoeff C α fc Test Conditions Min ≤ +125°C except LX7207 Typ Max 5.25 IR = 1mA VRWM = 3.0V, T = 25°C Each Line Each Line Each Line, 0V, 1MHz 50 Ω Environment, DC Bias = 0V, T = 25°C 50 Ω Environment, DC Bias = 0V, T = 25°C 6 45 32 50 200 40 3.5 155 0.25 55 48 Units V V µA Ω ppm pF dB MHz APPLICATION INFORMATION Copyright © 2003 Rev 1.2, 3/3/2005 then corrupt the operation of the sensitive TFT’s and affect the display operation and quality. Figure 6 shows a typical application of LX7207 is suppressing ESD and EMI in color LCD displays. Exact number of lines to be protected will depend on the controller and LCD specifications such as number of bits per pixel (bpp). Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 2 PACKAGE DATA Majority of Color LCD displays are made with Thin Film Transistors (TFT) and as such are very vulnerable to ESD damage. If an ESD stress hits the TFT display, it will produce a black pixel/line. ESD events can also create Electromagnetic Interference (EMI). EMI radiated from an ESD event can couple into a display through cables or I/O ports and become a voltage or current spike. This spike can LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET INPUT PULSE CLAMPING WWW . Microsemi .C OM Figure 1 – 8KV ESD Input Pulse as per IEC61000-4-2. Vertical Scale is equivalnet to 5A/div Figure 2 – Clamping Characteristics when device subjected to an 8 KV ESD pulse. CAPACITANCE VS. BIAS 42 Total Capacitance (pF) 40 38 36 34 32 1 2 3 4 DC Bias Voltage (V) 5 6 CHARTS 0 Figure 3 – Total Capacitance vs. Reverse Bias Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 3 LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET WWW . Microsemi .C OM FREQUENCY RESPOSNE 0 dB -5 dB -10 dB -15 dB -20 dB -25 dB -30 dB -35 dB -40 dB -45 dB 3 MHz 100 MHz 1 GHz 6 GHz Figure 4 – Typical Insertion Loss Curve. Spikes at high frequencies are caused by PCB layout. ANALOG CROSSTALK CHARTS Figure 5 – Typical analog crosstalk Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 4 LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET APPLICATION CIRCUITS WWW . Microsemi .C OM LX7207 LCD Controller/ TFT Driver IC LCD LX7207 Back Light Figure 6 – System Block Diagram of LCD Controller and Display RECOMMENDED PCB PARAMETERS Parameter Value Cu pad size 0.275 +0.0/-0.025 mm Pad Pitch 0.5mm Pad Definition Non-Solder Mask Defined Solder Mask Opening 0.375 ± 0.025 mm 0.25 x 0.25 mm square, 0.125 mm thick, laser cut, electro-polished OSP (Organic Surface Preservative) Solder Stencil Pad Protective Finish APPLICATIONS Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 5 LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET RECOMMENDED PCB PARAMETERS- CONTINUED WWW . Microsemi .C OM Non-Solder Mask Defined Cu Pad (OSP finish) 0.275 mm dia. Solder Mask Opening 0.325 mm dia. Figure 7 – Recommended Non-Solder Mask Defined Pad Temperature (°C) 240°C max 183°C 150°C ~ 1min Flux Activation Zone Solder Reflow Zone ~2 min APPLICATIONS Preheat Zone Cooling Zone ~ 1min Time (s) Figure 8 – Solder Reflow Profile. Max Temp is 240ºC and max time above liquidous (183ºC) is 60 seconds. Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 6 LX7207 Integrated EMI Filter & ESD Protection For Color LCD Displays ® TM P RODUCTION D ATA S HEET PACKAGE DIMENSIONS WWW . Microsemi .C OM SP 0.5mm Chip Scale Package 2.5 0.25 mm dia. 63/37 Sn/Pb Eutectic Solder Bumps 0.37mm Min 0.47mm Max 0.5 Orientation Mark E 0.5 1 A D B C 2.5 C 2 3 4 5 MSC LX7207 Date Code D B E Part Marking A 1 2 3 4 5 0.55mm Min 0.65mm Max MSC LX7207 Date Code MSC LX7207 Date Code MSC LX7207 Date Code ` Part Orientation in Tape 2.00 mm ± 0.05 4.00 mm ± 0.10 3.50 mm ± 0.05 8.00 mm + 0.30 -0.10 MECHANICALS 4.00 mm ± 0.10 0.51 mm 0.254 mm ± 0.02 32° MAX 2.67 mm ±0.05 1.14 mm ± 0.05 Tape Dimensions Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 7 LX7207 TM Integrated EMI Filter & ESD Protection For Color LCD Displays ® P RODUCTION D ATA S HEET NOTES WWW . Microsemi .C OM NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2003 Rev 1.2, 3/3/2005 Microsemi 11861 Western Avenue, Garden Grove, CA. 92841 (714) 898-8121, Fax: (714) 893-2570 page 8